Applied Materials, Inc.

Brooks Automation Gmbh

Gee Sun Hoey

Jayakumar Gurusamy

Terry Bluck

Hoang Huy Vu

Jimin Ryu

Fred Conrad Redeker

Brian J Brown

Boris Fishkin

Jagan Rangarajan

Lawrence M Rosenberg

Raijiro Koga

Takashi Kumagai

Hiromi Tsuruta

Ekaterina A Mikhaylichenko

Jim Kellogg Atkinson

Edwin Velazquez

Balasubramaniam Coimbatore Jaganathan

Bruce Lu

Manoohcer Birang

Jaimie Stomberg

Roland Shu

K Y Wang

Rex Lu

An apparatus for transferring a substrate is disclosed herein. More specifically, the apparatus relates to substrate handling systems used in semiconductor device manufacturing, and more particularly, to substrate handling systems having a substrate handler with enclosed moving elements and increased compatibility with post-CMP cleaning modules. The apparatus includes one or more indexing assemblies. Each of the indexing assemblies including an enclosure, an actuator assembly disposed within the enclosure, and two handling blades disposed outside of the disclosure. Each of the two blades are moveable in either of a translational or a rotating manner.

Substrate handling systems

A spray manifold for a brush box is disclosed which includes an elongated body having a plurality of holes formed in a line along a direction parallel to a longitudinal axis of the body, a linear slot formed along a length of the body aligning with the line of the holes, a central bore formed along the length of the body and between each of the holes and the slot, and a cover disposed on the slot.

Spray bar design for uniform liquid flow distribution on a substrate

There is described apparatus and methods for transporting and processing substrates including wafers as to efficiently produce at reasonable costs improved throughput as compared to systems in use today. A linear transport chamber includes linear tracks and robot arms riding on the linear tracks to linearly transfer substrates along the sides of processing chambers for feeding substrates into a controlled atmosphere through a load lock and then along a transport chamber as a way of reaching processing chambers. A four-axis robot arm is disclosed, capable of linear translation, rotation and articulation, and z-motion.

Linear vacuum robot with Z motion and articulated arm

Linear vacuum robot with z motion and articulated arm

A substrate gripper apparatus is provided. Substrate gripper apparatus includes a body, a first slide member moveable relative to the body, a first finger mounting member coupled to the first slide member, a first lower finger coupled to the first finger mounting member, and a first pivoting finger coupled to the first finger mounting member. First pivoting member may impose a force on a substrate due to gravity. Methods of operating the substrate gripper apparatus as well as other aspects are provided.

Substrate gripper apparatus and methods

Generally, a method and apparatus for supporting a web of polishing material. In one embodiment, the apparatus includes a platen adapted to support the web, a frame assembly, and one or more flexures coupled between the platen and the frame assembly. The flexure allows the frame assembly to be moved in relation to the platen. When the frame assembly is in an extended position relative to the platen, the web is placed in a spaced-apart relation to the platen.

Platen with peripheral frame for supporting a web of polishing material in a chemical mechanical planarization system

Generally, a method and apparatus for retaining a web of polishing material is provided. In one embodiment, an apparatus for retaining a web of polishing material includes a platen that has a first clamp and a second clamp disposed on opposite sides of the platen. A top surface of the platen is adapted to support the web of polishing material in an orientation having the web's edges disposed approximate the first and second sides of the platen. The first and second clamps are actuated to laterally tension the web therebetween.

Platen with lateral web tensioner

Method and apparatus for providing and controlling delivery of a web of polishing material

A chemical mechanical polishing apparatus has a rotatable platen, a feed roller located in a cavity in the platen, a take-up roller, and a generally linear polishing sheet releasably secured to the platen to rotate with the platen. The polishing sheet has an exposed portion extending over a top surface of the platen for polishing the substrate, an unused portion wound around the feed roller, and a used portion wound around the take-up roller. A gas source direct a purge gas into the cavity containing the feed roller.

Using a purge gas in a chemical mechanical polishing apparatus with an incrementally advanceable polishing sheet

A chemical mechanical polishing apparatus includes a pad conditioner having a conditioner head, a cleaning cup for receiving and cleaning the conditioner head of the pad conditioner, and a fluid dispenser for dispensing a cleaning fluid onto the conditioner head.

Pad conditioner cleaning apparatus

A pad cleaning brush and method for making the same is used in conjunction with spray rinse water to thoroughly clean a polishing pad of a chemical-mechanical polishing apparatus after a wafer has been polished. The bristles of the brush are securely retained within the brush by a welding process. This prevents the bristles from remaining on the polishing pad after the cleaning operation, thereby preventing the remaining bristles from damaging a subsequently polished wafer.

Pad cleaning brush for chemical mechanical polishing apparatus and method of making the same

A cleaning cup for holding and cleaning a pad conditioner having a conditioner head, the cleaning cup includes a spray nozzle for spraying a cleaning solution on a top side of the conditioner head. The cleaning cup further includes a plurality of support pins extending upwards from a base of the cleaning cup to receive the conditioner head thereon.

A conditioner head to condition the polishing surface of a polishing pad includes a disk having an abrasive surface to contact a polishing pad. A disk holder carries the disk and holds it in contact with the polishing pad. The disk holder has a generally flat mounting surface. A drive element rotates the disk about an axis.

Growing community of inventors

San Jose, CA, United States of America

Gee Sun Hoey