Apple Inc.

Dell Products Inc.

Gary S Thomason

Ron Alan Hopkinson

William Francis Leggett

Gavin J Reid

Joss Nathan Giddings

Jaime Tolentino

John Raff

Michael Jason Giles

Kevin Scott Fetterman

Camille Chen

Michelle Rae Goldberg

Laura M DeForest

Timothy S Hibbard

David A Hardell

Ruchi Goel

Huy Le

Brett W Degner

Dinesh C Mathew

Keith J Hendren

Matthew Phillip Casebolt

Patrick Kessler

John M Brock

Charles A Schwalbach

Christiaan A Ligtenberg

Bradley Joseph Hamel

Peteris K Augenbergs

Cina Hazegh

Brandon S Smith

Matthew C Waldon

Thomas R Tate

Tom Tate

James Utz

Koussalya Balasubramanian

Abhilash Rajagopal

Steven L Williams

Hao Shi

Hassan Lashkari

Joseph W Tannehill

Venus Kumar

Jorge C Marcet

Chase Berry

Jason W Leung

A portable computing device having a substantially non-conducting outer housing and alternative electrical grounding and audio system architectures is disclosed. The device can be a laptop computer having a main logic board, a keyboard assembly, an audio source positioned below the keyboard assembly, and an equalizer electrically coupled to the audio source, with each of these components being electrically coupled to a universal grounding structure. The audio source emits sound waves that are propagated through the keyboard assembly and between gaps between keyboard keys and the outer housing. Settings for the equalizer can be selected to account for sound absorption and amplification characteristics of the sound waves along these sound transmission paths. The universal grounding structure includes a plurality of separate ground components that are electrically intercoupled, each being substantially smaller than the overall portable computing device, and also includes an electromagnetic interference shield around the main logic board.

Portable computer electrical grounding and audio system architectures

A data network may include a data bus and network nodes. The data bus may be a differential data bus having first and second differential signal lines that convey differential signals between the nodes. A bimodal impedance terminator may be coupled to the first and second differential signal lines at one or both ends of the data bus. The bimodal impedance terminator may include a first resistor coupled between the first differential signal line and a circuit node and a second resistor coupled between the second differential signal line and the circuit node. A capacitor may be coupled between the circuit node and ground. A third resistor may be coupled between the circuit node and ground in series with the capacitor. The bimodal impedance terminator may terminate both the differential-mode impedance and the common-mode impedance of the data bus to reduce signal reflections at the ends of the data bus.

Bimodal impedance matching terminators

The present application describes various embodiments of systems and methods for providing internal components for portable computing devices having a thin profile. More particularly, the present application describes internal components configured to fit within a relatively thin outer enclosure.

Internal components of a portable computing device

Tools and fixtures for assembling a printed circuit board (PCB), such as a main logic board (MLB), in a portable computer device are described. A connector assembly having an electrically conductive gasket mounted on an edge of the MLB is described. In addition, a keyboard assembly including a notched portion of the MLB for accommodating more than one type of keyboard is described. In addition, a PCB assembly having a bracket to support a weak region of the PCB during assembly is described.

Printed circuit board features of a portable computer

Methods and apparatus for mitigating the effects of interference between multiple air interfaces located on an electronic device. In one embodiment, the air interfaces include a WLAN interface and PAN (e.g., Bluetooth) interface, and information such as Receiver Signal Strength Index (RSSI) as well as system noise level information are used in order to intelligently execute interference mitigation methodologies, including the selective application of modified frequency selection, variation of transmitter power, and/or change of operating mode (e.g., from multiple-in multiple-out (MIMO) to single-in, single-out (SISO)) so as to reduce isolation requirements between the interfaces. These methods and apparatus are particularly well suited to use cases where the WLAN interface is operating with high data transmission rates. Business methods associated with the foregoing technology are also described.

Methods and apparatus for enhanced coexistence algorithms in wireless systems

Electronic devices such as portable computers may contain circuits that generate radio-frequency noise. The radio-frequency noise may interfere with the operation of sensitive circuitry such as wireless communications circuitry. The circuits that generate the radio-frequency noise may include differential signal drivers that drive signals onto communications lines such as lines in a bus or output interface. A control circuit may power the drivers at an adjustable driver voltage bias level. The amount of noise that is generated by the drivers may vary as a function of the voltage bias level and may produce different amounts of noise at different wireless frequencies. Computer lid position and other factors may also influence the amount of interference that is generated. The control circuit may determine the current operating state of the device and may make voltage bias level adjustments that minimize interference between the drivers and the wireless circuitry.

Electronic device with dynamic drive strength adjustment to mitigate impact of system noise on wireless performance

Electrical communication between an information handling system chassis having a non-conductive surface and processing components within the chassis is established through the non-conductive surface with conductive elements extending from a conductive pad. A protruding element extending from a conductive pad engages the conductive elements through the non-conductive surface when the protruding element is coupled to a cavity formed in the chassis. Alternatively, the protruding element extends from the chassis to couple to a cavity in the conductive pad. Processing components have electrical communication with the chassis through the conductive pad.

System and method for electrical communication through a non-conductive information handling system chassis surface

Systems and methods for evaluating electromagnetic interference that may be employed, for among other things, to evaluate electronic system immunity to radiated electromagnetic fields and/or to identify particular electronic system areas that are susceptible to electromagnetic radiation.

Systems and methods for evaluating electromagnetic interference

A flexible printed circuit improves data transfer rates by disposing ground wires in a ground plane proximate to signal wires disposed in a signal channel plane. One or more ground wires is associated with each signal wire pair or each signal wire for imaging of the return currents of the signal pairs. An overlapping alignment minimizes loop area between a ground wire and its associated signal wire. An offset alignment provides a reduced loop area and reduced breakage risk since movement of the flexible-circuit does result in compression of the signal wire and its associated ground wire. A combination of overlapping and offset alignment balances signal transfer effectiveness with breakage risk by offsetting ground and signal wires is stress sensitive regions and overlapping ground and signal wires in stress tolerant regions. In one embodiment, the flexible circuit interfaces a portable computer with a display lid to support high-speed display signals with reduced breakage risk from cycling the display lid between an open and closed position.

Method for flexible circuits

Growing community of inventors

Georgetown, TX, United States of America

Gary S Thomason