International Business Machines Corporation

Gary E O'Neil

Michael E Stopford

James B Tate

Martin P Goetz

Brian Ashley Carpenter

Trieu Can Chieu

Anand Narasimhan

Li-Cheng Richard Zai

Russell Alan Resnick

Anthony P Ferranti

Chester Robert Burroughs

Edward D Doan

A method and system for efficiently extending the operating temperature range of high power components within a system/device. An embedded monitor measures local temperatures such as junction temperatures of components. When the measured temperature is less than the lowest operational temperature threshold of the component, temperature control logic initiates pre-heating to raise the component's temperature to an operational level, utilizing a heating source. The component (or device) is made operational only when the temperature is at or above the operational level. The temperature control logic maintains the operational temperature of the component using the high power dissipated by components within the operating system/device as a self heating source. If self heating is unable to maintain the operational temperature, the heating source is utilized to assist in maintaining the component's operational temperature, and thereby extends the useable operational temperature range of the system in which the components are employed.

Extending the operating temperature range of high power devices

During manufacture of an electronic device, an aerogel coating is applied to a first side of an IC substrate of a first IC. A bonding procedure is initiated, during which IC interconnects are either placed on the coated side of the substrate or on the opposite side of the substrate. The first IC is connected on a carrier to a second IC with the coated side of the first IC facing the second IC to reduce heat transmission to the second IC during operation of the first IC. The aerogel coating reduces thermal stress to the circuit board and surrounding components, reduces the risk of overheating of critical circuit components, provides chemical and mechanical insulation from contamination during subsequent wafer handling operations, and provides a thermal isolator between IC regions of dissimilar power dissipation, which isolator facilitates efficient thermal extraction from localized hotspots.

Electronic device with aerogel thermal isolation

A method induces augmented levels of heat dissipation by exploiting quiescent IC leakage currents to control the temperature in high power devices. A heat control and temperature monitoring system (HCTMS) utilizes a thermal sensor to sense the junction temperature of a component, which becomes self-heated due to the quiescent leakage current inherent to the component upon the application of power to the component. By increasing the voltage level of the power source, this quiescent self-heating property is augmented, which serves to accelerate the preheating of the device, until the temperature rises above the minimum specified operating temperature of the component. The method further includes reliably initializing the system by applying full system power and triggering a defined initialization sequence/procedure. Once the component is operational, the method includes maintaining the component's temperature above the minimum operating threshold via continued self-heating, continued augmentation of the applied DC voltage, or both, where required.

Utilization of overvoltage and overcurrent compensation to extend the usable operating range of electronic devices

A method and system for inducing augmented levels of heat dissipation by exploiting quiescent IC leakage currents to control the temperature in high power devices. A heat control and temperature monitoring system (HCTMS) utilizes a thermal sensor to sense the junction temperature of a component, which becomes self-heated due to the quiescent leakage current inherent to the component upon the application of power to the component. By increasing the voltage level of the power source, this quiescent self-heating property is augmented, which serves to accelerate the preheating of the device, until the temperature rises above the minimum specified operating temperature of the component. The system is then reliably initialized by applying full system power and triggering a defined initialization sequence/procedure. Once the component is operational, the component's temperature is maintained above the minimum operating threshold via continued self-heating, continued augmentation of the applied DC voltage, or both, as is required.

Method for manufacturing an electronic device

The present invention provides an aircraft collision alarm system and method. The method includes the steps of collecting aircraft position information for aircraft in a given area and digitally encoding this aircraft position information. This aircraft position information is then transmitted on an audio sub-carrier over the voice communications channel of a VOR to the aircraft. The aircraft receives and processes the digitally encoded information and alerts the pilot if a collision alarm situation is present.

Aircraft collision avoidance alarm

A method and system for utilizing the heat dissipated by quiescent IC leakage currents to control the start-up temperature of components. A temperature control sub-system utilizes a thermal sensor to sense the junction temperature of the component. When the temperature is below an operating threshold, the control sub-system applies power to the component, and the component is self-heated due to the quiescent leakage current inherent to the component. This quiescent self-heating property serves as a source of pre-heat to elevate the temperature of the component, until the temperature, as indicated by the thermal sensor, rises above the minimum specified operating temperature of the component. The system may then be reliably initialized by applying full system power, and triggering a hardware reset or defined initialization sequence/procedure. Once the component(s) is operational, self-heating continues to maintain the component's temperature above the minimum operating threshold.

Method for pre-heating high power devices to enable low temperature start-up and operation

A modular electronic apparatus, in particular a mobile client system, in which a fully functional handheld computing system can be selectively integrated with a fully functional handheld communications system. Each system is provided with battery supported power supply, to enable the separate functionality of each system, and a particular cooperation between the power supplies of the two systems, when integrated, is achieved. Optimization of the battery supported power supplies for two systems (here, the computer and communications systems) is thus achieved, while accommodating the integrated use of the systems.

Modular electronic apparatus with battery charging control

Direct communication between a primary portable unit initiating the communication and a secondary portable unit is established utilizing two handshaking operations. The first handshaking operation is performed in the base station channel to establish initial contact between the primary and secondary portable units. After initial contact is made, the second handshaking operation is performed to establish communication in an unoccupied channel. The base station channel and the unoccupied channel may be a TDMA/TDD channel or a TDMA/FDD channel.

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Raleigh, NC, United States of America

Gary E O'Neil