Motorola Corporation

Google Inc.

Motorola Mobility LLC

Google Technology Holdings LLC

Gary K Mui

Karl W Wyatt

James J Morikuni

Chao-pin Yeh

Martin Rabindra Pais

Jose P Joseph

Maninder Singh Sehmbey

Tomasz L Klosowiak

Seajin Oh

Neil J Adams

David W Currier

Daniel A Young

Sean Xin Wu

Xinyu Dou

Siddharth Sinha

Tom Brey

Delbert Juarezl

Don Dillard

Kai X Hu

Dave Roller

Rich Dlesk

Siddarth Sinha

Disclosed are methods and touch sensitive devices including a haptic actuator drive frequency module stored by the memory and in communication with the controller, the haptic actuator drive frequency module being configured to receive touch input from one of a plurality of regions of the touch sensitive layer and to output one of a plurality of haptic actuator drive frequency signals based upon the region from which the haptic actuator drive frequency module received the touch input to provide for consistency of the haptic response across a touch sensitive device.

Methods and devices for consistency of the haptic response across a touch sensitive device

An optical communication system is provided for conveying signals between multiple housing elements of a device, where respective optical detectors and optical light sources interact via a light guide associated with each communication path, where an optical signal produced by the optical light source and received by the optical detector travels a path where at least a first light redirection unit redirects the optical signal between an angle in which the optical signal travels along at least a portion of the length of the light guide, and an angle which allows the optical signal to exit the light guide. In at least some instances, the multiple housing elements correspond to at least a pair of housing elements that are incorporated as part of a communication device having a slider configuration. In some of the same or still further instances, one or more of the light redirection units are diffractive optical elements. In some instances, one or more of the light redirection units are reflectors.

Optical communication system with light guide having variable slidable point of entry or exit

A point to strip optical communication system () for transmitting light between a first housing () and a second housing () of a device is provided. The point to strip optical communication system () includes a point optical communication element () that is capable of emitting light. The point optical communication element () is coupled to either the first housing () or the second housing (). The point to strip optical communication system () also includes a strip optical communication element () that is coupled to either the first housing () or the second housing () to which the point optical communication element () is not coupled. The length of the strip optical communication element () corresponds to the travel distance of the first housing () and the second housing (). The strip optical communication element () is located to coincide with the travel path of the point optical communication element ().

Point to strip optical communication system

The present invention provides a method, article of manufacture, and optical package (24) for eliminating tilt angle (40) between an optical emitter (26) mounted on a carrier (28). The method, article of manufacture, and optical package (24) include a carrier (28) having a top surface (42) with a cavity (46) formed therein, an adhesive material (38) inserted into the cavity (46), and an optical emitter (26) placed on the top surface (42) of the carrier (28) and at least partially covering the cavity (46), thereby providing at least one egress point for overflowing said adhesive material therefrom.

Method, article of manufacture, and optical package for eliminating tilt

Board delamination during the singulation from a board panel and board sagging during front-end assembly are two biggest problems encountered in cellular manufacturing lines. The method (700) and circuit board panel (600) of the present invention substantially eliminate assembly-line delamination and sagging for circuit board manufacturing. A number of slots are punched to fit into a circuit board profile. V-grooves are cut along each of the circuit board profiles through the slots and directly opposite on a top and bottom of the circuit board. Thus, optimization of the cut-outs and v-groove configurations eliminate tearing/delamination and substantially reduce sagging.

Method and circuit board panel for circuit board manufacturing that

A selective gas sensor (10) for detecting a particular compound, or group of compounds, such as non-methane hydrocarbons, within a high temperature gas stream (12) includes an oxygen generation system (14) positioned over an oxygen diffusion region (15). The oxygen generation system (14) and the oxygen diffusion region (15) provide oxygen through a medial temperature control zone (20) to a sensing element (16). The temperature and flux of hydrocarbon components within the high temperature gas stream (12) are regulated by components within the high temperature control zone (20) and by an external temperature control zone (22) in thermal contact with the sensing element (16).

Selective gas sensor

A flexible circuit board assembly (10) includes a flexible substrate (11) having first and second end portions (14,15) and an intermediate portion (16). Conductive metalization interconnect paths (17) extend between the substrate end portions (14, 15) and across the intermediate portion (16). The substrate first and second end portions are mounted to first and second end portions (21, 22) of a rigidizer plate (20). Stiffening material (35) is provided on the flexible substrate intermediate portion (16) to define stiff (36, 37, 38) and less stiff (39, 40) paths that extend across the interconnect paths (17) and the substrate intermediate portion (16) and define desired bend curvature characteristics for the flexible substrate intermediate portion (16). A method utilizes this structure to provide a flexible circuit board assembly (10), preferably with a bent rigidizer plate (20).

Flexible circuit board assembly and method

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Arlington Heights, IL, United States of America

Gary K Mui