Motorola Corporation

Semiconductor Components Industries, LLC

Gary R Lorenzen

Prosanto K Mukerji

Keith W Bailey

Alexander James Elliott

Kent L Kime

Pablo Rodriguez

George C Chen

William L Fragale

Sury N Darbha

Timothy E Meko

A method of manufacturing semiconductor components ( ) includes assembling, packaging, and testing the semiconductor components ( ) while the semiconductor components ( ) are mounted on an adhesive layer ( ). The method of can also keep the semiconductor components ( ) mounted on the adhesive layer ( ) between each of the assembling, packaging, and testing steps.

Method of manufacturing semiconductor components

An electronic component includes a semiconductor substrate (101, 301, 401), an electrically conductive layer (102, 103, 302, 303, 402, 403) supported by the semiconductor substrate (101, 301, 401), and a lead (110, 120, 210, 310, 410, 420) having an electrical coupling portion (112, 122, 212, 312, 412, 422) coupled to and supported by the electrically conductive layer (102, 103, 302, 303, 402, 403) wherein the electrical coupling portion (112, 122, 212, 312, 412, 422) has at least one notch (115, 215, 315) adjacent to the electrically conductive layer (102, 103, 302, 303, 402, 403).

Electronic component and method of manufacture

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Phoenix, AZ, United States of America

Gary R Lorenzen