The Boeing Company

Hughes Electronics Corporation

Gary L Duncan

Bruce Lee Drolen

John P Stafford

Roderick A Bulante

Troy A Conwell

David M Bowden

Sean Nguyen

Dennis Quan

Sung H Lee

Thanh K Nguyen

Bruce L Drolen

A thermal management device suitable for use as an electronic chassis includes a monolithic, monocoque body having integrally formed channels for carrying thermal energy away from a heat source, such as electronic components. The device may be fabricated using additive/subtractive manufacturing processes such as ultrasonic consolidation.

Thermal management device and method for making the same

A heat sink board structure includes a thermal/structural base having a composite core layer of a mass of graphitized carbon fibers infiltrated with a first resin material matrix. The graphitized carbon fibers of the composite core are substantially unidirectional and oriented parallel to the face of the composite core layer. Transverse reinforcement layers are bonded to the oppositely disposed faces of the composite core layer. Each transverse reinforcement layer is formed of carbon fibers embedded in a resin material matrix, with the carbon fibers lying substantially in a plane of the transverse reinforcement layer and perpendicular to the carbon fibers in the composite layer. Heat generating and heat dissipating components are bonded to the thermal/structural base. Metallic contact strips are bonded to the surfaces of the transverse reinforcement layers.

Composite heat sink/support structure

Growing community of inventors

Torrance, CA, United States of America

Gary L Duncan