Micron Technology Incorporated

Other

Gary L Howe

Daniel B Penney

Miles S Wiscombe

Scott Eugene Smith

Brian W Huber

Eric J Stave

Harish Naga Venkata

Thanh K Mai

James S Rehmeyer

Byung Sick Moon

David R Brown

Thomas H Kinsley

Matthew Alan Prather

Myung Ho Bae

Tony M Brewer

Debra M Bell

Yoshinori Fujiwara

Joshua E Alzheimer

John E Riley

Duc V Ho

Vaughn N Johnson

Kyle Alexander

Sujeet V Ayyapureddi

Roy Edgar Greeff

Michael Amiel Shore

Timothy P Finkbeiner

Randall J Rooney

Jason M Johnson

Vijayakrishna J Vankayala

Jennifer E Taylor

William Chad Waldrop

Dennis G Montierth

Christian N Mohr

Jeffrey Edward Koelling

Liang Chen

Harish V Gadamsetty

Brian Thomas Pecha

Vijay Vankayala

John A Winegard

Brian T Pecha

Jack Riley

Brian Gross

Vipul Surlekar

Apparatuses and methods for memory array accessibility can include an apparatus with an array of memory cells. The array can include a first portion accessible by a controller of the array and inaccessible to devices external to the apparatus. The array can include a second portion accessible to the devices external to the apparatus. The array can include a number of registers that store row address that indicate which portion of the array is the first portion. The apparatus can include the controller configured to access the number of registers to allow access to the second portion by the devices external to the apparatus based on the stored row addresses.

Memory array accessibility

The present disclosure includes apparatuses and methods to transfer data between banks of memory cells. An example includes a plurality of banks of memory cells and a controller coupled to the plurality of subarrays configured to cause transfer of data between the plurality of banks of memory cells via internal data path operations.

Bank to bank data transfer

A memory device may include a memory array including a plurality of memory cells and a die stack including at least a portion of the plurality of memory cells. The memory device may also include multiple temperature sensors each designed to output a temperature code corresponding to the temperature of a respective die of the die stack. One die of the die stack is then designed to output the temperature code corresponding to the hottest die of the die stack.

Systems and methods for temperature sensor access in die stacks

Methods, apparatuses, and systems related to voltage management of memory apparatuses/systems are described. The memory device can include circuitry configured to determine an operating frequency of a clock signal for an ongoing or an upcoming memory operation. The memory device may generate a control indicator for increasing a system voltage for higher operating frequencies, for decreasing the system voltage for lower operating frequencies, or a combination thereof.

Apparatus with data-rate-based voltage control mechanism and methods for operating the same

Methods, systems, and devices for power management for a memory device are described. For example, a memory device may include one or more memory dies and may be configured to operate using a first supply voltage and a second supply voltage. The first supply voltage may be associated with a first defined voltage range, and the second supply voltage may be associated with a second defined voltage range. The memory device may include a power management integrated circuit (PMIC) that is coupled with the one or more memory dies and provides the supply voltages to the one or more memory dies. The PMIC may be configured to provide, to the one or more memory dies, a first voltage that is within the first defined voltage range as the first supply voltage and a second voltage that is outside the second defined voltage range as the second supply voltage.

Power management for a memory device

A memory device includes a command interface configured to receive write commands from a host device. Additionally, the memory device includes an input buffer configured to buffer a strobe signal from the host device. Furthermore, the memory device includes a first ripple counter and a second ripple counter. The memory device includes command handling circuitry configured to alternatingly start the first ripple counter and the second ripple counter in response to consecutive write commands. The command handling circuitry and/or the first and second ripple counters are configured to suppress a reset of the input buffer if either the first ripple counter or the second ripple counter has not reached a threshold and is still counting.

Synchronous input buffer control using a ripple counter

Memory devices and systems with improved command/address bus utilization are disclosed herein. In one embodiment, a memory device comprises a plurality of external command/address terminals and a command decoder. The plurality of external command/address terminals are configured to receive a command as a corresponding plurality of command/address bits. A first set of the command/address bits indicate a read or write operation. A second set of the command/address bits indicate whether to execute a refresh operation. The memory device is configured to, in response to the first set of command/address bits, execute the read or write operation on a portion of a memory array. The memory device is further configured to, in response to the second set of command/address bits, execute the refresh operation to refresh at least one memory bank of the memory array when the second set of command/address bits indicate that the refresh operation should be executed.

Memory with improved command/address bus utilization

Embodiments of the disclosure are drawn to apparatuses and methods for bad row mode. The memory may prevent proper access operations (e.g., read operations) from being performed on a selected bad row of the memory as part of a bad row mode. For example, the memory may store a bad row address and when an access address matches the bad row address, may suppress one or more signals, change data read from the address, or combinations thereof. The bad row mode may be used to provide a positive control for post package repair (PPR) operations on the memory. A controller may enter the memory into bad row mode and then test the memory to determine if the selected bad row can be located and repaired via PPR.

Apparatuses and methods for bad row mode

Methods, apparatuses, and systems related to operations for managing the quality of an input signal received by a device and for providing feedback in real-time. A controller can provide a reference signal to the device for the input quality check. The memory can implement the input quality check by counting the number of transitions of the reference signal for a set time period and store the resulting count value(s). The memory can use the count value(s) to determine a condition or a quality for the reference signal.

Apparatus with input signal quality feedback

Memory devices, systems including memory devices, and methods of operating memory devices are described, in which memory devices are configured to provide row clear features. In some embodiments, the memory device may receive a command from a host device directed to a row of a memory array included in the memory device. The memory device may determine that the command is directed to two or more columns associated with the row, where each column is coupled with a group of memory cells. The memory device may activate the row to write the two or more columns using a set of predetermined data stored in a register of the memory device. Subsequently, the memory device may deactivate the word line based on writing the set of predetermined data to the two or more columns.

Row clear features for memory devices and associated methods and systems

Apparatuses and methods for decoding addresses for memory are disclosed. An example apparatus includes a memory cell array and a row decoder. The memory cell array includes a bank of memory including a plurality of groups of memory. Each of the groups of memory includes sections of memory, and each of the sections of memory including memory cells arranged in rows and columns of memory. The row decoder decodes addresses to access a first group of memory to include rows of prime memory from a first block of memory and to include rows of prime memory from a second block of memory. The row decoder decodes the addresses to access a second group of memory to include rows of prime memory from the second block of memory and to include rows of redundant memory. The rows of redundant memory are shared with the first and second blocks of memory.

Apparatuses and methods for decoding addresses for memory

A memory device may include one or more memory banks that store data and one or more input buffers. The input buffers may receive command address signals to access the one or more memory banks. The memory device may operate in one of a first mode of operation or a second mode of operation. The one or more input buffers may operate under a first bias current when the memory device is in the first mode of operation or a second bias current when the memory device is in the second mode of operation, and the first bias current may be greater than the second bias current.

Command address input buffer bias current reduction

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Plano, TX, United States of America

Gary L Howe