Motorola Corporation

Freescale Semiconductor,inc.

Other

Nxp Usa, Inc.

Ford Motor Company Limited

Delco Electronics Corporation

Innovative Gaming Corporation of America

United Gaming, Inc.

Gary L Miller

Vernon B Goler

Mark Maiolani

Mario D Nemirovsky

Timothy Ernest Litch

William C Moyer

Samuel James Guido

Ray Charles Marshall

Stanley E Groves

Rollie Morris Fisher

Michael E Gladden

Rudolf Bettelheim

John Mark Wilson

Jeffrey Freeman

David Rivera

Micah Charles Knapp

Marcella Evelyn Meyer

Chris P Ahrens

Robert G Plummer

Robert S Porter

Huy M Nguyen

Gus Wai-Yan Yeung

Chen He

James G Gay

Thomas R Toms

Kuppuswamy Raghunathan

Derek Beattie

Jehoda Refaeli

Wallace B Harwood, Iii

Ronald W Stence

Joseph Jelemensky

Jimmy Gumulja

Robert L Anderson

David D Barrera

Daniel N Debrito

David R Gonzales

Geng Zhong

Gilford E Lubbers

Hugo Mauro V D C Cavalcanti

Philip Enqirue Madrid

Philip Enrique Madrid

Surendra P Bhattarai

Guruswamy Ganesh

Gary Lee Whisenhunt

Jehodi Refaeli

A system and method wherein die-to-die communication are provided between a first die and a second die contained in a common integrated circuit (IC) package, a first processor on the first die communicatively coupled to first connectivity circuitry by a first processor bus and configured to provide first bus transactions to the first processor bus, the discrete signal lines connected to the first connectivity circuitry to provide first discrete signals indicative of discrete events, the first connectivity circuitry configured to store the first discrete signals in a plurality of virtual signal registers and to convert the first bus transactions and the first discrete signals into die-to-die message packets to be communicated to the second connectivity circuitry via a die-to-die interconnect between the first die and the second die, the first discrete signals being converted into the die-to-die message packets on a register-by-register basis.

Inter-processor communication and signaling system and method

A system and method wherein die-to-die communication are provided between a first die and a second die contained in a common integrated circuit (IC) package, a first processor on the first die communicatively coupled to the first connectivity circuitry by the first processor bus and configured to provide first bus transactions, to be provided to the second connectivity circuitry, to the first processor bus, the first connectivity circuitry configured to utilize a multiple simultaneous outstanding transaction capability supporting multiple simultaneous outstanding write transactions concurrent with multiple simultaneous outstanding read transactions, the second connectivity circuitry configured to provide processor bus flow control information and elasticity buffer status information pertaining to the elasticity buffer to the first connectivity circuitry via a common message for flow control.

Inter-processor communication method for access latency between system-in-package (SIP) dies

A system in a package (SIP) has a first die with a first internal voltage level, first die-to-die output circuitry, first die-to-die input circuitry, and first internal logic and a second die with a second internal voltage level, second die-to-die output circuitry, second die-to-die input circuitry, and second internal logic. A first signal is provided to the second internal logic via the first die-to-die output circuitry and the second die-to-die input circuitry, wherein each of the first die-to-die output circuitry and second die-to-die input circuitry selectively level shift the first signal based on the first and second internal voltage levels. A second signal is provided to the first internal logic via the second die-to-die output circuitry and the first die-to-die input circuitry, wherein each of the second die-to-die output circuitry and first die-to-die input circuitry selectively level shift the second signal based on the first and second internal voltage levels.

Systems and methods for supplying reference voltage to multiple die of different technologies in a package

A data bus network interface module for enabling reception and transmission of application messages to/from at least one host processing module of an integrated digital signal processing device via a data bus network is described. The data bus network interface module being arranged to receive at least one data bus message from at least one remote network node via the data bus network, read an identifier field of the received at least one data bus message, and make data content of the received at least one data bus message available to at least one debug module if the identifier field comprises an identifier value defined for debug use.

Data bus network interface module and method therefor

A source clock signal is received from a primary semiconductor device by a secondary semiconductor device via an interconnect. A local clock signal is generated on the secondary semiconductor device based on the source clock signal. A mode control signal is generated on the secondary semiconductor device, where the mode control signal indicates one of an unlock mode of operation and a lock mode of operation of the secondary semiconductor device. A physical interface (PHY) clock signal is generated based on the local clock signal, where the PHY clock signal includes the local clock signal during the lock mode, and the PHY clock signal includes an inverted version of the local clock signal during the unlock mode. Data received from the primary semiconductor device via the interconnect is latched at a positive edge of the PHY clock signal during the unlock mode and the lock mode.

Synchronous communication between system in package (SiP) devices

A method embodiment of the present disclosure includes receiving a delay value associated with an interconnect delay that is measured across interconnect circuitry communicatively coupling a host semiconductor device with a semiconductor device. The method also includes delaying a local clock signal by an amount of delay indicated by the delay value to produce a delayed local clock signal. The method also includes receiving a delayed source clock signal, where the delayed source clock signal is received from the host semiconductor device via the interconnect circuitry. The method also includes outputting a master clock signal based on a comparison of the delayed source clock signal and the delayed local clock signal, where the master clock signal is utilized to generate one or more aligned clock signals on the semiconductor device that are aligned with a source clock signal generated on the host semiconductor device.

Clock signal alignment for system-in-package (SIP) devices

Methods and systems are disclosed for address mapping between die-to-die-port (DTDP) host devices and DTDP expansion devices for combined system-in-package (SiP) solutions. Interconnect circuitry having a plurality of ports is configured to provide communication from the host device to the expansion device so that the expansion device appears to be resident on the host device. Configurable address mapping is used to re-configure the host memory map to include expansion memory map details in a seamless fashion. Further, direct circuit interconnection blocks (e.g., using copper pillar (CuP) connectors) can be used to improve connectivity and performance.

Methods and systems for address mapping between host and expansion devices within system-in-package (SiP) solutions

Methods and systems are disclosed for interconnecting die-to-die-port (DTDP) host devices and DTDP expansion devices for combined system-in-package (SiP) solutions. Interconnect circuitry having a plurality of ports is configured to provide communication from the host device to the expansion device so that the expansion device appears to be resident on the host device. Further, direct circuit interconnection blocks (e.g., using copper pillar (CuP) connectors) can be used to improve connectivity and performance. In addition, level shift circuitry can be utilized within expansion devices to allow for standardized interconnect signals and supply voltages to be provided by DTDP host devices to DTDP expansion devices.

Methods and systems for interconnecting host and expansion devices within system-in-package (SiP) solutions

A system in a package (SiP) includes a first semiconductor die having a nonvolatile memory and trim/repair circuitry, and a second semiconductor die having a volatile memory and trim/repair circuitry. The first and the second semiconductor die are in a same package. The nonvolatile memory of the first semiconductor die is configured to store trim/repair values for each of the first and the second semiconductor die. The trim/repair circuitries of the first and second semiconductor die are configured to, in response to a reset of the second semiconductor die, copy the trim/repair values from the nonvolatile memory of the first semiconductor die to the volatile memory of the second semiconductor die.

System in a package (SiP)

In a processing system comprising a plurality of data processors at an integrated circuit die, each data processor has a local debug module. In response to acquiring data trace information based upon a corresponding local filtering criteria, the local debug modules transmit their data trace information to a global resource from each of the local debug modules for further filtering by a common filtering criteria.

Method and apparatus for filtering trace information

A data processing system includes a plurality of data processors, debug logic, and linking logic. The debug logic is coupled to each data processor of the plurality of data processors, and is for providing an instruction for exiting debug mode to the plurality of data processors. The linking logic is coupled to the debug logic and to each of the plurality of data processors. The linking logic is for linking selected ones of the plurality of data processors with each other and to the debug logic. The debug logic provides the instruction for exiting the debug mode when the selected ones of the plurality of data processors are linked in parallel by the linking logic.

Multi-processor data processing system having synchronized exit from debug mode and method therefor

A system includes one or more processors; one or more trace debug circuits configured to monitor one or more of instruction, data, and watchpoint buses of the one or more processors, and record information determined from said monitoring; and a sequence processing unit configured to provide a control signal to a trace debug circuit of the one or more trace debug circuits, wherein in response to the control signal, the trace debug circuit controls one or more of said monitoring and recording, and a system on a chip comprises the one or more processors, the one or more trace debug circuits, and the sequence processing unit.

Data processing system having a sequence processing unit and method of operation

An interface including first and second transport protocol circuitry, a memory and a mode controller. The interface includes first and second physical interface types which are both selectively enabled to interface a set of pads. The first transport protocol circuitry is operative with the first type physical interface in a first mode and the second transport protocol circuitry is operative with the second type physical interface in a second mode. The memory stores a mode value indicative of the operating mode. The mode controller enables one of the physical interface types and a corresponding transport protocol based on the mode value. The first mode is the default mode, and the mode controller enables dynamic transition to the second mode. An escape indication may be enabled during the second mode for dynamic transition back to the first mode. Programmable timing values may be used to facilitate mode transitions.

Interface system and method with backward compatibility

A method is for testing a non-volatile memory. A base data pattern is defined for a first pageset of the non-volatile memory. The non-volatile memory has a plurality of pages which comprise words. The base pattern is arranged so that each bitpair of a plurality of bitpairs that includes one of a group consisting of even bitpairs and odd bitpairs formed from all of the words exhibits all possible bitpair transitions during sequential accesses of the pages of the plurality of pages. The base pattern is stored in the first pageset. The pages of the plurality of pages of the first pageset are accessed sequentially.

Transition fault testing for a non-volatile memory

Growing community of inventors

Austin, TX, United States of America

Gary L Miller