Avago Technologies General IP (singapore) Pte. Ltd.

Avago Technologies Ecbu IP (singapore) Pte. Ltd.

Avago Technologies International Sales Pte. Limited

Gek Yong Ng

Fun Kok Chow

Julie Elizabeth Fouquet

Qian Tao

Richard Baumgartner

Kwee Chong Chang

Richard Kok Keong Lum

Gary Richard Trott

James Costello

Kah Weng Lee

Peng Siang Seet

Siong Lee Loh

Boon Keat Tan

Cherng Woei Heng

Kok Keong Richard Lum

Richard Lum

Jia Peng

A sensor, optical system, and combination lens for use with an optical sensor are disclosed. An illustrative optical system is described to include a photodetector having a proximity sensor area and an ambient light sensor area that is physically separated from the proximity sensor area as well as a combination lens that includes a proximity sensor focusing portion and an ambient light sensor focusing portion that each separately direct incident light for the proximity sensor area and the ambient light sensor area, respectively.

Combination lens including an ambient light sensor portion and a proximity sensor portion for proximity sensing and ambient light sensing

An isolation system and isolation device are disclosed. An illustrative isolation device is disclosed to include a transmitter side and receiver side separated by an isolation material. One or more components of the transmitter side operate on a clock signal whereas one or more components of the receiver side operate on a scrambled clock signal. The scrambled clock signal is generated to have a different energy distribution than the clock signal and is also generated to have a dominant peak value that is lower than the dominant peak value of the clock signal.

Isolator with narrow-range clock scrambling unit

An optical sensor and optical system are disclosed. The optical sensor is disclosed to include a light source, a photodetector having a proximity sensing portion and an ambient light sensing portion, and a controller configured to implement a proximity sensing phase where the proximity sensing portion of the photodetector is utilized to obtain an incident light reading when the light source is ON and then implement an ambient light sensing phase where the ambient light sensing portion of the photodetector is utilized to obtain an incident light reading when the light source is OFF.

Matrix arrangement of photodetector for use as a proximity sensor and ambient light sensor

Various embodiments of systems for transmitting and receiving a plurality of signals across an isolation material are disclosed. In one embodiment, a first signal may be modulated into a first modulated signal. The first modulated signal is then modulated into a second modulated signal in accordance to a second signal using amplitude modulation. In another embodiment, a first signal and a second signal are modulated into a modulated signal before being modulated further using amplitude modulation. The detection of the modulated signal may be performed using a frequency detector and an amplitude detection circuit that are arranged in parallel. At least some of the apparatuses, circuits, systems and methods disclosed herein may be implemented using conventional CMOS design and manufacturing techniques to provide, for example, at least one or more integrated circuits.

Transmitting and receiving digital and analog signals across an isolator using amplitude modulation

A sigma-delta converter, analog-to-digital conversion system, and an Integrated Circuit (IC) chip are disclosed that include a main sigma-delta modulator and an auxiliary sigma-delta modulator. The auxiliary sigma-delta modulator is electrically matched with the main sigma-delta modulator and is configured to generate an output that is incorporated into a feedback loop of the main sigma-delta modulator to enable the main sigma-delta modulator to adjust an offset signal applied at a main analog channel.

Dynamic offset cancellation in sigma-delta converter

Disclosed herein are various embodiments of coil transducers and galvanic isolators configured to provide high voltage isolation and high voltage breakdown performance characteristics in small packages. A coil transducer is provided across which data or power signals may be transmitted and received by primary and secondary coils disposed on opposing sides thereof without high voltage breakdowns occurring therebetween. At least portions of the coil transducer are formed of an electrically insulating, non-metallic, non-semiconductor, low dielectric loss material. Circuits are disclosed herein that permit high speed data signals to be transmitted through the coil transducer and faithfully and accurately reconstructed on the opposing side thereof. The coil transducer may be formed in a small package using, by way of example, printed circuit board, CMOS and other fabrication and packaging processes.

Galvanic isolators and coil transducers

Various embodiments of systems for transmitting and receiving digital and/or analog signals across a single isolator, solid state lighting systems, or DC/DC converter feedback regulation control systems are disclosed. In one embodiment, a first signal may be modulated into a first modulated signal. The first modulated signal is then modulated into a second modulated signal in accordance to a second signal. The second modulated signal is in turn, modulated into a third modulated signal in accordance to a third signal. At least some of the apparatuses, circuits, systems and methods disclosed herein may be implemented using conventional CMOS design and manufacturing techniques and processes to provide, for example, at least one or more integrated circuits.

Transmitting and receiving digital and analog signals across an isolator

Various embodiments of systems for transmitting and receiving digital and Various embodiments of systems for transmitting and receiving digital and/or analog signals across a single isolator, solid state lighting systems, or DC/DC converter feedback regulation control systems are disclosed. In one embodiment, the digital and analog signals may be modulated into a frequency modulated signal, and each pulse of the frequency modulated signal may be further encoded into a major pulse and a minor pulse. At least some of the circuits, systems and methods disclosed herein may be implemented using conventional CMOS design and manufacturing techniques and processes to provide, for example, a single integrated circuit or ASIC.

Various embodiments of an optical proximity sensor and corresponding circuits and methods for measuring small AC signal currents arising from the detection of pulsed AC light signals emitted by a light emitter and reflected from an object to detected in the presence of larger ambient light DC current signals are disclosed. Circuits and corresponding methods are described that improve the dynamic range, sensitivity and detection range of an optical proximity sensor by cancelling the contributions of DC current signals arising from ambient light signals that otherwise would dominate the detected small AC signal currents. The DC signal cancellation occurs in a differential amplifier circuit before small AC signal currents are provided to an analog-to-digital converter. The circuits and methods may be implemented using conventional CMOS design and manufacturing techniques and processes.

Optical proximity sensor with improved dynamic range and sensitivity

According to one embodiment, there is provided a method of reducing the amount of power consumed by a galvanic isolator. A transmitter transmits a wake-up signal to a receiver located across an isolation medium when the transmitter is ready or preparing to transmit data or power signals to a receiver, which is operably connected to a sensing circuit. The sensing circuit receives the wake-up signal through the isolation medium, which may be operably connected to and powered substantially continuously or intermittently by a first power source. In response to the sensing circuit receiving the wake-up signal, the receiver is powered up from a sleep mode to an operating mode. After a period of time thas passed since the wake-up signal was transmitted, a signature pattern is transmitted from the transmitter to the sensing circuit through the isolation medium. Next, the sensing circuit or the receiver verifies the validity of the signature pattern. If the signature pattern is determined at to be valid, the receiver is enabled to receive the data or power signals from the transmitter. The transmitter then transmits the data or power signals from the transmitter through the isolation medium to the receiver.

Wake-up circuits, devices and methods for galvanic isolators

Various embodiments of systems for transmitting and receiving digital and analog signals across a single isolator, solid state lighting systems, and DC/DC converter feedback regulation control systems are disclosed. At least some of the circuits, systems and methods disclosed herein may be implemented using conventional CMOS design and manufacturing techniques and processes to provide, for example, a single integrated circuit or ASIC.

Galvanic isolators are disclosed herein. An embodiment of a galvanic isolator comprises a generally planar electrically insulating substrate comprising opposing first and second surfaces, the substrate comprising an electrically insulating, low dielectric loss material and having a transmitter coil disposed on the first surface and a receiving coil disposed on the second surface. A transmitter circuit is operably connected to the transmitter coil. The transmitter circuit comprises a first detector that detects a rising edge of an input signal; a first pulse generator that generates a plurality of first pulses upon detection of the rising edge; a second detector that detects a falling edge of the input signal; and a second pulse generator that generates a plurality of second pulses upon detection of the falling edge. A receiver circuit is operably connected to the second receiving coil. The receiver circuit generates a signal that is substantially similar to the input signal based on the first pulses and the second pulses.

Galvanic isolator

According to one embodiment, there is provided a high voltage isolation dual capacitor communication system comprising communication drive and sense electrodes and corresponding first and second capacitors that are formed in two separate devices. The two devices are electrically connected in series to provide a single galvanically-isolated communication system that exhibits high breakdown voltage performance in combination with good signal coupling. The system effects communications between drive and receive circuits through the first and second capacitors, and in a preferred embodiment is capable of effecting relatively high-speed digital communications. The system may be formed in a small package using, by way of example, CMOS or other semiconductor fabrication and packaging processes.

High voltage isolation dual capacitor communication system

According to one embodiment, there is provided a high voltage drive circuit comprising drive and sense electrodes formed substantially in a single plane. The device effects signal transfer between drive and receive circuits through the drive and sense electrodes by capacitive means, and permits high voltage devices, such as IGBTs, to be driven thereby without the use of high voltage transistors, thereby eliminating the need to use expensive fabrication processes such as SOI when manufacturing high voltage gate drive circuits and ICs. The device may be formed in a small package using, by way of example, using CMOS or other conventional low-cost semiconductor fabrication and packaging processes.

Growing community of inventors

Singapore, Singapore

Gek Yong Ng