Seagate Technology Incorporated

Other

Gary Joseph Kunkel

John L Brand

Ajaykumar Rajasekharan

Zoran Jandric

Brian William Karr

Manuel Charles Anaya-Dufresne

Zhen Wei

Declan Macken

James Gary Wessel

Huazhou Lou

Timothy William Stoebe

Narayanan Ramakrishnan

Michael Allen Seigler

Michael Thomas Johnson

Andrew D Habermas

Raul Horacio Andruet

Quinn Jay Haddock

Zhiyu Chen

Igor V Sytine

Pietro Ferrero

Erik Jon Hutchinson

Szymon Suckewer

Dongming Liu

David James Ellison

Kurtis Dean Loken

Neil Zuckerman

Chris Rea

Edwin F Rejda

Joseph Michael Stephan

Anil Junuthula Reddy

Alexander J Smits

Xuan Zheng

Andrew Frenz

Douglas Hampton Cole

Richard A Register

Marsha Anne Huha

Matthew Aaron Carper

Peter S Hersh

Ying Dong

Anatoli Morozov

Ki Myung Lee

Jin Fang

The Ngoc Nguyen

Zhiyong Xiao

Dan Dinh

Edwin Frank Rejda

An assembly for lapping multiple row bars, the assembly including a carrier having at least one carrier bond pad, multiple row bars adjacent to each other in a stack, wherein a first row bar of the stack is positioned closer to the carrier than any of the other multiple row bars of the stack and comprises at least one row bar bond pad, an electrical connection between at least one of the carrier bond pads and at least one of the row bar bond pads of the first row bar, and at least one electrical trace extending through at least two of the multiple row bars and electrically connected to at least the first row bar and one additional row bar of the stack. An outermost row bar of the stack includes an outer surface and at least one electronic lapping guide.

Articles for lapping stacked row bars having in-wafer ELG circuits

Various defects in an electronic assembly can be intelligently identified with a system having at least a server connected to a first capture module and a second capture module. The first capture module may be positioned proximal a first manufacturing line while the second capture module is positioned proximal a second manufacturing line. Images can be collected of first and second electronic assemblies by respective first and second capture modules prior to the images being sent to a classification module of the server where at least one defect is automatically detected in each of the first and second electronic assemblies concurrently with the classification module.

Intelligent defect identification system

An apparatus and method for topographically characterizing a workpiece. The method includes scanning a first surface of a workpiece with a scanning probe at a first resolution to derive a first topographical image, and performing a refining operation on the first topographical image to obtain a true first topographical image. The method also includes scanning, with the scanning probe, a surface of interest of the workpiece, which is a sub-portion of the first surface, at a second resolution that is higher than the first resolution to derive a second topographical image. The second topographical image is scaled down to the first resolution. The method further includes performing a pattern recognition operation to substantially match the scaled-down second topographical image to a corresponding sub-portion of the true first topographical image. The matched sub-portion of the true first topographical image is employed to refine the second topographical image.

Metrology technique that provides true flattening

A method of lapping multiple row bars provided in a stack, including the steps of electrically connecting at least one row bar bond pad of a first row bar to at least one carrier bond pad of a carrier, electrically connecting an outermost row bar of the stack to the first row bar of the stack by at least one electrical trace, wherein the outermost row bar comprises at least one electronic lapping guide, lapping an outer surface of the outermost row bar until a signal provided by the at least one electronic lapping guide of the outermost row bar reaches a predetermined value, terminating the lapping of the outermost row bar, and removing the outermost row bar from the stack to expose a second row bar, wherein the second row bar is electrically connected to the first row bar with the at least one electrical trace.

Methods and articles for lapping stacked row bars having in-wafer ELG circuits

Embodiments of the present disclosure include methods and systems of lapping a row bar of sliders, where the systems and methods use externally mounted laser components to focus laser energy on an area of an individual slider that can absorb the laser energy in a manner to cause at least the write pole and/or reader to protrude more relative to one or more other slider components (e.g., a reader) during lapping.

Lapping system including one or more lasers, and related methods

A slider comprises an air bearing surface (ABS) and is configured to interact with a magnetic recording medium. A writer is provided on the slider and comprises a write coil having a media-facing surface situated at the ABS. Cooling arms project laterally from peripheral surfaces of the write coil and extend along the ABS. The media-facing surface of the write coil and the cooling arms are exposed to the ABS to facilitate increased cooling of the write coil at the ABS.

Write coil cooling arrangement at air bearing surface

A method includes receiving an image of a surface of a slider bar from an interferometer, where the slider bar includes at least two sliders, and where the image includes image data according to at least two image data channels for a slider bar surface and the at least two sliders. The method also includes generating a slider bar map of the surface of the slider bar based upon the image data of the image, where the slider bar map includes at least two data channels and ascertaining a plurality of individual slider surface maps based on a number of sliders included on the slider bar, where the ascertaining is also based upon the slider bar map having the at least two data channels. The method also includes segmenting the slider bar map according to the plurality of individual slider surface maps.

Automated and accurate high-throughput slider-level flatness inspection

A contact sensor is provided at or near an air bearing surface of a slider and having a temperature coefficient of resistance. The contact sensor is coupled to a lead arrangement comprising a first lead and a second lead. The contact sensor comprises a sensor element, a first peripheral wing comprising an inner wing connected to the sensor element and an outer wing connected to the first lead, and a second peripheral wing comprising an inner wing connected to the sensor element and an outer wing connected to the second lead. An electrically conductive overlay covers at least the outer wings of the first and second peripheral wings and some or all of the first and second electrical leads.

Electrically conductive overlay for head-medium contact sensor

Sliders that include a slider body having an outer side edge, an inner side edge, a trailing edge and a leading edge, and a base; a trailing edge set of features positioned towards the trailing edge of the slider body, the trailing edge set of features having air bearing surfaces, the air bearing surfaces being above the base of the slider body; a leading edge set of features positioned towards the leading edge of the slider body; a gap positioned between the trailing edge set of features and the leading edge set of features, the gap having a gap surface, the gap surface substantially coplanar with the base of the slider body; and a first gap feature and a second gap feature distributed evenly within the gap from the inner side edge to the outer side edge, the first and second gap features each having upper surfaces, the upper surfaces of the first and second gap features being above the base of the slider body but below the air bearing surface of the trailing edge features.

Sliders having features in the mid gap

A sensor supported by a head transducer has a temperature coefficient of resistance (TCR) and a sensor resistance. The sensor operates at a temperature above ambient and is responsive to changes in sensor-medium spacing. Conductive contacts connected to the sensor have a contact resistance and a cross-sectional area adjacent to the sensor larger than that of the sensor, such that the contact resistance is small relative to the sensor resistance and negligibly contributes to a signal generated by the sensor. A multiplicity of head transducers each support a TCR sensor and a power source can supply bias power to each sensor of each head to maintain each sensor at a fixed temperature above an ambient temperature in the presence of heat transfer changes impacting the sensors. A TCR sensor of a head transducer can include a track-oriented TCR sensor wire for sensing one or both of asperities of the medium.

Resistive temperature sensors for improved asperity, head-media spacing, and/or head-media contact detection

A magnetic device including: a magnetic reader; a magnetic writer; and a variable overcoat, the variable overcoat positioned over at least the magnetic reader and writer, the variable overcoat having an overcoat layer, the overcoat layer having a substantially constant thickness and material; and at least one disparate overcoat portion, the disparate overcoat portion having a different thickness, a different material, or both, than the overcoat layer.

Magnetic devices with variable overcoats

A slider of a magnetic recording head has a leading edge, a trailing edge, and an air bearing surface between the leading and trailing edges. A sensor is situated at the trailing edge of the slider and configured to sense presence of a lube droplet or other contaminant at the trailing edge.

Slider trailing edge contamination sensor

A data writer may suspend a transducing head from an actuator. The transducing head can consist of a writer coil positioned proximal a write pole. A protruding signal may be passed through the write coil to contact a data storage medium with the transducing head. A write signal can be passed through the write coil to write a data bit on the data storage medium.

Data writer coil heater

Growing community of inventors

Minneapolis, MN, United States of America

Gary Joseph Kunkel