Juniper Networks, Inc.

Gautam Ganguly

Alexander I Yatskov

Peng Su

Marc D Hartranft

Jimmy Chun-Chuen Leung

Elmer Tolentino

Richard W Singer

Valery Kugel

Aliaskar Hassanzadeh

Helen L Turner

Guhan Subbarayan

A disclosed apparatus may include (1) an integrated circuit electrically coupled to a substrate, (2) a plurality of electrical contacts that are disposed on the substrate and are electrically coupled to the integrated circuit via the substrate, (3) at least one cable assembly electrically coupled to the plurality of electrical contacts, and (4) a package stiffener physically coupled to the substrate around the integrated circuit such that the at least one cable assembly is accessible to at least one electrical cable. Various other apparatuses, systems, and methods are also disclosed.

Apparatus, system, and method for utilizing package stiffeners to attach cable assemblies to integrated circuits

The disclosed apparatus may include (1) a shoulder bolt that includes (A) a head and (B) a shank, (2) a retention barrel that envelops at least a portion of the shank of the shoulder bolt, (3) a coil spring that envelops at least a portion of the shank of the shoulder bolt and resides between the head of the shoulder bolt and a heatsink, and (4) a travel-limiting component (such as a set screw or a sleeve) that (A) is coupled to the retention barrel and (B) limits the heatsink from travelling linearly beyond a travel threshold via the coil spring. Various other apparatuses, systems, and methods are also disclosed.

Apparatus, system, and method for dynamic compensation of heatsink-clamping mechanisms

Techniques are described to limit heat transfer from a first electronic component to a second electronic such as by having an aperture in a lid over the second electronic component to form a gap in the conductance of heat from the first electronic component to the second electronic component. A semiconductor electronic package includes a substrate, a first electronic component that is of a first type and that is mounted along a surface of the substrate, a second electronic component that is of a second type different than the first type and that is mounted along the surface of the substrate, and a metallic component that is positioned over the first electronic component and that has an aperture through which the second electronic component is exposed.

Lid for semiconductor electronic package

The disclosed apparatus may include (1) at least one alignment pin that (A) is placed proximate to a component on a circuit board and (B) is secured proximate to the component on the circuit board and (2) at least one heatsink that (A) is placed atop the component after completion of a reflow process in which the component is soldered to the circuit board, (B) is aligned by the alignment pin such that the heatsink resides in a specific position atop the component, and (C) absorbs heat dissipated by the component when the component is operational. Various other apparatuses, systems, and methods are also disclosed.

Apparatus, system, and method for precise heatsink alignment on circuit boards

The disclosed apparatus may include (1) a base that (A) supports multiple heatsinks and (B) is coupled to a device that includes (i) a first component designed to operate at temperatures below a first threshold temperature and (ii) a second component designed to operate at temperatures below a second threshold temperature, the first threshold temperature being different than the second threshold temperature, (2) a first heatsink that (A) is secured to the base and (B) transfers heat away from the first component such that the first component operates at a temperature below the first threshold temperature, and (3) a second heatsink that is (A) secured to the base, (B) physically separated from the first heatsink by at least a certain amount of space, and (C) transfers heat away from the second component such that the second component operates at a temperature below the second threshold temperature.

Apparatus, system, and method for cooling devices containing multiple components

The disclosed apparatus may include (1) a stiffening brace that (A) is coupled to a top surface of a lidless integrated circuit and (B) includes at least one joint and (2) a removable lid that (A) interfaces with the stiffening brace at the joint, (B) temporarily sits atop the stiffening brace during a reflow process in which a bottom surface of the lidless integrated circuit is soldered to a circuit board, and (C) provides structural support to the lidless integrated circuit to impede the lidless integrated circuit from warping during the reflow process. Various other apparatuses, systems, and methods are also disclosed.

Growing community of inventors

San Jose, CA, United States of America

Gautam Ganguly