Motorola Corporation

Gary R Burhance

John C Barron

John K Arledge

Henry F Liebman

James A Zollo

Peter J Bartels

John Holley

A differential pair () is provided by routing a printed circuit board () having high density interconnect (HDI) substrate () with first and second metal layers () such that a first runner () forms a zigzag pattern using the two metal layers while a second runner () forms a second zigzag pattern on the same two metal layers. The first and second zigzag patterns overlap so as to provide orthogonal signal flow.

Method and apparatus for routing a differential pair on a printed circuit board

A substrate assembly () and method of making same has at least one embedded component () in a via () of a substrate core () and includes a first adhesive layer () coupled to the substrate core, and a second adhesive layer () on at least portions of a top surface of the substrate core and above portions of the embedded component. The substrate assembly can further include a first conductive layer () adhered to the bottom surface of the substrate core and a second conductive layer () on the second adhesive layer. The substrate assembly can further include an interconnection () between a conductive surface of the embedded component and at least one among the first conductive layer and the second conductive layer. The interconnection can be formed through an opening () that at least temporarily exposes at least a conductive surface () of the embedded component.

Circuit board with embedded components and method of manufacture

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Boynton Beach, FL, United States of America

Gary R Burhance