Keyssa, Inc.

Vitesse Semiconductor Corporation

Waveconnex, Inc.

Molex Corporation

Gary Davis McCormack

Ian A Kyles

Roger Dwain Isaac

Emilio A Sovero

John Wolcott

Eric Almgren

Steve Novak

Frederick George Weiss

Eric Sweetman

Bojana Zivanovic

Angus J McCamant

Norbert Seitz

Christopher Scott Sansom

Ronald F Talaga, Jr

Bhupendra Sarhad

Kenneth R Kveton

Michael A Bourdess

Anthony Michael Fadell

Yanghyo Kim

Richard R Suter

Mariel Van Tatenhove

Norbert J Seitz

Lex Alan Kosowsky

Srikanth Gondi

Ken Kveton

Mike Bourdess

Roger Issac

A scalable, high-bandwidth connectivity architecture for portable storage devices and memory modules may utilize EHF communication link chip packages mounted in various two-dimensional and three-dimensional configurations on planar surfaces such as printed circuit boards. Multiple electromagnetic communication links between devices distributed on major faces of card-like devices may be provided with respectively aligned pairs of communication units on each device. Adjacent communication units on a printed circuit board may transmit or receive electromagnetic radiation having different polarization, such as linear or elliptical polarization. Power and communication between communication devices may both be provided wirelessly.

Scalable high-bandwidth connectivity

Embodiments discussed herein refer to systems, methods, and circuits for establishing EHF contactless communications links. The EHF contactless communication link may serve as an alternative to conventional board-to-board and device-to-device connectors. The link may be a low-latency protocol-transparent communication link capable of supporting a range of data rates. The link may be established through a close proximity coupling between devices, each including at least one EHF communication unit. Each EHF unit involved in establishing an EHF communication link may progress through a series of steps before data can be transferred between the devices. These steps may be controlled by one or more state machines that are being implemented in each EHF communication unit.

Extremely high frequency systems and methods of operating the same

Tightly-coupled near-field transmitter/receiver pairs are deployed such that the transmitter is disposed at a terminal portion of a first conduction path, the receiver is disposed at a terminal portion of a second conduction path, the transmitter and receiver are disposed in close proximity to each other, and the first conduction path and the second conduction path are discontiguous with respect to each other. In some embodiments of the present invention, close proximity refers to the transmitter antenna and the receiver antenna being spaced apart by a distance such that, at wavelengths of the transmitter carrier frequency, near-field coupling is obtained. In some embodiments, the transmitter and receiver are disposed on separate substrates that are moveable relative to each other. In alternative embodiments, the transmitter and receiver are disposed on the same substrate.

Tightly-coupled near-field communication-link connector-replacement chips

A communication device employs a contactless secure communication interface to transmit and receive data with a computing device using close proximity extremely high frequency (EHF) communication. The communication device and the computing device periodically initiate a discovery operation mode, whereby the devices periodically transmit identifying information about the respective devices and listen for identifying information from the other device. Upon completion of the discovery mode operation, the devices enter a link-training operation mode and exchange capability information about the respective devices. During transport mode operation the communication device employs methods to manage access to data stored on the communication device by encrypting the data using one or a combination of training information or capability information as a basis for generating an encryption key.

EHF secure communication device

A Physical Layer (PHY) of a host system of an electronic device may be implemented as a contactless PHY (cPHY) for extremely high frequency (EHF) contactless communication and the operation of EHF transmitters (TX), receivers (RX) and transceivers (EHF-XCVR) in an extremely high frequency integrated circuit (EHF IC) of the electronic device. The Host-cPHY translates logical communications requests from the Link Layer (LINK) into hardware-specific operations to affect transmission or reception of signals over an EHF contactless link. The Link Layer (LINK) may also be optimized as a contactless Link Layer (cLINK) for EHF contactless communication. A virtualized contactless Physical Layer (VcPHY) may comprise a contactless Physical Layer (Host-cPHY), and a contactless Link Layer (cLINK) for coupling a conventional Link Layer (LINK) with the contactless Physical Layer (Host-cPHY). Multiple data streams may be transported over the EHF contactless link over a range of frequencies.

Virtualized physical layer adapted for EHF contactless communication

An electronic device may include a dielectric substrate, an electronic circuit supported by the substrate, for processing data, and a communication unit having an antenna. The communication unit may be mounted to the substrate in communication with the electronic circuit for converting between a first EHF electromagnetic signal containing digital information and a data signal conducted by the electronic circuit. The electromagnetic signal may be transmitted or received along a signal path by the antenna. An electromagnetic signal guide assembly may include a dielectric element made of a dielectric material disposed proximate the antenna in the signal path. The electromagnetic signal guide may have sides extending along the signal path. A sleeve element may extend around the dielectric element along sides of the dielectric element. The sleeve element may impede transmission of the electromagnetic signal through the sides of the dielectric element.

Wireless communication with dielectric medium

A system for transmitting or receiving signals may include a dielectric substrate having a major face, a communication circuit, and an electromagnetic-energy directing assembly. The circuit may include a transducer configured to convert between RF electrical and RF electromagnetic signals and supported in a position spaced from the major face of the substrate operatively coupled to the transducer. The directing assembly may be supported by the substrate in spaced relationship from the transducer and configured to direct EM energy in a region including the transducer and along a line extending away from the transducer and transverse to a plane of the major face.

Redirection of electromagnetic signals using substrate structures

Data may be transferred from a communication subsystem of a first device to a communication subsystem of a second device contactlessly, at high speed, and without intervention by host processors of either device. Devices may be programmed or personalized at the factory or warehouse, and may personalized at a warehouse or at a point of sale while in the box. Various modes of operation and use scenarios are described. Portions of the devices themselves, or a transmission path between the devices may be shielded against snooping by a material which degrades an EHF signal passing therethrough.

Contactless data transfer systems and methods

A contactless, electromagnetic (EM) replacement for cabled Standards-based interfaces (such as USB, I2S) which handles data transfer requirements associated with the Standard, and capable of measuring and replicating relevant physical conditions on data lines so as to function compatibly and transparently with the Standard. A contactless link between devices having transceivers. A non-conducting housing enclosing the devices. A dielectric coupler facilitating communication between communications chips. Conductive paths or an inductive link providing power between devices. An audio adapter communicates over a contactless link with a source device, and via a physical link with a destination device such as a conventional headset. Power may be provided to the adapter from the source device, and by the adapter to the destination device.

Full duplex contactless communication systems and methods for the use thereof

'Smart' connectors with embedded processors, measurement circuits and control circuits are disclosed for establishing a 'contactless' radio frequency (RF) electromagnetic (EM) Extremely High Frequency (EHF) communications link between two electronic devices having host systems. The connectors are capable of monitoring, controlling, and directing (managing) link operation to dynamically adapt to conditions, as well as monitoring and altering (or modifying) data passing through the connector, and selecting a protocol suitable for a communications session. The connectors are capable of identifying the type of content being transferred, providing authentication and security services, and enabling application support for the host systems based on the type of connection or the type of content. The connectors may operate independently of the host systems, and may perform at least one of sensing proximity of a nearby object; detecting a shape of a nearby object; and detecting vibrations.

Smart connectors and associated communications links

A Physical Layer (PHY) of a host system of an electronic device may be implemented as a contactless PHY (Host-cPHY) for extremely high frequency (EHF) contactless communication and the operation of EHF transmitters (TX), receivers (RX) and transceivers (EHF-XCVR) in an extremely high frequency integrated circuit (EHF IC) of the electronic device. The Host-cPHY translates logical communications requests from the Link Layer (LINK) into hardware-specific operations to affect transmission or reception of signals over an EHF contactless link). The Link Layer (LINK) may also be optimized as a contactless Link Layer (cLINK) for EHF contactless communication. Multiple data streams may be transported over the EHF contactless link over a range of frequencies.

Physical layer adapted for EHF contactless communication

A computing device includes an integrated unit having a plurality of functional components, and an extremely high frequency (EHF) communication unit operatively coupled to the integrated unit. The EHF communication unit includes a transducer configured to transmit and receive EHF electromagnetic signals, and convert between electrical signals and electromagnetic signals. The computing device includes a transceiver operatively coupled to the transducer. The EHF communication unit may enable at least one of the functional components of the computing device to be supplemented by a functional component of an external computing device.

Growing community of inventors

Tigard, OR, United States of America

Gary Davis McCormack