Lockheed Martin Corporation

Gary H Yan

Gregory T Daly

Richard Joseph Teti

Philip Paul Kraft

Robert E Kuffel

A lead-free solder composition including about 90% to about 99% by weight of a lead-free tin solder based on the total weight of the lead-free solder composition and about 1% to about 10% by weight of a polyhedral oligomeric silsesquioxane based on the total weight of the lead-free solder composition.

Anti-tin whisker solder and method of manufacture thereof

Anti-tin whisker solder

A method for making high density interconnected modules for radio-frequency, digital processing, or other circuits subject to radiated interference includes the step of applying sets of semiconductor chips to individual regions on an insulating flexible substrate. Electrically conductive, planar walls are procured, each having first and second broad surfaces and a through aperture. The through aperture is dimensioned to fit over at least some of the chips of a module. The aperture is registered with the chips to be surrounded, and the wall is placed over the chips. Liquid encapsulant is applied to fill the resulting cavity, thereby encapsulating the chips. HDI interconnections are made, and the modules are separated. The conductive walls define the module dimensions.

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Cherry Hill, NJ, United States of America

Gary H Yan