Intel Corporation

Gary Paek

Nicholas Waddell Oakley

Peter S Adamson

Daryl A Sato

David W Boggs

John H Dungan

John J Valavi

For one disclosed embodiment, an apparatus includes a first housing and a second housing coupled to the first housing. The first housing and the second housing are rotatable between an open configuration and a closed configuration. The apparatus further includes and a touch input device supported by the first housing. The touch input device is configured to have a first active touch surface when the first housing and the second housing are in the open configuration, and a second active touch surface when the first housing and the second housing are in the closed configuration. The first active touch surface is smaller than the second active touch surface.

Dual touch surface multiple function input device

For one disclosed embodiment, an apparatus includes a first housing and a touch input device supported by the first housing. The touch input device includes a first touch surface layer, a second touch surface layer, and a touch sensor disposed between the first touch surface layer and the second touch surface layer. The touch sensor is configured to detect a first touch input associated with the first touch surface layer and a second touch input associated with the second touch surface layer.

Electronic computer with an at least partially transparent input device

At least partially transparent input device for an electronic computer

Electronic computer with partially transparent input device

A method for providing an improved solder joint for a via-in-pad ball grid array package. One or more bonding pads are formed upon a substrate. One or more vias are formed through the substrate within the bonding pad. The vias are plugged with a via plug material. The via plug material is then preconditioned such that an amount of volatiles within the via plug material is reduced.

Preconditioning via plug material for a via-in-pad ball grid array package

An electronic assembly is disclosed. The electronic assembly includes a lower portion and a first elongate trace formed on an upper surface of the lower portion. The trace is covered by an upper portion, and an opening formed through an upper surface of the upper portion extends to the trace to expose a portion of the trace. A second elongate trace is formed on the upper portion. A portion of the second elongate trace positioned in the opening formed through the upper surface of the upper portion contacts the first elongate trace through the opening to form an electrical interconnection between the first trace and the second trace.

PCB method and apparatus for producing landless interconnects

An apparatus and method for providing a vented blind via in pad of a printed circuit board (PCB). A vent in the blind via in pad to allow gases formed during reflow soldering to escape from the solder joint. In one embodiment, the vent extends from the outer edge of the pad to the blind via. In another embodiment, a method includes forming a blind via in pad having a vent.

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Beaverton, OR, United States of America

Gary Paek