Synopsys, Inc.

Monterey Design Systems, Inc.

Gary K Yeap

Lawrence Thomas Pileggi

Douglas B Boyle

Majid Sarrafzadeh

Sharad Malik

Feroze P Taraporevala

Abhijeet Chakraborty

Salil Ravindra Raje

Dennis Yamamoto

Lilly Shieh

Xun Liu

Bohai Liu

Tong Gao

Gang Ni

Chunlei Zhu

James S Koford

John Lee

Christopher J Dunn

Yifan Zhang

David Gluss

Bang Liu

Robert E Shortt

Joseph T Rahmeh

Emre Tuncer

Eric McCaughrin

Dinesh D Gaitonde

Ben Mathew

Paul David Friedberg

Padmashree Takkars

Hung-Chun Chien

Chang-Wei Tai

Renata Zaliznyak

Sam Jung Kim

Dalei Wang

Archie Li

Yau-Tsun Steven Li

Satamurthy Pullela

Xiao-Ming Xiong

Yonghua Liao

Techniques for determining a density of through-silicon vias (TSVs) in a three-dimensional (3D) stacked die are disclosed. In some embodiments, such techniques may include obtaining first power consumption information associated with a first die of the 3D stacked die; obtaining second power consumption information associated with a second die of the 3D stacked die; identifying, on the first die, an area associated with the second die, the identified area overlapping an area associated with the first die; and determining a density of TSVs for the identified area based at least on the first power consumption information and the second power consumption information.

Determining a density of through-silicon vias in integrated circuits

Methods and systems are described herein relate to automatic channel identification of high-bandwidth memory channels and subchannel generation. An HBM channel identification system may perform a sequence of operations to identify HBM channels within a netlist of an interposer: channel dimension prediction, channel bounding box prediction, channel orientation derivation, subchannel partition, and subchannel routing region creation. In one example, an HBM channel identification method includes identifying candidate nets within a netlist. A bounding box that includes one or more nets of the candidate nets is determined. Once the bounding box is determined, the orientation of the box is determined and used to determine a pattern of bumps within the bounding box. Finally, a subchannel is generated based on the pattern of bumps.

Automatic channel identification of high-bandwidth memory channels for auto-routing

A computer implemented method for designing a circuit is presented. The method includes forming, using the computer, a multitude of cells. Each cell is characterized by a multitude of first shapes extending along a first direction. Each first shape is spaced, along a second direction substantially orthogonal to the first direction, from a neighboring first shape in accordance with a first pitch. Each cell is further characterized by a cell origin including a first cell coordinate associated with the second direction. The first cell coordinate is assigned in accordance with an integer multiple of the first pitch when the computer is invoked to form the multitude of cells representing the circuit.

Methodology using Fin-FET transistors

A computer implemented method for designing a circuit is presented. The method includes forming, using the computer, a multitude of cells, each cell characterized by at least first and second boundaries positioned along a first direction, and a plurality of first shapes extending along the first direction. Each first shape is spaced, along a second direction substantially orthogonal to the first direction, from a neighboring first shape in accordance with a first pitch. The first and second boundaries are further positioned in accordance with an integer multiple of the first pitch when the computer is invoked to form the plurality of cells representing the circuit.

A method for generating legal colorable multiple patterning standard cell placement is provided. In this method, a standard cell library including color information can be accessed. For each standard cell, edge labels can be assigned based on colors of objects within a predetermined distance from each edge. A truth table, which indicates legal spacing between pairs of standard cells based on their edge labels, can be accessed. A plurality of standard cells of a design can then be placed based on the truth table.

Standard cell placement technique for double patterning technology

A method of generating optimized input/output (IO) pair and inter-chip connection combinations for two chips is described. In this method, first and second designs for two chips can be specified. Then inter-chip signals based on the first and second designs can be specified. IO pairs for the first and second chips can be determined based on the inter-chip signals. At this point, electrical contacts between micro-bumps (MBs) of the first and second chips can be formed. Inter-chip paths with through-silicon-vias (TSVs) and MBs of the first and second chips can also be formed. At this point, the costs of assigning the IO pairs to the inter-chip paths can be determined. A cost matrix can be built based on these costs. A bipartite matching algorithm can be applied to the cost matrix to determine the optimized IO pair and inter-chip path combinations.

Two-chip co-design and co-optimization in three-dimensional integrated circuit net assignment

Full-chip scan data can be advantageously used during design planning to minimize top-level scan wires and scan feedthroughs. The scan cells can be reordered using a modified cost function to promote connecting all scan cells in one plan group before crossing to a scan cell in another plan group. The modified cost function can take into account penalty parameters. The penalty parameters can include at least one of: membership in a plan group or a top-level physical hierarchy, size of a plan group, FLOATING/ORDERED scan element in scan data, location of endpoints of an ORDERED list, location of endpoints of a macro, and membership in a plan group containing a STOP point. Scan data, at the block-level and at the top-level, can be automatically updated to reflect the plan groups and optimized scan chains.

Design-for-test-aware hierarchical design planning

The present invention, generally speaking, provides a placement method for the physical design of integrated circuits in which natural topological feature clusters (topo-clusters) are discovered and exploited during the placement process. Topo-clusters may be formed based on various criteria including, for example, functional similarity, proximity (in terms of number of nets), and genus. Genus refers to a representation of a netlist in terms of a number of planar netlists&#x2014;netlists in which no crossing of nets occurs. Topo-clusters drive initial placement, with all of the gates of a topo-cluster being placed initially in a single bin of the placement layout or within a group of positionally-related bins. The portion of a topo-cluster placed within a given bin is called a quanto-cluster. An iterative placement refinement process then follows, using a technique referred to herein as Geometrically-Bounded FM (GBFM), and in particular Dual GBFM. In GBFM, FM is applied on a local basis to windows encompassing some number of bins. From iteration to iteration, windows may shift position and vary in size. When a region bounded by a window meets a specified cost threshold in terms of a specified cost function, that region does not participate. The cost function takes account of actual physical metrics&#x2014;delay, area, congestion, power, etc. 'Dual' refers to the fact that each iteration has two phases. During a first phase, FM is performed within a region on a quanto-cluster basis. During a second phase, FM is performed within the region on a gate basis. GBFM occurs in the context of recursive quadrisection. Hence, after GBFM has been completed, a further quadrisection step is performed in which each bin is divided into four bins, with a quarter of the gates of the original bin being placed in the center of each of the resulting bins. GBFM then follows, and the cycle repeats until each bin contains a fairly small number of gates. Following the foregoing global placement process, the circuit is then ready for detailed placement in which cells are assigned to placement rows.

Placement method for integrated circuit design using topo-clustering

The disclosure describes a placement method for the physical design of integrated circuits in which natural topological feature clusters are discovered and exploited during the placement process is disclosed. Topo-clusters drive initial placement, with all of the gates of a topo-cluster being placed initially in a single bin of the placement layout or within a group of positionally-related bins. An iterative placement refinement process is done using a technique referred to as Dual Geometrically-Bounded FM (GBFM). GBFM is applied on a local basis to windows encompassing a number of bins. From iteration to iteration, windows may shift position and vary in size. When a region bounded by a window meets a specified cost threshold in terms of a specified cost function, that region stops participating. Following the foregoing global placement process the circuit is then ready for detailed placement in which cells are assigned to placement rows.

A design tool for integrated circuits includes a placement tool which places logic gates and interconnect components concurrently. Probabilistic interconnect models are used to represent the collection of possible interconnect routings that provide acceptable circuit performance and routing area.

System and method for concurrent placement of gates and associated wiring

A method for design optimization using logical and physical information is provided. In one embodiment, a method for design optimization using logical and physical information, includes receiving a behavioral description of an integrated circuit or a portion of an integrated circuit, optimizing placement of circuit elements in accordance with a first cost function, and optimizing logic of the circuit elements in accordance with a second cost function, in which the optimizing placement of the circuit elements and the optimizing logic of the circuit elements are performed concurrently. The method can further include optimizing routing in accordance with a third cost function, in which the optimizing routing, the optimizing placement of the circuit elements, and the optimizing logic of the circuit elements are performed concurrently.

Method for design optimization using logical and physical information

This invention recognizes the ability of logic optimization to help placement relieve congestion. Different types of logic optimizations are used to help placement relieve congestion. In one type of optimization, the speed of parts of the circuit is improved by selecting faster cells. In another type of optimization, the topology of the circuit is changed such that placement can now move cells, which could not have been moved before, to reduce congestion and thus enable routing. A distinguishing feature of this methodology is that it not only uses the placement information for interconnection delay/area estimates during logic optimization, but also uses logic optimization to aid the physical placement steps by providing support to placement so that the congestion of the circuit is improved. The aim is to avoid getting into a situation where the placed circuit cannot be routed.

Method for logic optimization for improving timing and congestion during placement in integrated circuit design

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Fremont, CA, United States of America

Gary K Yeap