Tdk Corporation

Genichi Watanabe

Masayuki Yoshida

Shunji Aoki

Junichi Sutoh

Hisayuki Abe

Yoshikazu Ito

Takashi Sakurai

Satoshi Kurimoto

Hiroshi Shindo

Ko Onodera

Shinya Yoshihara

Junichi Suto

Akihiro Horita

Masahiko Konno

There are provided a ceramic electronic component and a method for producing the ceramic electronic component, where a ground electrode layer can be directly coated with lead-free solder without lowering reliabilities. Terminal electrodeis provided with a ground electrode layerof Cu having been formed by firing, a solder layerformed of a lead-free solder based on five elements of Sn&#x2014;Ag&#x2014;Cu&#x2014;Ni&#x2014;Ge, and a diffusion layerhaving been formed by the diffusion of Ni between the ground electrode layerand the solder layer. Because the diffusion layerof Ni is formed between the ground electrode layerand the solder layer, the diffusion layer, which functions as a barrier layer, suppresses the solder leach of Cu from the ground electrode layer. The diffusion layerof Ni can also suppress the growth of fragile intermetallic compounds of Sn&#x2014;Cu. Therefore, a decrease in the bonding strength between the ground electrode layerand the solder layercan be prevented.

Ceramic electronic component and method for producing same

The present invention relates to a laminated type electronic part and aims at providing a sheet manufacturing method and a sheet that contribute to high integration, downsizing and enhancement of reliability of the electronic part. To accomplish this object, the manufacturing method according to the present invention involves forming a layer composed of a positive resist on a support body, repeatedly executing an exposure process, a developing process and a depositing process of depositing a substance having a desired electrical characteristic into an obtained pattern space with respect to the layer, and thereafter removing the support body. The sheet composed of portions, having three or more types of different physical properties, of which an aspect ratio in pattern is equal to or larger than 1, is provided by this manufacturing method.

Method of forming sheet having foreign material portions used for forming multi-layer wiring board and sheet having foreign portions

An object of the invention is to provide a flat ceramic sheet including an internal electrode used for manufacturing a multilayer ceramic electronic part. Specifically, an electrode portion is formed on a surface of a transparent base member, and a photosensitive slurry containing dielectric powder is applied thereon. The photosensitive slurry is exposed from the backside of the base member up to a predetermined thickness, and then it is subjected to development. After that, the base member is removed. Thus, a ceramic green sheet is obtained.

Method of producing ceramic green sheet and method of producing electronic component using this ceramic green sheet

The invention relates to a so-called ceramic green sheet used for manufacturing multilayer ceramic electronic parts. The invention is intended to improve accuracy in shape of an electrode or other element formed on the sheet, accuracy in its position and uniformity in its thickness. In a process according to the invention, a layer made of a photosensitive material including a powder having a desired electric characteristic is formed on a light transmissive base member. A mask having a desired pattern is disposed on the back side of the base member and the photosensitive material is exposed from the back side of the base member through the mask. Then the photosensitive layer after the exposure is subjected to development.

Method for manufacturing ceramic green sheet and method for manufacturing electronic part using that ceramic green sheet

The invention relates to a so-called ceramic green sheet used for manufacturing multilayer ceramic electronic parts. The invention is directed to formation of an insulating layer or a like layer having a complex shape with concavities and convexities while maintaining accuracy in its shape, accuracy in its formation position and uniformity in its thickness. In a process according to the invention, a layer made of a photosensitive material including a powder having a desired electric characteristic is formed on a light transmissive base member. Light such as ultraviolet light having a first pattern is radiated to the photosensitive material from the back side of the base member and light such as ultraviolet light having a second pattern is radiated to the photosensitive material from the back side of the base member so that the photosensitive material is exposed. Then the photosensitive layer after the exposure is subjected to development.

The present invention provides a method for manufacturing an electronic part that can cope with downsizing, improvement in performance and quality of a multilayer electronic part. A ceramic green sheet is produced by forming on a substrate or on a layer formed on a substrate an internal electrode having a predetermined thickness by a discretional process, forming a photosensitive ceramic slurry on a surface of the substrate or the layer and the internal electrode in such a way that its thickness just before exposure will be substantially equal to or smaller than the thickness of the internal electrode from the surface of the substrate or the layer, irradiating the photosensitive ceramic slurry with light from the upper side of the substrate to perform exposure while masking the internal electrode pattern, to selectively harden the surface of the photosensitive ceramic slurry, the exposure amount being controlled in such a way that the surface of the photosensitive ceramic slurry is hardened, and removing the portion of the photosensitive ceramic slurry that has not been exposed by a development process to expose a surface of the internal electrode pattern.

Growing community of inventors

Tokyo, Japan

Genichi Watanabe