Applied Materials, Inc.

Gary U Keppers

Govinda Raj

Sudhir R Gondhalekar

Faruk Gungor

Vincent Kirchhoff

Ian Widlow

Felix Rabinovich

Francisco Rodarte

Aravind Dugganna Naik

Ravikumara Kodinaganhalli

A component, a method of manufacturing a component, and a method of cleaning a component is provided. The component includes a gas flow system within the component, wherein the gas flow system fluidly couples one or more inlet holes and one or more outlet holes. The manufacturing of the component results in an arc shaped groove and a circumferential groove created in the body of the ring. The component undergoes one or more cleaning operations, including rinsing, baking, or purging operations. The cleaning operations remove debris or particles in or on the component, where the debris or particles can be caused during manufacturing of the component, or during use of the component in a semiconductor processing system.

Component, method of manufacturing the component, and method of cleaning the component

Embodiments of an apparatus for gas delivery in a semiconductor processing system use a gas distribution plate that has a plurality of gas passageways where the passageways have surfaces with an average roughness of less than or equal to approximately 10 Ra. In some embodiments, the gas distribution plate has one or more internal fluid passageways that are capable of being fluidly coupled to one or more fluid sources to provide temperature control of the gas distribution plate. In some embodiments, the gas distribution plate has at least one internal cavity with at least one heatsink that may surround at least one of the plurality of gas passageways to provide, at least partial, temperature control of the gas distribution plate.

Apparatus and method for gas delivery in semiconductor process chambers

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Morgan Hill, CA, United States of America

Gary U Keppers