Kansai Paint Company, Ltd.

Mitsui Chemicals, Inc.

Other

Shizuoka University

Genji Imai

Hideo Kogure

Naozumi Iwasawa

Takeya Hasegawa

Tsuguo Yamaoka

Daisuke Kojima

Osamu Isozaki

Keiichi Ikeda

Yoshihiro Yamamoto

Takeshi Sako

Jun Akui

Toshiro Takao

Ritsuko Fukuda

Kenichi Sugimoto

Keisuke Takuma

Tsutami Misawa

Akira Ogiso

Takeshi Tsuda

Taizo Nishimoto

Hisashi Tsukahara

Toshikazu Murayama

Katsuhiro Ito

Naonori Miyata

Takahiro Higuchi

Yukari Takeda

Haruhumi Hagino

Kengo Ohnishi

Izumi Okajima

Hiroyuki Honma

Chiaki Iwashima

A process for producing a polymer, characterized in that a polymer having juts is produced by carrying out photopolymerization of at least one photopolymerizable polymerization precursor containing a photocurable compound having two or more unsaturated bonds by irradiation with active energy ray, optionally in the presence of at least one additive component for adding a polymer function, in a supercritical fluid or subcritical fluid; and a polymer having juts of 10 nm or more height, which height is 0.1-fold or more of the diameter of the juts, produced by the above process.

Polymer and process for producing polymer

A near infrared ray activation type positive resist composition comprising

Near infrared ray activation type positive resin composition

Disclosed is an optical waveguide-forming curable resin composition and optical waveguide-forming curable dry film which are capable of forming cured resin articles that have high heat resistance, excellent mechanical strength and high transparency, and possess properties required for forming optical waveguides, such as low thermal expansion, low transmission loss, etc. The present invention provides a curable resin composition for forming an optical waveguide, the composition comprising a hydrolyzable silyl-containing silane-modified epoxy resin (A) having an average of at least one hydrolyzable silyl group and an average of at least one epoxy group per molecule; and a resin (B) having, per molecule, an average of at least one functional group that is reactive with an epoxy group; and an optical waveguide-forming curable dry film formed using the resin composition.

Curable resin composition for light guide formation, curable dry film for light guide formation, cured resin and light guide

There is provided a process for purification treatment of wastewater containing an organic substance. There is provided a process for purification treatment of wastewater containing an organic substance by carrying out supercritical treatment or subcritical treatment, which comprises subjecting the wastewater to at least one solid-liquid separation pretreatment selected from separation treatment with a flocculant, sedimentation treatment, flotation treatment and filtration treatment; and then subjecting the wastewater to primary treatment as biological treatment; and subsequently purifying the wastewater by treatment including secondary treatment as supercritical treatment or subcritical treatment.

Process for purification treatment of wastewater containing organic substance

A polymerization reaction apparatus is used for producing a polymer by photo-polymerizing a polymerization precursor by irradiation with an active energy ray in a supercritical fluid or subcritical fluid. The apparatus includes a reaction vessel (), active energy ray irradiation means (), a fluid feeding means of feeding a fluid into the reaction vessel, and a fluid discharging means of discharging the fluid. The apparatus further includes [] polymerization precursor storage parts (') for accommodating a polymerization precursor and/or addition components to be contained in the polymer and feeding the polymerization precursor and/or addition components to a reaction field, or [] a polymerization precursor feeding means capable of feeding a polymerization precursor and/or addition components into the reaction vessel.

Polymerization reaction apparatus, and method of producing polymer using this apparatus

A method of fabricating an optical waveguide which comprises forming a core layer (c) on surface of a peelable substrate (a), then forming a clad layer (d) on the surface of the core layer (c) and the surface of the substrate (a), and then peeling the substrate (a) off from the core layer (c) and the clad layer (d) to fabricate an optical waveguide of which the top face (e) or the bottom face of the core layer (c) is not covered by the clad layer (d).

Method of fabricating optical waveguide

A method of producing a polymer according to the present invention is characterized by comprising a step of photopolymerizing one or more photopolymerizable polymerization precursors by irradiation with an activation energy ray in a supercritical fluid or in a subcritical fluid.

Method of producing polymer

A composition for activation energy rays comprising a specific vinyl ether group-containing compound (A) in which a vinyl ether group is bonded to a secondary or tertiary carbon atom, a polymer (B) having a carboxyl group and/or a hydroxyphenyl group, and a photo-acid generator compound (C) can form a resist pattern having an excellent sensitivity without carrying out any heat treatment at a temperature of 60&#xb0; C. or more after irradiation.

Composition for activation energy rays and method of forming pattern

A pattern can be precisely formed by irradiating, with an active energy beam, a positive sensitive resin composition according to this invention comprising a base polymer, an ether-bond-containing olefinic unsaturated compound and an acid-generating agent, where the base polymer is a copolymer comprising the structural units represented by formulas (1) to (3): where Rand Rare each independently hydrogen or methyl and Ris C-Cstraight or branched unsubstituted alkyl or C-Cstraight or branched substituted alkyl, wherein a, b and c are 0.05 to 0.7, 0.15 to 0.8 and 0.01 to 0.5, respectively and a+b+c=1.

Positive sensitive resin composition and a process for forming a resist pattern therewith

The present invention provides a negative photosensitive resin composition comprising (A) a photocurable resin having a photosensitive group or groups crosslinkable by light irradiation, (B) a photoacid generator and (C) a photosensitizer which is a benzopyran condensed ring compound capable of increasing photosensitivity to visible light with a wavelength of 480 nm or more,

Negative photosensitive resin composition, negative photosensitive dry film and method of forming pattern

A method of forming a resist pattern film. A positive type actinic ray decomposing and developing dry film is applied onto a surface of a coating substrate so that the surface of the coating substrate may face to the urethane resin layer of the dry film. Then, the dry film may be heat treated. The non-actinic ray-curable substrate of the dry film, then, is optionally stripped, and is heat treated if it has not already been heat treated. Then, an actinic ray is irradiated through a mask or directly onto the surface of the dry film so as to obtain an intended pattern and is optionally heat treated. The non-actinic ray-curable substrate which was not previously stripped is, then, stripped. Then, the positive type actinic ray-curable urethane resin layer is subjected to a developing treatment. Finally, an unnecessary area of the urethane resin layer to form a resist pattern film is removed.

Positive type actinic ray-curable dry film and pattern-forming method by use of the same

The present invention provides a positive photosensitive resin composition comprising (A) a positive photosensitive resin, (B) a photoacid generator and (C) a photosensitizer which is a benzopyran condensed ring compound capable of increasing photosensitivity to visible light with a wavelength of 480 nm or more; a positive photosensitive dry film prepared by applying the photosensitive resin composition to a surface of support film, followed by drying, to form a photosensitive resin layer; and a method of forming a pattern using the resin composition or the dry film.

Positive photosensitive resin composition, positive photosensitive dry film and method of forming pattern

A liquid or a solid positive type photosensitive resin composition is herein disclosed which is used under the irradiation circumstance of a safelight having a maximum wavelength within the range of 500 to 620 nm, wherein an absorbancy of an unexposed film formed from this composition is 0.5 or less within the range of the maximum wavelength &plusmn;30 nm selected from the range of the maximum wavelength of the safelight; and a method for forming a resist pattern is also disclosed which comprises (1) a step of applying a positive type photosensitive resin composition onto a substrate to form a photosensitive film thereon, (2) a step of exposing the photosensitive film so as to obtain a desired pattern, and (3) a step of performing a developing treatment to form a resist pattern, wherein at least one step of the steps (1) to (3) is carried out under the irradiation circumstance of the safelight having a high spectral luminous efficiency in which the maximum wavelength of an emission spectrum of a light source is within the range of 500 to 620 nm.

Positive type photosensitive resin composition and method for forming resist pattern

A positive type actinic ray-curable (dry film having, on the surface of a non-actinic ray-curable substrate, a solid positive type actinic ray-curable urethane resin layer formed from (1) a resin composition containing, as essential components, (A ) an ether linkage-containing olefinicaly unsaturated compound, (B ), an acid group-containing urethane resin having a weight average molecular weight of 1,000 to 200,000 and an acid group content in the range of 0.5 to 10 equivalents per one kg of the resin, and (C) a photo-acid generator; (2) a resin composition containing, as essential components, (A ) an ether linkage-containing, polyurethane based, olefinicaly unsaturated Compound, (B ) at least one resin selected from the group consisting of (a) a carboxyl group and hydroxyphenyl group-containing polymer, (b) a carboxyl group-containing polymer and (c) a hydroxyphenyl group-containing polymer, and (C) a photo-acid generator; or (3) a resin composition containing, as essential components, (A ) an ether linkage-containing, polyurethane based, olefinicaly unsaturated compound, (B ) an acid group-containing urethane resin having a weight average molecular weight of 1,000 to 200,000 and an acid group content in the range of 0.5 to 10 equivalents per one kg of the resin, and (C) a photo-acid generator; and a method of forming a pattern by use of the dry film.

Growing community of inventors

Kanagawa, Japan

Genji Imai