Macdermid, Incorporated

Other

Ppg Industries, Inc.

Macdermid, Incorprated

Gary B Larson

Donald R Ferrier

Steven A Castaldi

Jon E Bengston

Stanley J Ruszczyk

Peter E Kukanskis

Raymond A Letize

John L Cordani

William J Decesare

Ann S Williams

Cynthia Retallick

Donald P Cullen

Donna Kologe

Edward T Donlon

Brian Jobson

James A Johnson

Lance C Sturni

John J Grunwald

William R Adams

Mark Wojtaszek

James Watkowski

Donna M Kologe

Maria Nikolova

Richard L Kremer

William Schweikher

Clyde Newcomer

Daniel Gallegos

Austin Wells

An aqueous acidic copper electroplating composition containing an improved additive system for use at elevated temperatures. The improved additive system comprises (a) a suppressor comprising at least one high molecular weight polymer; (b) a brightener comprising at least one divalent sulfur compound; and (c) a leveler comprising a heterocyclic nitrogen compound. The improved electroplating composition is usable for plating through holes in printed circuit boards.

Acid copper electroplating bath composition

The present invention is directed to an improved method for metallizing polymer substrates, such as polyimides. The present invention comprises the steps of surface treating the polymer substrate with a plasma jet or corona discharge surface treatment, conditioning and etching the polymer substrate with an etching solution comprising a hydroxide and ionic palladium, activating the polymer substrate with ionic palladium, reducing the palladium on the polymer substrate, plating an electroless nickel layer onto the prepared polymer substrate, and plating an electroless copper layer over the electroless nickel layer. The process of the invention provides an improved method for preparing the polymer substrate for subsequent electrolytic plating thereon.

Polyimide substrate and method of manufacturing printed wiring board using the same

The present invention relates to a process for the manufacture of printed circuit boards. The method contemplates a novel processing sequence for this manufacturing process which method is particularly versatile in reducing the number of steps and variety of chemicals currently necessary to produce the circuit boards.

Process for the manufacture of printed circuit boards

A process is revealed whereby resistors can be manufactured integral with the printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are revealed as techniques for improving the uniformity and consistency of the plated resistors.

Method for the manufacture of printed circuit boards with plated resistors

This invention proposes the use of an activator solution comprising precious metal ions and an oxidizing agent for the selective activation and plating of metallic surfaces. The invention is particularly useful in plating exposed copper surfaces on printed circuit boards without substantial extraneous plating on the soldermask surfaces.

Composition and method for selective plating

Composition and methods for providing a phosphate conversion coating on a metal surface, particularly a copper surface, characterized in that the phosphating composition includes at least one composition-soluble compound containing vanadium, niobium, tungsten or tantalum. The phosphate conversion coatings so produced are thicker, more durable and more uniform than those produced by known phosphating compositions. The compositions and processes are especially useful for providing a passivating/uniformizing coating layer on copper surfaces to which organic resin is thereafter deposited to serve as a resist in printed circuit fabrication sequences, particularly when the organic resin is an electrophoretically deposited organic resin. Also described is the microetching of copper surfaces with a phosphoric acid/peroxide microetchant preparatory to deposit thereon (or after a further provision of a phosphate conversion coating) of a photoresist which is then imagewise exposed and developed to provide a patterned resist.

Phosphating compositions and processes, particularly for use in

The present invention relates to a process for the manufacture of printed circuit boards. The method contemplates the use of electroless nickel as the primary medium for interconnection, for building circuitry to the desired thickness and as an etch resist. The method is particularly versatile in reducing the number of steps and variety of chemicals currently necessary to produce these circuit boards.

Method for the manufacture of printed circuit boards

Disclosed is a composition and process for the surface treatment of metallic surfaces, which comprises treating said surface in an aqueous solution comprising a benzimidazole compound having either a halogenated phenyl group, a halogenated benzyl group or a halogenated ethyl phenyl group in the 2-position.

Composition and process for treatment of metallic surfaces

A patterned mask is provided on a surface by formulating a liquid, 100% solids-type thermally curable mask composition, applying the composition as a film to the surface, selectively thermally exposing the film in the desired mask pattern using a focused beam of heat energy without use of an interposed patterned mask, and then developing away the film areas not thermally exposed so as to produce a patterned mask. The invention enables the elimination of potentially troublesome volatile solvent carriers or diluents from the composition, while at the same time still enabling production of finely-defined patterns without having to bring a patterned mask (cf. phototool) into contact with the composition. Similarly, the expense involved with use of dry film photo-sensitive masks is avoided.

Method for forming a patterned mask

For attaining adhesion between copper circuitry innerlayers and pre-preg layers in a multilayer printed circuit, a conversion coating of copper oxide is provided on the metallic copper surfaces in a manner which develops an altered topography of the underlying metallic copper surfaces. Thereafter, a controlled dissolution and removal of a substantial amount of the copper oxide is effected, in a manner which does not adversely affect the already-developed topography of the underlying metallic copper, and such that the innerlayer, at the time of assembly with the pre-preg layers, has copper surfaces consisting of the topographically altered metallic copper and a relatively small amount of copper oxide thereon. Excellent bonding strengths are achieved with decreased incidence of pink ring formation as compared to conventional processes utilizing copper oxide for adhesion promotion.

Process for fabricating multilayer printed circuits

Copper surfaces upon which organic resins are electrophoretically deposited to serve as plating or etch resists in the course of manufacturing printed circuits, are preliminarily provided with a uniformizing/passivating coating layer, such as a layer of copper oxide or phosphate conversion coating, over which the organic resin is electrophoretically deposited, resulting in the organic resin being deposited with substantial uniformity in thickness and properties.

Process for the manufacture of printed circuits using

For attaining adhesion between copper circuitry innerlayers and pre-preg layers in a multilayer printed circuit, a conversion coating of copper oxide is provided on the metallic copper surfaces in a manner which develops an altered topography of the underlying metallic copper surfaces. Thereafter, a controlled dissolution and removal of a substantial amount of the copper oxide is effected, in a manner which does not adversely affect the already-developed topography of the underlying metallic copper, and such that the innerlayer, at the time of assembly with the pre-preg layers, has copper surfaces consisting of the topographically altered metallic copper and a relatively small amount of copper oxide thereon. Excellent bonding strengths are achieved with decreased incidence of pink ring formation as compared to conventional processes utilizing copper oxide for adhesion promotion. In addition, the copper ion containing solutions resulting from the controlled dissolution and removal of copper oxide can be economically utilized in formulating electroless copper plating baths.

Growing community of inventors

Cheshire, CT, United States of America

Gary B Larson