Meta Platforms Technologies, LLC

Zarlink Semiconductor Limited

Gary Charles Day

Paul Ronald Stribley

Jun-Youn Kim

Mohsin Aziz

Abdul Shakoor

Bo Goran Alestig

A micro-LED device and a method of fabricating the micro-LED device are disclosed. The method includes processing from a first side (e.g., p-side) of epitaxial layers of a micro-LED wafer to form individual mesa structures and a first solid metal bonding layer on the mesa structures, bonding a second solid metal bonding layer on a backplane wafer to the first solid metal bonding layer of the micro-LED wafer, removing the substrate of the micro-LED wafer and processing from a second side (e.g., n-side) of the epitaxial layers to isolate the solid metal bonding layers and form individual electrodes (e.g., anodes) for individual micro-LEDs, forming a dielectric material layer on surfaces in regions between the mesa structures, and depositing one or more metal materials in the regions between the mesa structures to form mesa sidewall reflectors and a common electrode for the micro-LEDs.

Small-pitch micro-LEDs

An integrated circuit capacitor and an integrated circuit are provided. The integrated circuit capacitor includes at least first, second and third conducting plates. The first conducting plate is positioned between the second and third plates. A first dielectric layer is positioned between the first and third conducting plates. A second dielectric layer is positioned between the first and second conducting plates. An 'overlap portion' of the second conducting plate extends beyond the edge of the first conducting plate and towards the third conducting plate. The capacitor is arranged so that the electrical breakdown voltage between the overlap portion and the third conducting plate is lower than the electrical breakdown voltage between the first and second conducting plates.

Large value, compact, high yielding integrated circuit capacitors

Growing community of inventors

Plymouth, United Kingdom

Gary Charles Day