Magic Leap, Inc.

Gary Quartana, Jr

Guillermo Padin Rohena

Shigeru G Natsume

Haney Awad

William Wheeler

Bradley Fraser

Ralph Remsburg

Evan Francis Rynk

Carlos Julio Suate Pedroza

John Aguirre

Youlin Jin

Jose Felix Rodriguez

Adam Carl Wright

Matthew Thomas Hull

Humberto Eduardo Garcia

Paul Daniel Lindquist

William Chow

Various embodiments relate to a thermal management system for an electronic device, such as an augmented reality or virtual reality device. The thermal management system can comprise an active cooling mechanism in various embodiments to dynamically or actively cool components of the device, for example, by adjust fan speeds of a fan assembly. In some embodiments, a hardware shutdown mechanism can be provided to shut down the device if software-based thermal management devices are inoperable. In some embodiments, the air flow into and/or within the electronic device can be adjusted to cool various components of the device.

Thermal management system for electronic device

A fan assembly is disclosed. The fan assembly can include a first support frame. The fan assembly can comprise a shaft assembly having a first end coupled with the first support frame and a second end disposed away from the first end. A second support frame can be coupled with the first support frame and disposed at or over the second end of the shaft assembly. An impeller can have fan blades coupled with a hub, the hub being disposed over the shaft assembly for rotation between the first and second support frames about a longitudinal axis. Transverse loading on the shaft assembly can be controlled by the first and second support frames.

Power supply assembly with fan assembly for electronic device

Growing community of inventors

Parkland, FL, United States of America

Gary Quartana, Jr