Corning Incorporated

Gaylord L Francis

Robert Michael Morena

Ronald E Johnson

Paul A Tick

Dana Craig Bookbinder

Joel P Carberry

Brent M Wedding

Lung-Ming Wu

Francis W Martin

Scott Glaeseman

Steven Demartino

Donald M Trotter, Jr

Lauren Kay Cornelius

Kathleen Ann Wexell

Robert John Paisley

Rodney D Bagley

Andrew Herczog

Gerald B Carrier

An optical device, and a method of producing the device, are disclosed. The device comprises a substrate and an optical waveguide component affixed to the substrate with a glass frit fusion seal formed and locked within a recessed void in the substrate, the glass frit fusion seal being the fused product of a low melting glass frit. The recessed void in the substrate includes a region for receiving the optical waveguide component and an intersecting region that secures the placement of the glass frit fusion seal. The optical waveguide component is affixed to the substrate in order to control temperature varying optical properties of the component.

Optical device and fusion seal

An optical device, and a method of producing the device, are disclosed. The device comprises a substrate and an optical waveguide component affixed to the z, substrate with a glass frit fusion seal formed and locked within a recessed void in the substrate, the glass frit fusion seal being the fused product of a low melting glass frit. The recessed void in the substrate includes a region for receiving the optical waveguide component and an intersecting region that secures the placement of the glass frit fusion seal. The optical waveguide component is affixed to the substrate in order to control temperature varying optical properties of the component.

An optical device, and a method of producing the device, are disclosed. The device comprises a substrate having a near-zero, or negative, coefficient of thermal expansion and an optical component affixed to the substrate with a fusion seal, the seal being the fused product of a low melting glass flit having a positive CTE and a mill addition of a glass-ceramic having an effective negative CTE.

Polymeric compositions having a polymeric component and an inorganic filler which undergoes a crystal (phase) inversion within the operating temperature range of the composition are provided. The present invention relates to a method for reducing the water sensitivity of particles of a crystallized phosphate glass. The particles are composed of P.sub.2 O.sub.5 and one or more cations selected from the group consisting of magnesium, cobalt, arsenic, zinc, iron, aluminum, and zirconium. The method includes nitriding the particles.

Method of reducing water sensitivity of phosphate glass particles

The present invention relates to a method for packaging an optical waveguide coupler where the coupler includes a body having two end portions and a constricted portion located between the end portions. The method includes placing the coupler in a mold where the mold surrounds at least the constricted portion of the coupler, introducing a polymeric composition into the mold so that the polymeric composition substantially fills the constricted portion, curing the polymeric composition, and removing the mold.

Waveguide coupler

This invention relates to a resistive heating device. In particular, it relates to an exhaust gas apparatus useful for achieving early light-off of catalytic converters comprising a cellular substrate having a layer of conductive material formed thereon and means for activating the device by passing electric current or by exposing the device to an electromagnetic energy field.

Heated cellular substrates

Lead-free, tin phosphate glasses contain 25-50 mole percent P.sub.2 O.sub.5, 30-70% SnO, 0-15% ZnO, the mole ratio of SnO:ZnO being greater than 5:1, and an effective amount up to 25% total of at least one oxide in the indicated proportion selected from the group consisting of up to 25% R.sub.2 O, wherein R.sub.2 O consists of 0-25% Li.sub.2 O, 0-25% Na.sub.2 O, and 0-25% K.sub.2 O, up to 20% B.sub.2 O.sub.3, up to 5% Al.sub.2 O.sub.3, up to 5% SiO.sub.2, and up to 5% WO.sub.3. The glasses are particularly useful as sealing glass frits in sealing material to join component parts in electrical and electronic devices. The sealing glass material may contain mill additions to reduce the effective coefficient of thermal expansion in a seal, as well as a strength reinforcing additive having a coefficient of thermal expansion preferably below 120.times.10.sup.-7 /.degree.C.

Non-lead sealing glasses

A composite article comprising a silicon body and a glass body bonded directly thereto by electrostatic bonding. The glass composition consists essentially of oxides of silicon, aluminum, and lithium, and the glass has a coefficient of thermal expansion approximating that of silicon, etches at a rate of at least 100 mg/cm.sup.2 in 20 minutes in 48% HF, and may be electrostatically bonded to silicon at a voltage not over 1,000 volts/mm of glass thickness at a temperature not over 440.degree. C.

Composite article and method

A fusion sealing material containing a mill addition, a sealing tape cast from the material, and a method of producing the tape. The material is composed of a low temperature glass, a mill addition that lowers the effective coefficient of thermal expansion of the glass in a seal and an organic medium. The sealing tape is prepared by hot mixing the solids with a liquefied medium, such as a high melting alcohol, and casting the hot mix onto a cold sheet to immediately solidify the medium.

Sealing material and method

There is disclosed a sealing material based on a lead sealing glass having a mill addition of a crystalline material having the crystalline structure of magnesium pyrophosphate. The effective coefficient of thermal expansion in a seal is substantially reduced by the mill addition, thereby permitting use with low expansion materials.

Fusion sealing materials

Mill additions are disclosed which lower the CTE of, and are compatible with, tin-phosphorus oxyfluoride glasses. The sealing materials provide fusion-type seals having a CTE not over about 110.times.10.sup.-7 /.degree.C. and a sealing temperature not over about 350.degree. C. Also disclosed is a family of glass compositions in the tin-phosphorus oxyfluoride system that exhibit very low glass transition temperatures and coefficients of thermal expansion not over about 160.times.10-7/.degree.C. (25.degree.-150.degree. C.). In addition to the four basic elements, the glasses contain up to 11% Nb, and may additionally contain up to 10%, taken individually or in combination, of V, Fe and/or Mo to further decrease the Tg and CTE values.

Sealing materials and glasses

There is disclosed a sintered, alpha-cordierite solid solution glass-ceramic body in which the properties of coefficient of thermal expansion and modulus of rupture are stabilized and controlled by using a combination of two dopants in the glass during sintering and crystallization. There is further disclosed the method of producing such bodies, and controlling such properties, through the use of the two dopants.

Sintered glass-ceramic body and method

There is disclosed a hybrid circuit embodying a crossover formed on a low expansion substrate of aluminum nitride, mullite or a cordierite-type glass-ceramic. The crossover is a thick film dielectric composed of a glass-ceramic having a primary crystal phase of willemite and a secondary phase of cordierite.

Hybrid circuits and thick film dielectrics used therein

Metallizing pastes, for forming thick film circuitry on low expansion substrates in electronic devices, are disclosed. The paste contains a glass powder that crystallizes on firing to a glass-ceramic in which lead titanate is the primary crystal phase.

Growing community of inventors

Painted Post, NY, United States of America

Gaylord L Francis