Intel Corporation

Gary L Bookhardt

Shawn McEuen

Alexander Uan-Zo-Li

Jorge Pedro Rodriguez

Basavaraj B Astekar

Alexander B Uan-Zo-li

Matthew D Coakley

Neil C Delaplane

Josh Gordon

Marc A Abrams

Robert L Van Egmond

Brad T Combs

Ryan Wilday

An apparatus including a storage area to store instructions and a controller to control power in a first device based on the instructions. In operation, the controller generates one or more signals to combine power from a first power source and a second power source for a hybrid power operation. The controller is to generate the one or more signals based on a connection state of the first device, multiple connection states of the first device, a charge level of a battery of the first device, or a combination thereof.

Power management system and method

Network communication housing

A heat sink may be spring strapped onto a socketed processor using clips that engage the spring strap and that are pre-positioned on the circuit board. The clips may be C-shaped and may include an upper spring arm portion, a vertical portion, and a base which may be surface mounted to the circuit board. The upper spring arm of the C-shaped clip then releasably engages the spring strap to clamp the heat sink firmly onto the socketed processor.

Clamping heat sinks to circuit boards over processors

An integrated heat dissipation apparatus includes an attachment area, a heat exchange area thermally connected to the attachment area, and an air flow generation area that is integrally formed with the attachment area and the heat exchange area. A thermally conductive member extends between the attachment area and the heat exchange area to facilitate the removal of heat from the attachment area to the heat exchange area. A generated air flow passes through the heat exchange area.

Integrated heat dissipation apparatus

Growing community of inventors

Beaverton, OR, United States of America

Gary L Bookhardt