Foxconn Technology Co., Ltd.

Fu Zhun Precision Industry (shen Zhen) Co., Ltd.

Gen-Ping Deng

Chun-Chi Chen

Zhi-Sheng Lian

Yi-Qiang Wu

Hui Shen

Xu Li

Feng Hu

Wei Deng

Liang-Hui Zhao

Feng Jin

A heat dissipation apparatus includes fins each including a body and blades extending radially outwardly from the body. The blades define cutouts therebetween. The fins are stacked together in such a manner that the cutouts of the fins cooperatively form airflow guiding channels each extending spirally from top to bottom.

Heat dissipation apparatus

A heat dissipation device for removing heat from an electronic device and electronic components, includes a base plate in contact with the electronic device, a first fin set and a second fin set mounted on the base plate. The first fin set includes a plurality of first fins perpendicularly arranged on the base plate. The second fin set includes a plurality of second fins attached to a lateral side of the first fin set and perpendicular to both the first fins and the base plate. A fan is mounted on tops of the first fin set and the second fin set to cover both of them. Air generated by the fan flows through the first and second fin sets to cool the electronic components mounted on orthogonally neighboring sides of the heat dissipation device.

Heat dissipation device for at least two electronic devices with two sets of fins

A heat dissipation device includes a heat sink, a fan having a flange and a plurality of brackets mounting the fan on the heat sink. Each of the brackets includes two pair of spaced buckles extending from a top thereof toward the fan. A bottom of each bracket is fixed on a bottom of the heat sink. The two pair of buckles of the bracket are buckled on the flange of the fan.

Heat dissipation device having support brackets with buckles to support the fan

A method for manufacturing a cover of an electronic device includes steps of offering a metallic green piece comprising a top plate, a bottom plate and a connecting plate interconnecting a side of the top and bottom plates; offering a profile molding insert and a lower mold, the profile molding insert forming a shaping surface, the lower mold defining a cavity to receive an end of the green piece; putting the profile molding insert in the green piece, the shaping surface of the profiling molding insert being oriented towards the end of the green piece; inserting the end of the green piece in the cavity of the lower mold and punching the lower mold to enable the top and bottom plates at the end of the green piece bent along the shaping surface of the profile molding insert toward each other.

Method for manufacturing cover of electronic device and cover obtained thereby

A heat dissipation device removing heat from a memory module includes two conducting plate clipping the memory module and an elastic member. Each conducting plate includes a lower part and an upper part. The two lower parts of the two conducting plates abut against two opposite sides of the memory module, respectively. The two upper parts of the two conducting plates are pivotably connected together and located above the memory module. The elastic member is located between the two upper parts and urges the two lower parts towards the memory module. The upper part of each conducting plate is slantwise at an obtuse angle to the lower part to make the two upper parts of the two conducting plates splay upwardly.

Heat dissipation device for memory module

A heat dissipation device removing heat from a heat generating electronic device on a printed circuit board includes a base, a plurality of fins attached to the base and a clip for mounting the base and the fins onto the heat generating electronic device. Each of the fins defines a closed through hole therein. The holes of the fins cooperatively define a channel. The clip includes a locking beam extending through the channel of the fins and two fasteners engaging the locking beam mounting the base and the fins onto the heat generating electronic device.

Heat dissipation device having a clip

A heat dissipation device configured for dissipating heat of a memory module includes two fin assemblies pivotally assembled together through a pivot, two heat spreaders adapted for being arranged at two opposite side surfaces of the memory module, and two heat pipes. Each of the two heat pipes includes an evaporation section and a condensation section formed at two opposite ends thereof. The condensation sections of the heat pipes are respectively attached to the fin assemblies, and the evaporation sections of the heat pipes are respectively and thermally attached to the heat spreaders, whereby the heat of the memory module is transferred by the heat pipes from the heat spreaders to the fin assemblies for dissipation.

A heat dissipation device for dissipating heat generated by a heat-generating component mounted on a printed circuit board, includes a heat absorbing board with a bottom thereof attached to the heat-generating component, two heat sinks, two heat pipes respectively connecting the heat absorbing board and the two heat sinks, two centrifugal fans and two clips. Each of the centrifugal fans is located at a lateral side of a corresponding heat sink. Each of the clips includes an engaging portion riveting with the heat absorbing board and two locking portions extending from two ends of the engaging portion and locked onto the printed circuit board to thereby secure the heat absorbing board on the heat-generating component.

Heat dissipation device

A heat dissipation device includes a heat sink having a base with thermal interface material thereon and a protective cap covering the base. The protective cap includes a body shielding the thermal interface material and sidewalls extending from the body and engaging with a periphery of the base of the heat sink. A rotatable portion is rotatable relative to the body of the protective cap. The rotatable portion includes a base-wall being rotatably connected with the body of the protective cap and a plurality of positioning sides extending from the base-wall and engaging lateral sides of a corner of the base of the heat sink.

Heat dissipation device having cap for protecting thermal interface material thereon

A portable projector with a heat dissipation system, includes a housing and two LED light sources located in the housing. Each of the LED light sources includes a circuit aboard, an LED device mounted on the circuit aboard and a heat pipe. The heat pipe has an evaporating section thermally contacting the circuit board, and a condensing section. A fin set thermally contacts with the condensing section of the heat pipe for dissipating heat therefrom. The fin set of one LED light source is located behind the evaporating section of the heat pipe of the other light source and closely adjacent to a wall of the housing.

Portable projector using an LED and related heat dissipation system

A fastener for fastening a heat sink to a printed circuit board via a back plate comprises a head and a shaft extending from the head. The shaft comprises a first and second engaging portions and a connecting portion therebetween. The first and second engaging portions have outer threads on exteriors thereof. Two cutouts are defined in the connecting portion. The back plate defines four thread holes machined with inner threads for engaging with the outer threads. In use of the fastener, an elastic force is produced to the fastener due to a deformation of the two cutouts during the threading. The elastic force helps the outer threads to have a secure engagement with the inner threads whereby the fastener can firmly engage with the back plate even when the fastener is subject to vibration or shock.

Fastener

A blind () for a projector includes a bracket () mounted to the projector, and a folded fin () fixed on the bracket and covering a hot air vent of the projector. The folded fin includes a plurality of parallel fins () and a plurality of upper and lower tabs () interconnecting the fins. Each of the fins defines an angle of 135 degrees with a plane defined by the lower tabs. Furthermore, a projection of each of the fins on the plane defined by the lower tabs overlaps a part of a corresponding adjacent fin. Thus, the blind can prevent a light leakage from the projector, while allow a heated airflow to be expelled out of the projector simultaneously.

Blind for a projector

A heat dissipation device for dissipating heat from heat-generating components on a printed circuit board includes a cover for covering the printed circuit board and a radiator mounted on the cover. The cover defines a plurality of holes corresponding to the heat-generating components on the printed circuit board. The radiator includes a plurality of contacting portions extending through the holes of the cover for contacting the heat-generating components, respectively. The cover and the radiator are made of different materials by different manufacturing techniques, i.e. aluminum die-casting and aluminum extrusion.

Heat dissipation device having metal die-casting component and metal-extrusion component

A heat sink () for removing heat from heat-generating devices includes a plurality of fins () interconnected together by a fastener () extending therethrough. Each fin comprises a main body () and a flange () bent from an edge of the body. The main body has a thickness and defines a through hole () therein. The fastener comprises a plurality of alternating bars () and positioned portions (). Each positioned portion has a same thickness as the main body and is accommodated in the through hole. Each bar is sandwiched between two adjacent main bodies, for fixing the fins in position and preventing the fin from sliding along a length direction of the fastener. The bar has a width larger than a diameter of the through hole.

Heat sink with combined fins

A heat dissipating device () for cooling a number of electronic devices. The heat dissipating device includes a heat sink (), a fan () mounted to a side of the heat sink and a fan duct (). The heat sink includes a heat spreader (), a cover () and fins () disposed between the heat spreader and the cover. The fan duct includes a mounting plate (), a faceplate () extending downwardly from and perpendicular to the mounting plate, and baffle walls () extending downwardly from the mounting plate. The mounting plate defines locating holes () for permitting screws () to pass through the locating holes and to engage with threaded holes () defined in the cover. An airflow generated by the fan flows through the fins and an outlet () defined between the baffle walls and the heat sink.

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Shenzhen, China

Gen-Ping Deng