Applied Nanostructures, Inc.

Kevex Corporation

Gary D Aden

Josiah F Willard

Ami Chand

Jeremy J Goeckeritz

A calibration device including a thermal sensing device, and a reference heater, where the heater and the sensing device are integrated together, the heater and the sensing have at least one dimension substantially in common, and the over all dimensions are in the range of thermal micro probes, 100 nm-500 microns.

Micro heater integrated with thermal sensing assembly

A scanning probe assembly having a nanometer sensor element defined at a tip apex and its method of fabrication using micro-electromechanical systems (MEMS) processing techniques. The assembly comprises a probe body, a cantilever extending outward, and a hollow tip at the end of the cantilever. A first conductive material is disposed on the hollow tip, followed by a dielectric layer thus embedding the conductive layer. A nanometer hole is milled through the tip, first conductor and dielectric materials. A metal sensor element is deposited by means of electrochemical deposition in the through-hole. A second conductor is deposited on a lower layer. The first and second conductors form electrical connections to the sensor element in the tip. The intra-tip metal, in combination with other layers, may form a thermocouple, thermistor, Schottky diode, ultramicroelectrode, or Hall Effect sensor, and used as a precursor to grow spikes such a nanotubes.

Vertical embedded sensor and process of manufacturing thereof

In an electron beam lithography system, a layer of photoresist is exposed in vacuum by a collimated flood beam of electrons passing through an electron mask in nominal contact with the photoresist to define the exposed images. The electron mask includes a mask wafer apertured to define one or more frames supporting one or more panes of electron permeable membrane material having an average atomic number less than 14 and each supporting a patterned layer of electron absorbing material defining the mask patterns. Suitable electron permeable membrane materials include BN, BC, SiC, Si.sub.3 N.sub.4 and Al.sub.4 C.sub.3 of a thickness of 0.1 .mu.m to 2 .mu.m.

Growing community of inventors

Redwood City, CA, United States of America

Gary D Aden