Hitachi, Ltd.

Hitachi Cable, Inc.

Texas Instruments Corporation

Renesas Technology Corp.

Hitachi Vlsi Engineering Corp.

Stanley Electric Co., Ltd

Hitachi Microcomputer System, Ltd.

Other

Hitachi Tobu Semiconductor

Dia Nippon Printing Co., Ltd.

Hitachi Cable Precision Co., Ltd.

Hitachi Microcomputer Systems Ltd.

Gen Murakami

Kunihiko Nishi

Asao Nishimura

Makoto Kitano

Akihiro Yaguchi

Kunihiro Tsubosaki

Aizo Kaneda

Shozo Nakamura

Masahiro Ichitani

Sueo Kawai

Hiroshi Kikuchi

Takashi Yokoyama

Akio Hasebe

Hiroshi Hozoji

Takashi Yamazaki

Kazuyoshi Oshima

Junichi Saeki

Isamu Yoshida

Hiroyoshi Kokaku

Noriyuki Kinjo

Masatsugu Ogata

Masanori Segawa

Syuuji Eguchi

Ichiro Anjoh

Ichiro Anjo

Tetsuro Matsumoto

Wahei Kitamura

Tetsurou Matsumoto

Toshiyuki Sakuta

Hideki Kosaka

Keizo Otsuki

Hidetoshi Mochizuki

Masamichi Ishihara

Satoshi Oguchi

Masachika Masuda

Hiromichi Suzuki

Mamoru Mita

Kazuyuki Miyazawa

Ryuji Kohno

Masao Mitani

Michael A Lamson

Katherine G Heinen

Nae Yoneda

Toyohiko Kumakura

Kazunari Suzuki

Ryosuke Kimoto

Junichi Arita

Akihiko Iwaya

Michio Tanimoto

Takayuki Okinaga

Takashi Emata

Osamu Horiuchi

Toshihiro Yasuhara

Taisei Jin

Shunji Koike

Kanji Otsuka

Ichio Shimizu

Hiroshi Satoh

Yasunori Yamaguchi

Akira Suzuki

Yasuhiro Kasama

Hajime Hasebe

Eiji Miyamoto

Kazuya Ito

Tetsu Udagawa

Norio Okabe

Dai Aoki

Tomoaki Abe

Tetsuya Saito

Yuuji Shirai

Toshiaki Morikawa

Katsuji Komatsu

Shoji Shinzawa

Youichi Matsuno

Atsusi Nozoe

Atsushi Otaka

Tomo Yasuda

Hajime Sato

Hideo Miura

Hideki Tanaka

Takahiro Naito

Satoru Ito

Masahiko Kobayashi

Yoshio Adachi

Takaharu Yonemoto

Tatsuya Ohtaka

Akio Hoshi

Osamu Yoshioka

Naozumi Hatada

Sumio Okada

Toshikatsu Hiroe

Yasuo Mori

Maya Obata

Kazunori Katoh

Takeshi Gappa

Masanori Sakimoto

Hiroyuki Isobe

Tooru Nagamine

Eiji Ohi

Kazuhisa Hatano

A light emitting device has a cup portion with a bottom surface opening, and one electrode of a light emitting element is connected to the cup portion. The other electrode of the light emitting element is connected to a lead set up from an inner space to outside the cup portion using the opening of the cup portion. Each electrode and lead of the light emitting device can be electrically connected without bonding wires. This prevents shadows or light unevenness from reflecting the shape of the bonding wire, thereby enhancing light-emission efficiency. As an alternative to setting up the lead from inside to the outside of the cup portion, the lead existing outside the cup portion and the other electrode are electrically connected via the bonding wire through the cup portion's opening. Thus, light outputted outside of the light emitting device is not intercepted by the bonding wire.

Light emitting device having a mirror portion

A surface mount type light-emitting unit includes a light-emitting device. A first lead is connected electrically to a first electrode of the light-emitting device. A second lead is connected electrically to a second electrodc of the light-emitting device. A clear insulator seals the light-emitting device, a section connecting the first electrode to the first lead and a section connecting the second electrode to the second lead. An end of the first lead, forming a reflecting section, is molded into a cup-shaped portion having a flat bottom. The light-emitting device is bonded to the flat bottom. A surface of the reflecting section opposed to the flat bottom is exposed to a surface of thc insulator.

Light-emitting unit and method for producing same as well as lead frame used for producing light-emitting unit

A surface mount type light-emitting unit composed of a light-emitting device, a first lead connected electrically with a first electrode of the light-emitting device, a second lead connected electrically with a second electrode of the light-emitting device, and a clear insulator for sealing the light-emitting device, a connecting section of the first electrode of the light-emitting device and the first lead, and a connecting section of the second electrode of the light-emitting device and the second lead wherein connecting terminal sections of the first and second leads for connecting them with external devices, respectively, are placed on a surface of the insulator, comprises an end of the first lead being molded into a cup-shaped portion having a flat bottom; the light-emitting device being bonded to the bottom inside a reflecting section corresponding to the molded cup-shaped portion of the first lead; and a surface opposed to that of the reflecting section on which the light-emitting device has been bonded being exposed to the surface of the insulator.

In surface packaging of thin resin packages such as resin molded memory ICs or the like, cracks of the package occur frequently at a solder reflow step where thermal impact is applied to the package because the resin has absorbed moisture before packaging. To solve this problem, the devices are packaged moisture-tight at an assembly step of the resin molded devices where the resin is still dry, and are taken out from the bags immediately before the execution of surface packaging.

Surface package type semiconductor package and method of producing semiconductor memory

As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the 'Lead-On-Chip' or 'Chip-On-Lead' structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

Semiconductor device

A wiring board includes a predetermined wiring section disposed on an insulation board, and an electromagnetic shielding film is placed at a position close to the wiring section. A semiconductor device includes an electromagnetic shielding film disposed on a surface, on which an integrated circuit of a semiconductor chip has been formed, through an insulative film, a lead is provided on the electromagnetic shielding film through an insulative film, the lead is electrically connected to an external terminal of the semiconductor chip, and the resulting structured material is sealed with a sealing material; and a circuit board for electronic parts composed of a circuit board prepared by forming a plurality of leads on an insulating material, and a conductor disposed on the plurality of leads through an insulating material and reducing a self inductance of the plurality of leads by flowing an eddy current through the conductor.

Wiring board, semiconductor device, electronic device, and circuit board for electronic parts

As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the &ldquo;Lead-On-Chip&rdquo; or &ldquo;Chip-On-Lead&rdquo; structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

In surface packaging of thin resin packages such as surface mount resin molded memory ICs or the like, cracks of the package occur frequently at a solder reflow step where thermal impact is applied to the package because the resin has absorbed moisture before packaging. To solve this problem, the devices are sealed, by heat-sealing, in a bag moisture-tight at an assembly step of the resin molded devices where the resin is still dry, and are taken out from the bags immediately before the execution of surface packaging. The devices are packaged in a moisture-proofing bag made of a laminate film, and a desiccant is sealed, by heat-sealing the bag, in the moisture-proofing bag together with the, e.g., surface mount semiconductor device having a plastic package encapsulating the semiconductor device. A caution is provided for the bag, that the devices should be presented from moisture absorption after opening the bag.

A semiconductor device, comprising: a semiconductor chip having on its main plane a plurality of external electrodes each having a joining portion; an insulating substrate having a predetermined pattern of leads thereon and having no device hole for said semiconductor chip, each of said leads being provided with an inner lead having a joining portion which is joined through solder to a corresponding one of the joining portions of said external electrodes of said semiconductor chip to provide a joined portion; and a molding resin for sealing said joined portion including the solder, wherein the joining portion of the external electrode comprises a metal selected from the group consisting of gold and tin, the joining portion of the inner lead comprises a metal selected from the group consisting of gold and tin, provided that, when the metal constituting the joining portion of the external electrode is gold, the metal constituting the joining portion of the inner lead is tin, or vice versa, and the solder comprise gold/tin solder. This constitution contributes to an improved in reliability with respect to temperature cycling in lead-patterning substrates, semiconductor devices, and electronics devices.

Semiconductor device, lead-patterning substrate, and electronics device, and method for fabricating same

Method for bonding a semiconductor chip to a lead-patterning substrate using a gold/tin alloy

In surface packaging of thin resin packages such as surface mount resin molded memory ICs or the like, cracks of the package occur frequently at a solder reflow step where thermal impact is applied to the package because the resin has absorbed moisture before packaging. To solve this problem, the devices are sealed, by heat-sealing, in a bag moisture-tight at an assembly step of the resin molded devices where the resin is still dry, and are taken out from the bags immediately before the execution of surface packaging. The devices are packaged in a moisture-proofing bag made of a laminate film, and a desiccant is sealed, by heat-sealing the bag, in the moisture-proofing bag together with the, e.g., surface mount semiconductor device having a plastic package encapsulating the semiconductor device.

Growing community of inventors

Machida, Japan

Gen Murakami