Dpa Labs, Incorporated

Gary Bivins

Philip L Young

Scott McDaniel

Huong Kim Lam

Douglas Young

William S Ditto

A process to remove a semiconductor die from a plastic package and then to reassemble the die in a high reliability hermetic package. The process is used to remove an already existing die using a unique disassembly and etching process and make the removed die more reliable by reattaching the die and rebonding all new die wires into either a hermetic package or a different type of package with a &ldquo;bond-on-top-of-bond&rdquo; technique. The original bondfoot on the removed die may be first preconditioned by a novel bond-flattening tool, which can be attached to the bond-head chuck of any wirebonder. Also, the die can be used in other applications with different pin-outs or configurations.

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Tujunga, CA, United States of America

Gary Bivins