Interconnect Portfolio LLC

Beta Phase, Inc.

Silicon Pipe, Inc.

Samsung Electronics Co., Ltd.

Novias, Inc.

Pacific Measurements, Inc.

Gary Yasumura

Joseph Charles Fjelstad

Kevin P Grundy

Para Kanagasabai Segaram

William F Wiedemann

Michael D Perry

Matthew J Stepovich

John F Krumme

Russell G Larsen

Harold Byron Kent

Gerald J Selvin

Thomas J Obenhuber

Scott Franklin Wetenkamp

Robert D Genin

Mike Perry

Charles Byer

William F Wiedermann

Wayne McNinch

An electrical connector. An electrical connector a pair of cylindrical housings, one having a plurality of torsion bar conductors and a second having a plurality of ramps. Rotating the pair of housings relative to one another causes an angled tip on the torsion bar to rotate as it moves up the ramp. A land is provided to discontinue further rotation of the torsion bar tip as the housings continue to rotate.

Connector having a housing with a conductor with a ramp section and a curved surface section

An electrical connector. An electrical connector comprising a connector body having a first channel and a first conductive element extending through the first channel in a first tip section. The first tip section having a first moment arm that, when forced in contact with a first conductive surface, twists the first conductive element to produce a torsion force. The torsion force holds the first tip section in contact with the first conductive surface.

Electrical connector with conductors with a ramp to induce torsion

Disclosed are tapered dielectric and conductor structures which provide controlled impedance interconnection while signal conductor lines transition from finer pitches to coarser pitches thereby obviating electrical discontinuities generally associated with changes of circuit contact pitch. Also disclosed are methods for the construction of the devices and applications therefore.

Tapered dielectric and conductor structures and applications thereof

Torsionally-induced contact-force conductors for electrical connector systems

Disclosed are IC package structures comprised of standard IC packages modified with separate circuit interconnection structures and disposed to interconnect either directly to other IC packages or to intermediate pedestal connectors which serve to support and interconnect various circuit elements, thus effectively allowing critical signals to bypass the generally less capable interconnection paths within standard interconnection substrates.

IC package structures having separate circuit interconnection structures and assemblies constructed thereof

An electrical interconnection device for establishing redundant contacts between the ends of two conductive elements to be mated, creating a electrical interconnection without capacitive stubs.

Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity

An electrical connector comprised of a plurality of electrical contacts arranged in a stair-step configuration designed to mate with electrical components having electrical contacts arranged in a stair-step configuration. A direct connect signaling system comprised of stair-step electrical connectors mated to stair-step printed circuit boards, other stair-step electrical components, or combinations thereof.

High speed, direct path, stair-step, electronic connectors with improved signal integrity characteristics and methods for their manufacture

Structures employed by a plurality of packages, printed circuit boards, connectors and interposers to create signal paths which reduce the deleterious signal quality issues associated with the use of through-holes. Disclosed structures can coexist with through-hole implementations.

Interconnect system without through-holes

A signal-segregating connector for use in a system having a printed circuit board, a first electrical structure and a second electrical structure. The connector includes a first set of conductive elements to convey signals between the first electrical structure and the printed circuit board, and a second set of conductive elements to convey signals between the first electrical structure and the second electrical structure.

Signal-segregating connector system

Interconnection assemblies which adjust their alignment and performance through the use of control feedback from the data transferred through the assemblies.

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Santa Clara, CA, United States of America

Gary Yasumura