Murata Manufacturing Co., Ltd.

Genji Inuidani

Michio Kadota

Eiichi Takata

Yasuji Yamamoto

A method for manufacturing an electronic component includes the steps of forming an electrode layer including &#x3b1;-tungsten on a substrate at a substrate temperature of about 100&#xb0; C. to about 300&#xb0; C. by a sputtering process, processing the electrode layer so as to have a desired shape, and heat-treating the electrode layer. An electronic component includes a substrate and an electrode layer that is disposed on the substrate directly or indirectly, includes &#x3b1;-tungsten, and has a specific resistance of about 15 &#x3bc;&#x3a9;.cm or less and a warpage of about 120 &#x3bc;m or less. A surface acoustic wave filter includes a piezoelectric substrate and an electrode layer, disposed on the piezoelectric substrate, including &#x3b1;-tungsten.

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Kameoka, Japan

Genji Inuidani