Delphi Technologies, Inc.

Gary Lynn Eesley

Mohinder Singh Bhatti

Donald T Morelli

Carl William Berlin

Scott David Brandenburg

Erich William Gerbsch

Richard Dixon Parker

An assembly for packaging one or more electronic devices in die form. The assembly includes substrates on opposite sides of the assembly, with lead frames between the electronic devices and the substrates. The substrates, lead frames, and electronic devices are sintered together using silver-based sintering paste between each layer. The material and thicknesses of the substrates and lead frames are selected so stress experienced by the electronic devices caused by changes in temperature of the assembly are balanced from the center of the assembly, thereby eliminating the need for balancing stresses at a substrate level by applying substantially matching metal layers to both sides of the substrates.

Balanced stress assembly for semiconductor devices

A liquid cooled power electronics assembly configured to use electrically conductive coolant to cool power electronic devices that uses dielectric plates sealed with a metallic seal around the perimeter of the dielectric plates to form a device assembly, and then forms another metallic seal between the device assembly and a housing. The configuration allows for more direct contact between the electronic device and the coolant, while protecting the electronic device from contact with potentially electrically conductive coolant. Material used to form the dielectric plates and the housing are selected to have similar coefficients of thermal expansion (CTE) so that the reliability of the seals is maximized.

Liquid cooled electronics assembly suitable to use electrically conductive coolant

Heat sinks are provided that achieve very high convective heat transfer surface per unit volume. These heat sinks comprise a spreader plate, at least two fins and at least one porous reticulated foam block that fills the space between the fins.

High performance heat exchange assembly

Heat sinks are provided that achieve very high convective heat transfer surface per unit volume. These heat sinks comprise a spreader plate, at least three fins and at least one porous reticulated foam block that fills the space between the fins.

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Davisburg, MI, United States of America

Gary Lynn Eesley