Ncr Corporation

Hyundai Electronics America, Inc.

At&t Global Information Solutions Company

Symbios Logic Inc.

Lsi Logic Corporation

Gary R Thornberg

Lawrence C Barnes

George H Seaman

To provide high purity gases to manufacturing tools, a gas isolation box is employed which is formed of stainless steel and includes vertical slots for receiving gas stick carrier cards. Gas sticks include required valves, gauges, and regulators rigidly mounted on stainless steel carrier cards, leak tested and labeled. The carrier cards with the rigidly mounted, leak tested gas sticks are slid into the vertical slots of the gas isolation box. Only two connections are then required to complete to gas lines, reducing the potential for flexing of high purity gas lines during installation.

Standardized gas isolation box (GIB) installation

A process for coating a surface of a substrate with a polymer material. The process includes heating a polymer to a preselected temperature such that the polymer, if solid, is in a liquid state or if liquid in a less viscous state to form a polymer solution. The polymer solution may contain other components such as a carrier in addition to the polymer. The polymer solution is heated to a preselected temperature below the flashpoint temperature of the polymer solution. The polymer solution is held in reservoir and propelled through a nozzle to create a continuous flow of polymer solution in the form of a stationary wave. The polymer solution flowing out of the nozzle returns to the reservoir, wherein it again will be sent through the nozzle. A substrate having a lower surface is moved over the stationary wave at a preselected rate such that the lower surface of the substrate contacts the stationary wave. A uniform film of polymer is coated on the lower surface of the substrate after the substrate has been moved over and passed the stationary wave.

Method and apparatus for polymer coating of substrates

The present invention provides a multi-chip module having multiple compartments. Circuitry is arranged on a substrate in such a manner that circuit components requiring specific operating environments are located in discrete areas dedicated to accommodate the circuit components. A cover, having multiple chambers that align with the discrete areas on the substrate, is secured to the substrate to define the multiple compartments. The compartments are separated by material that effectively isolates the compartments relative to one another.

Multi-chip module with multiple compartments

A programmable multichip module (MCM) base substrate includes a first patterned signal layer comprising a plurality of electrical conductors formed in a first direction and a second patterned signal comprising a second plurality of electrical conductors formed perpendicular to the first group, thus forming a grid. The two signal layers are electrically insulated from each other as well as the substrate surfaces. A first plurality of vias provides openings from the surface of the base substrate to the first signal layer, and a second plurality of vias provide openings in the surface of the base substrate to the second signal layer. Substrate programming is accomplished utilizing via plate-up and surface metalization techniques to establish connections between conductors residing in the two signal layers and to define surface contact pads, and utilizing masking and etching procedures to cut open selected conductors at unmasked via sites.

Via programming for multichip modules

A multi-chip module board includes a multi-chip module substrate; a first multi-chip module designed and assembled into the substrate; and a space on the substrate configured to receive an additional add-on multi-chip module, memory module or component module and to operatively connect the add-on module to the first multi-chip module. The first multi-chip module contains integrated and discrete circuit elements necessary to provide basic functionality required by the board user. Space and connecting structure is provided on the module board for the connection of add-on modules which provide additional or peripheral functionality to the board. The connecting structures included on the module board and the add-on modules are designed to permit the attachment of any one of several different function add-on modules to a location on the module board.

Growing community of inventors

Colorado Springs, CO, United States of America

Gary R Thornberg