Asm Technology Singapore Pte Ltd

Asm Assembly Automation Limited

Gary Peter Widdowson

Ajit S Gaunekar

Wai Chuen Gan

Gang Ou

Pak Kin Leung

You Yong Liao

Siu Yan Ho

Shiqiang Yao

Ka Shing Kenny Kwan

Yiu Ming Cheung

Chi Ming Chong

Chung Sheung Yung

Hon Yu Peter Ng

Cheuk Wah Tang

Wing Chiu Lai

Yi Kei Law

Kin Fung Yu

Chuek Wah Tang

Ying Liu

Ka Yee Mak

Kin Yik Hung

Kai Siu Lam

Sai Kit Wong

Man Chung Raymond Ng

Hon Chiu Hui

Yen Hsi Terry Tang

Jiang Wen Deng

Tin Kwan Bobby Chan

Chi Ping Hung

Wing Cheung Ho

Yin Fun Ng

Ajit Gaunekar

Dazhang Liao

Yun Bo He

Dong Sheng Zhang

Sun Kuen Wong

Ajit Shriman Gaunekar

Chi Chung Mok

Chi Wah Yuen

Chun Ho Ho

Shing Lui Lau

Chor Fai Wong

Shun Yan Lee

Yu Xing Cao

Xiangsheng Pan

A pick and place LED testing apparatus, comprising: a test station operative in use to power a group of LEDs; a bondhead operative in use to pick said group of LEDs from a source wafer and place said group of LEDs on said test station for testing; and an optical sensor operative in use to measure an optical characteristic of said group of LEDs when tested, wherein at least a portion of said bondhead is translucent to provide an optical path from said group of LEDs to said optical sensor.

Testing of LED devices during pick and place operations

A cooling apparatus is provided for a bond head which has a collet to hold a semiconductor die and a heater to heat the semiconductor die held by the collet. The cooling apparatus includes a dielectric liquid supply for supplying a dielectric liquid and a gas supply for supplying a gas. A spray nozzle is located next to a surface of the heater, and is connected to both the dielectric liquid supply and the gas supply. In order to cool the heater, the spray nozzle sprays a liquid-gas mixture of the dielectric liquid and the gas towards the surface of the heater.

Bond head cooling apparatus

An atomization mechanism for cooling a bond head comprises an atomization module and a conduit. In use, the atomization module receives gas and liquid from a gas supply and a liquid supply respectively to form an atomized spray and the conduit conveys the atomized spray from the atomization module to a spray inlet located at the bond head to receive the atomized spray into the bond head for cooling the bond head.

Atomization mechanism for cooling a bond head

A pick arm for a pick and place apparatus for semiconductor devices, the pick arm comprising first and second ends along a longitudinal axis of the pick arm, and a pick tool located at the first end of the pick arm for picking up semiconductor devices. The pick arm further comprises a winged part extending in a direction transverse to the longitudinal axis between the first and second ends of the pick arm, wherein the winged part comprising a sloping surface. The sloping surface is inclined between a top portion and a bottom portion of the winged part such that the sloping surface is nearer to the longitudinal axis at the top portion than at the bottom portion of the winged part.

Pick arm comprising a winged part for a bonding apparatus

A bond head for thermal compression die bonding comprises a collet operative to support a die on a first side of the collet during die bonding and a bond head heater located on a second side of the collet opposite to the first side for heating the collet and the die. A die vacuum suction hole on the bond head heater applies a vacuum suction force to hold the collet, and a collet vacuum suction hole on the bond head heater applies a vacuum suction force to hold the die. At least one vacuum distribution channel that is formed on the second side of the collet is in fluid communication with the collet vacuum suction hole and distributes the vacuum suction force across a surface of the second side of the collet for securing the collet.

Bond head for thermal compression die bonding

Disclosed is an apparatus for determining an alignment of a bondhead of a die bonder relative to a workchuck. Specifically, the apparatus comprises: i) a sensor configured to measure a distance between the bondhead and the sensor; and ii) a positioning device coupled to the sensor, the positioning device being configured to position the sensor relative to a plurality of locations on the bondhead facing the sensor. In particular, the sensor is operative to measure a set of distances between each of the plurality of locations on the bondhead and the sensor, the set of distances being for determining the alignment of the bondhead. A method of determining an alignment of a bondhead of a die bonder relative to a workchuck is also disclosed.

Apparatus and method for determining an alignment of a bondhead of a die bonder relative to a workchuck

A linear switched reluctance motor comprises a movable coil bracket including first and second coil assemblies. Each of the first and second coil assemblies further comprises a plurality of coils separately wound around a plurality of motor coil cores, each of the coils being configured to receive a sinusoidal current at a different phase from other coils comprised in the same coil assembly. Tooth members of a stator track are located adjacent to the motor coil cores such that a magnetic flux path is created which passes through the motor coil core, the stator track and an air gap between the motor coil core and the stator track. A multiple-phase motor driver electrically connected to the first and second coil assemblies generates symmetric multiple-phase sinusoidal currents for driving the motor.

Multiple-phase linear switched reluctance motor

A direct current motor comprises a magnet assembly having a pair of magnets for generating a magnetic field and a coil assembly located between the pair of magnets, the coil assembly and the magnet assembly being movable relative to each other. The coil assembly further comprises a first coil section and a second coil section which are electrically connected to each other. A current generator is electrically connected to the coil assembly and is operative to provide first, second and third currents. The first current is electrically connected directly to the first coil section and the second current is electrically connected directly to the second coil section whereas the third current is electrically connected to the first and second coil sections at a position connecting the first and second coil sections.

Direct current motor incorporating thermal control

An apparatus for aligning a bonding tool of a die bonder with respect to a bond stage is disclosed. The apparatus comprises: a connecting member to which the bonding tool is coupleable such that the connecting member is located between the bonding tool and a main body of a die bonder; and a plurality of actuators engaged to the connecting member. In particular, the plurality of actuators are actuable to rotate the connecting member and the bonding tool relative to the main body of the die bonder about a plurality of axes, to align the bonding tool with respect to the bond stage.

Apparatus for aligning a bonding tool of a die bonder

A system for maintaining thermal stability of a motion stage driven by a motor comprises a motion current generator operative to produce a motion current to drive the motion stage to move and a thermal current generator operative to produce a thermal current to dissipate heat in the motion stage for controlling a temperature of the motion stage without producing corresponding movement of the motion stage. A summation controller is operative to combine the motion current with the thermal current, and to produce a combined current output to the motor.

System for maintaining thermal stability of a motion stage

A collet mounting assembly for a die bonder comprises a collet mount having a first end attached to the die bonder and a second end opposite the first end with a cavity defined in the second end for receiving a shaft of the collet. The collet mounting assembly further comprises a fastener for securing the collet inside the cavity of the collet mount. A compression force is generated around the shaft of the collet received in the collet mount by the flexing of the fastener when it is attached to the collet mount, for securing the collet within the cavity of the collet mount.

Collet mounting assembly for a die bonder

A gantry system is provided that comprises a gantry beam having a first section and a second section and first and second motors cooperating to drive the respective first and second sections in parallel directions to position the gantry beam along a linear axis. A flexure is connected between the first and second sections about which the second section is deflectable relative to the first section, which is advantageous to reduce any stresses that may be caused in the gantry system when driving the gantry beam.

Gantry positioning system

A die bonder comprises a bond head having a load shaft which passes through the bond head and a collet located at one end of the load shaft for holding a die to be bonded. A bond force motor is operative to drive the load shaft along a travel axis in directions towards and away from a die bonding position. A rotary motor is operative to rotate the load shaft about a rotational axis parallel to the travel axis. A coupler which comprises a bearing couples the load shaft to the bond force motor to allow the load shaft to rotate about the rotational axis relative to the bond force motor.

Rotary bonding tool which provides a large bond force

A driving mechanism comprises a fixed housing, a movable housing on which an object to be driven is mounted and a driving motor which is operative to drive the movable housing to move linearly as well as to rotate relative to the fixed housing. An inductance-type encoder determines both linear and rotary displacement of the movable housing relative to the fixed housing, whereby to provide closed-loop control of the position of the object in both linear and rotary directions.

Driving mechanism having position encoder for two-dimensional positioning

Growing community of inventors

Hong Kong, China

Gary Peter Widdowson