Freescale Semiconductor,inc.

Motorola Corporation

Nxp Usa, Inc.

Gary G Li

Andrew C McNeil

Yizhen Lin

Daniel N Koury, Jr

Lisa Z Zhang

Todd Frederick Miller

Jonathan Hale Hammond

Aaron A Geisberger

David Joseph Monk

Keith L Kraver

Gary J O'Brien

Dave S Mahadevan

Heinz Loreck

Michael E S Chapman

A micro-electromechanical systems (MEMS) transducer () is adapted to use lateral axis vibration to generate non-planar oscillations in a pair of teeter-totter sense mass structures () in response to rotational movement of the transducer about the rotation axis () with sense electrodes connected to add pickups (e.g.,) diagonally from the pair of sense mass structures to cancel out signals associated with rotation vibration.

Vibration robust x-axis ring gyro transducer

A MEMS sensor () includes a support structure () suspended above a surface () of a substrate () and connected to the substrate () via spring elements (). A proof mass () is suspended above the substrate () and is connected to the support structure () via torsional elements (). Electrodes (), spaced apart from the proof mass (), are connected to the support structure () and are suspended above the substrate (). Suspension of the electrodes () and proof mass () above the surface () of the substrate () via the support structure () substantially physically isolates the elements from deformation of the underlying substrate (). Additionally, connection via the spring elements () result in the MEMS sensor () being less susceptible to movement of the support structure () due to this deformation.

MEMS sensor with stress isolation and method of fabrication

An inertial sensor () includes a drive mass () configured to undergo oscillatory motion and a sense mass () linked to the drive mass (). On-axis torsion springs () are coupled to the sense mass (), the on-axis torsion springs () being co-located with an axis of rotation (). The inertial sensor () further includes an off-axis spring system (). The off-axis spring system () includes off-axis springs (), each having a connection interface () coupled to the sense mass () at a location on the sense mass () that is displaced away from the axis of rotation (). Together, the on-axis torsion springs () and the off-axis spring system () enable the sense mass () to oscillate out of plane about the axis of rotation () at a sense frequency that substantially matches a drive frequency of the drive mass ().

Inertial sensor with off-axis spring system

A MEMS device () includes a proof mass () coupled to and surrounding an immovable structure (). The immovable structure () includes fixed fingers () extending outwardly from a body () of the structure (). The proof mass () includes movable fingers (), each of which is disposed between a pair () of the fixed fingers (). A central area () of the body () is coupled to an underlying substrate (), with the remainder of the immovable structure () and the proof mass () being suspended above the substrate () to largely isolate the MEMS device () from package stress, Additionally, the MEMS device () includes isolation trenches () and interconnects () so that the fixed fingers (), the fixed fingers (), and the movable fingers () are electrically isolated from one another to yield a differential device configuration.

MEMS device with central anchor for stress isolation

A microelectromechanical systems (MEMS) sensor () includes a substrate () and a suspension anchor () formed on a planar surface () of the substrate (). A first folded torsion spring () and a second folded torsion spring () interconnect the movable element () with the suspension anchor () to suspend the movable element () above the substrate (). The folded torsion springs () are each formed from multiple segments () that are linked together by bar elements () in a serpentine fashion. The folded torsion springs () have an equivalent shape and are oriented relative to one another in rotational symmetry about a centroid () of the suspension anchor ().

MEMS sensor with folded torsion springs

A microelectromechanical systems (MEMS) sensor () includes a substrate () a movable element () spaced apart from the substrate (), suspension anchors () formed on the substrate (), and compliant members () interconnecting the movable element () with the suspension anchors. The MEMS sensor () further includes fixed fingers () and fixed finger anchors () attaching the fixed fingers () to the substrate (). The movable element () includes openings (). At least one of the suspension anchors resides in at least one of the multiple openings () and pairs () of the fixed fingers () reside in other multiple openings (). The MEMS sensor () is symmetrically formed, and a location of the fixed finger anchors () defines an anchor region () within which the suspension anchors () are positioned.

Semiconductor device with reduced sensitivity to package stress

A transducer packageincludes a substratehaving a first axis of symmetryand a second axis of symmetryarranged orthogonal to the first axis of symmetry. At least a first sensorand a second sensoreach of which are symmetrically arranged on the substraterelative to one of the first and second axes of symmetryand.The first and second sensorsandare adapted to detect movement parallel to the other of the first and second axes of symmetryand. The first sensoris adapted to detect movement over a first sensing range and the second sensoris adapted to detect movement over a second sensing range, the second sensing range differing from the first sensing range.

Multiple axis transducer with multiple sensing range capability

A gyro sensor configured to sense an angular rate about a rotational axis includes a drive mass configured to undergo oscillatory linear motion within a plane, and a sense mass configured to undergo an oscillatory motion out of the plane as a function of the angular rate. A link spring component connects the sense mass to the drive mass such that the sense mass is substantially decoupled from the drive mass with respect to the oscillatory linear motion of the drive mass, but is coupled to the drive mass with respect to the oscillatory motion out of the plane of the sense mass.

Methods and apparatus for a MEMS gyro sensor

MEMS devices () and methods for forming the devices have now been provided. In one exemplary embodiment, the MEMS device () comprises a substrate () having a surface, an electrode () having a first portion coupled to the substrate surface, and a second portion movably suspended above the substrate surface, and a stress-release mechanism () disposed on the electrode second portion, the stress-release mechanism () including a first slot () integrally formed in the electrode. In another exemplary embodiment, the substrate () includes an anchor () and the stress-release mechanismis formed adjacent the anchor ().

Stress release mechanism in MEMS device and method of making same

A lead frame () for a packaged electronic device having split flag structures () coupled by support structures (). The support structures include bend portions () for providing stress relief between the flag structures during the manufacture and/or during the operation of a packaged electronic device (). In one embodiment, the packaged electronic device includes an inertial sensor ().

Lead frame with flag support structure

A proof mass () for a MEMS device is provided herein. The proof mass comprises a base () comprising a semiconductor material, and at least one appendage () adjoined to said base by way of a stem (). The appendage () comprises a metal () or other such material that may be disposed on a semiconductor material (). The metal increases the total mass of the proof mass () as compared to a proof mass of similar dimensions made solely from semiconductor materials, without increasing the size of the proof mass. At the same time, the attachment of the appendage () by way of a stem () prevents stresses arising from CTE differentials in the appendage from being transmitted to the base, where they could contribute to temperature errors.

Method of adding mass to MEMS structures

A transducer is provided herein which comprises an unbalanced proof mass (), and which is adapted to sense acceleration in at least two mutually orthogonal directions. The proof mass () has first () and second () opposing sides that are of unequal mass.

Growing community of inventors

Gilbert, AZ, United States of America

Gary G Li