Micron Technology Incorporated

Other

Gary L Chadwick

Alan G Wood

Larry Duane Kinsman

Tim J Corbett

Chender Huang

Tony M Teitenberg

John S Godfrey

Richard Regner

Dave Remmerden

Dave Hebert

Dave Reichle

Joe F Johnson

A reusable burn-in/test fixture for discrete TAB die consists of two halves. The first half of the test fixture contains cavity in which die is inserted. When the two halves are assembled, the fixture establishes electrical contact with the die and with a burn-in oven. The test fixture need not be opened until the burn-in and electrical test are completed. The fixture permits the die to be characterized prior to assembly.

Method for burn-in testing semiconductor dice

Stencils are provided for more precisely aligning stencil orifices with terminals or &ldquo;targets&rdquo; on a substrate. One such stencil is adapted for registration with an electronic substrate, such as a PCB, about a locus. The stencil includes a stencil body and an array of printing orifices passing through the stencil body. The printing orifices may have varying sizes, with the size of each printing orifice being a function of a distance of the printing orifice from the locus. Various methods are also provided, including methods for applying solder on electronic substrates using stencils and methods and systems for designing such stencils.

Printing stencils for electronic substrates

An apparatus and technique for performing continuity tests of power and ground pins on a packaged integrated circuit. The technique includes using a first and second fanout circuit each including a number of signal paths. Each signal path includes a switch and corresponds to a power or ground socket on a board configured to hold a number of integrated circuit packages. The fanout circuits allow full device testing, as well as testing of individual pins. By controlling the state of the switches, power and ground may be selectively supplied to power and ground pins to check the continuity of the signals from the integrated circuit device within the package to the external pins provided to route the signal to an external device.

Method and apparatus of testing memory device power and ground pins in an array assembly platform

Discrete die burn-in for nonpackaged die

A reusable burn-in/test fixture for discrete die consists of two halves. The first half of the test fixture contains cavity in which die is inserted. When the two halves are assembled, the fixture establishes electrical contact with the die and with a burn-in oven. The test fixture need not be opened until the burn-in and electrical test are completed. The fixture permits the die to be characterized prior to assembly.

Discrete die burn-in for non-packaged die

A signal timing analyzer monitors a programmable logic control (PLC) of an industrial machine. Signal states of the PLC are sampled and the signal information is then transferred to a receiver card which is connected to a computer data bus. This allows the computer to monitor a piece of equipment by 'eavesdropping' on the industrial controller that is actually operating and monitoring the equipment. The analyzer uses an on-board clock and timing circuit, so that the computer is not limited by the computer's clock speed in controlling sampling rates.

Real time monitoring of remote signals in an industrial environment

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Boise, ID, United States of America

Gary L Chadwick