Xytrans, Inc.

Lockheed Martin Corporation

Gavin Clark

Danny F Ammar

Eugene Fischer

John Hubert

Glenn Larson

David L Bass

Matt H Shafie

Ronald D Graham

David M Bills

Conrad Jordan

Stephen A Stahly

John F Hubert

A low cost and high performance millimeter wave (MMW) radio frequency transceiver module includes a substrate board and plurality of microwave monolithic integrated circuit (MMIC) chips supported by the substrate board and arranged in a receiver section, a local oscillator section and a transmitter section. A plurality of filters and radio frequency circuit interconnects are formed on the substrate board and operative with and/or connecting the receiver, local oscillator and transmitter sections. A plurality of electrical interconnects are operative with and connect the receiver, local oscillator and transmitter sections. A method of forming the millimeter wave radio frequency transceiver module is also disclosed.

Millimeter wave (MMW) radio frequency transceiver module and method of forming same

A lightweight millimeter wave outdoor unit includes a lightweight housing with a heat sink and mounting member configured for mounting on the antenna to form a wireless link. A millimeter wave transceiver board is formed of ceramic material and mounted within the housing. It includes a millimeter wave transceiver circuit that has microwave monolithic integrated circuit (MMIC) chips and operable with the transmit and receive boards. An intermediate frequency (IF) board has components forming an intermediate frequency circuit operable with the millimeter wave transceiver circuit. A frequency synthesizer board has a signal generating circuit for generating local oscillator signals to the transceiver circuit. A controller board has surface mounted DC and low frequency discrete devices thereon forming power and control circuits that supply respective power and control signals to other circuits on other boards. A quick connect/disconnect assembly is operative with the housing for allowing the housing to be rapidly connected and disconnected to the antenna circuit contact members interconnect circuits between boards.

Highly integrated microwave outdoor unit (ODU)

A millimeter wave pulsed radar system includes a radar synthesizer having a voltage controlled oscillator/phase locked loop (VCO/PLL) circuit, direct digital synthesizer (DDS) circuit and quadrature modulator circuit that are operative to generate an intermediate frequency local oscillator signal (IF/LO signal). A radar transceiver is operative with the radar synthesizer for receiving the IF/LO signal. A transmitter section has a frequency multiplier that multiplies the IF/LO signal up to a millimeter wave (MMW) radar signal and a receiver section and includes a direct conversion mixer that receives a MMW radar signal and the IF/LO signal to produce I/Q baseband signals that are later digitized and processed.

Millimeter wave pulsed radar system

A connector system and method for cooperating printed circuit boards includes a housing member having a clip receiving slot and circuit board engaging surface that is positioned against a first printed circuit board. At least one electrically conductive clip member has opposing ends and is received within the clip receiving slot. One end is readily secured by soldering to a circuit on the first printed circuit board and the other end is biased into connection with the circuit of a second printed circuit board such that high frequency radio frequency signals are transferred from one printed circuit board to the other printed circuit board via the clip member.

Solderless method for transferring high frequency, radio frequency signals between printed circuit boards

A subminiature coaxial connector (SMA) includes a shell, dielectric and conductor element that includes a biasing element that engages an interface contact tip and biases the interface contact tip into electrical contact against an electrical circuit, such as a trace on the circuit board without soldering, and adjusts for relative movements created by thermal mismatch.

Self-adjusted subminiature coaxial connector

A microwave monolithic integrated circuit (MMIC) assembly and related method are disclosed. A dielectric substrate has a surface on which radio frequency circuits and microstrip lines are formed. At least one MMIC chip opening is dimensioned for receiving therethrough a MMIC chip. A metallic carrier is mismatched as to coefficient of thermal expansion to the dielectric substrate and includes a component surface adhesively secured to the dielectric substrate on the surface opposing the radio frequency circuits and microstrip lines. At least one raised pedestal is on the component surface that is positioned at the MMIC chip opening. A MMIC chip is secured on the pedestal and extends through the MMIC chip opening for connection to the radio frequency circuits and microstrip lines. Stress relief portions are formed in the metallic carrier that segment the carrier into subcarriers and provide stress relief during expansion and contraction created by temperature changes.

Microwave monolithic integrated circuit (MMIC) carrier interface

A millimeter wave transceiver package is provided. Housings for electronic, RF, and support components of the transceiver with an RF transparent cover are stacked vertically in a multilayer structure. The channelized RF housing affects a reduction of 5:1 by minimizing the components placed on the housing. The design and position of the regulator/controller allows the use of surface mount parts and simplified DC and RF interfaces further contributing to design efficiency and reduced costs. Additionally, costs are reduced through the appropriate selection and application of materials. The generic housing for the millimeter wave module assembly accommodates frequencies from 20 to 40 GHz without design change, thus improving the modular character.

Low cost MMW transceiver packaging

A low cost millimeter wave (MMW) module for a microwave monolithic integrated circuit (MMIC) includes a carrier board formed of a dielectric material and having at least one MMIC die mounted thereon and at least one interface line, such as a 50 Ohm microstrip interface line. A base plate is formed of a material that has a higher unmatched coefficient of thermal expansion (CTE) than the carrier board and supports same. A housing is mounted over the carrier board and engages the base plate. The housing has at least one subminiature coaxial connector (SMA) interface mounted thereon. A flexible circuit interconnect, such as a fuzz button, connects the subminiature coaxial connector and MMIC die through the interface line. A thermal interface member is positioned between the carrier board and base plate to aid in heat transfer between the base plate and housing and the lower CTE carrier board.

Growing community of inventors

Tavares, FL, United States of America

Gavin Clark