Zeon Corporation

Gen Kobayashi

Toyokazu Ito

Hiromi Kitagawa

Masaya Miyamura

Yasuyuki Murakami

Daisuke Uchiumi

Disclosed are a heat conductive sheet including a resin and a particulate carbon material, and having a thermal resistance value under a pressure of 0.05 MPa of 0.20&#xb0; C./W or less, a heat dissipation device including the heat conductive sheet interposed between a heat source and a heat radiator, and a method of producing a heat conductive sheet.

Heat conductive sheet and method of producing same, and heat dissipation device

Disclosed are a heat conductive sheet including a resin and a particulate carbon material, and having an Asker C hardness at 25&#xb0; C. of 60 or more and a thermal resistance value under a pressure of 0.5 MPa of 0.20&#xb0; C./W or less, a method of producing a heat conductive sheet, and a heat dissipation device including the heat conductive sheet interposed between a heat source and a heat radiator.

A thermally conductive sheet includes a resin that is liquid under normal temperature and pressure, a resin that is solid under normal temperature and pressure, and a particulate carbon material, and the thermal resistance of the thermally conductive sheet under a pressure of 0.05 MPa is at most 0.30&#xb0; C/W. In the thermally conductive sheet, the resin that is solid under normal temperature and pressure is preferably a thermoplastic fluororesin that is solid under normal temperature and pressure, and the resin that is liquid under normal temperature and pressure is preferably a thermoplastic fluororesin that is liquid under normal temperature and pressure.

Growing community of inventors

Tokyo, Japan

Gen Kobayashi