Intel Corporation

Gary Baxter Long

Gary A Brist

William O Alger

Daryl A Sato

Jayne L Mershon

Carlos Mejia

Bryce D Horine

Michael W Beckman

Sanka Ganesan

Donald Tiendung Tran

Dennis J Miller

Timothy M Swettlen

David I Amir

Jill D Murfin

William Alger

Charles Mejia

Stacked flex cable assemblies and their manufacture are described. One assembly includes a first flex cable and a second flex cable electrically coupled to the first flex cable. The assembly also includes a connector electrically coupled to the first flex cable. The first flex cable is positioned between the connector and the second flex cable. Other embodiments are described and claimed.

Interconnect architecture with stacked flex cable

A method of making a printed circuit board panel, a printed circuit board panel made according to the method, and a system incorporating a printed circuit board provided onto the panel. The printed circuit board panel has a panel top edge, a panel bottom edge parallel to the panel top edge, and two parallel panel side edges, and further includes a first set of fiber bundles extending at the predetermined angle with respect to the panel side edges, and a second set of fiber bundles extending at the predetermined angle with respect to the panel top edge.

Method of making a fiber reinforced printed circuit board panel and a fiber reinforced panel made according to the method

An apparatus that includes a plurality of metalized planes, one or more dielectric layers separating the plurality of metalized planes; and one or more conductive trenches connecting to at least one of the plurality of metalized planes.

Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery

Method of power-ground plane partitioning to utilize channel/trenches

The invention provides an optical connection between a component on a printed circuit board ('PCB') and an optical fiber embedded in the PCB. By optically connecting the component with the optical fiber, the component may use the optical fiber for high speed optical data communication.

Connecting a component with an embedded optical fiber

The invention provides an optical connection between a component on a printed circuit board ('PUB') and an optical fiber embedded in the PCB. By optically connecting the component with the optical fiber, the component may use the optical fiber for high speed optical data communication.

A method, apparatus, and system for a printed circuit board (PCB) and package with an embedded air dielectric includes a conductor formed on a surface of a first core layer, a conductor layer overlaying an inner surface of a cavity formed in a second core layer, the conductor layer opposing the conductor, and a sealed air channel between and separating the conductor and the conductor layer from contacting each other. A gas in the sealed air channel provides a primary dielectric therein. The gas may be air.

Apparatus and method for an embedded air dielectric for a package and a printed circuit board

A method and apparatus for reducing timing skew between conductor traces. A dielectric medium made of a resin reinforced with a fabric is provided. The fabric includes a first plurality of yarns running parallel to a first axis and a second plurality of yarns running parallel to a second axis. The first plurality of yarns are separated by a first weave pitch and the second plurality of yarns separated by a second weave pitch. At least two conductor traces are formed on the dielectric medium. The conductor traces are positioned on the dielectric medium such that the conductor traces each have substantially similar effective dielectric constants.

Conductor trace design to reduce common mode cross-talk and timing skew

A method for forming a plurality of metalized planes, one or more dielectric layers separating the plurality of metalized planes; and one or more conductive trenches connecting to at least one of the plurality of metalized planes.

Method for creating power-ground plane partitioning and via connection to utilize channel/trenches for power delivery

A compressible domed contact used as a portion of socket contact within an electrical socket to eliminate co-planarity issues and to achieve an effective electrical connection between the electrical socket and a microelectronic device. The compressible domed contact may be made of resilient material such that it will substantially return to its original shape after being compressed.

Electrical socket with compressible domed contacts

Formation of a mixed-material composition through diffusion using photo-thermal energy. The diffusion may be used to create electrically conductive traces. The diffusion may take place between material layers on one of a package substrate, semiconductor substrate, substrate for a printed circuit board (PCB), or other multi-layered substrate. The photo-thermal energy may be supplied by various devices, for example a YAG laser device, COlaser device, or other energy source.

Photo-thermal induced diffusion

Formation of a mixed-material composition through diffusion using photo-thermal energy. The diffusion may be used to create electrically conductive traces. The diffusion may take place between material layers on one of a package substrate, semiconductor substrate, substrate for a printed circuit board (PCB), or other multilayered substrate. The photo-thermal energy may be supplied by various devices, for example a YAG laser device, COlaser device, or other energy source.

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Aloha, OR, United States of America

Gary Baxter Long