H.c. Starck Gmbh

H.c. Starck Solutions Euclid, LLC

H.c. Stark Inc.

H.c. Starck Place

Gary Alan Rozak

Mark E Gaydos

Patrick Hogan

Shuwei Sun

Steven Alfred Miller

Prabhat Kumar

Maria Bozena Winnicka

Joseph Hirt

David Meendering

Brad Lemon

Timothy Welling

Jerome O'Grady

James G Daily, Iii

Michael Thomas Stawovy

David B Smathers

Rong-Chein Richard Wu

Rong-chein Richard Wu

David G Schwartz

Christopher A Michaluk

Peter R Jepson

Francois-Charles Dary

Richard Wu

Norman C Mills

Stefan Zimmermann

Scott Jeffrey Volchko

Barbara L Cox

Yen-Te Lee

Qi Zhang

William Loewenthal

Steve Miller

Charles Wood

Patrick Alan Hogan

Maria B Winnicka

Davd G Schwarz

David G Schwarz

Glen Zeman

John A Shields

Charles B Wood

James G Iii Daily

Jerone O´Grady

The invention is directed at sputter targets including 50 atomic % or more molybdenum, a second metal element of niobium or vanadium, and a third metal element selected from the group consisting of titanium, chromium, niobium, vanadium, and tantalum, wherein the third metal element is different from the second metal element, and deposited films prepared by the sputter targets. In a preferred aspect of the invention, the sputter target includes a phase that is rich in molybdenum, a phase that is rich in the second metal element, and a phase that is rich in the third metal element.

Molybdenum containing targets

A sputtering target that includes at least two consolidated blocks, each block including an alloy including molybdenum in an amount greater than about 30 percent by weight and at least one additional alloying ingredient; and a joint between the at least two consolidated blocks, the joint being free of any microstructure due to an added bonding agent (e.g., powder, foil or otherwise), and being essentially free of any visible joint line the target that is greater than about 200 &#x3bc;m width (e.g., less than about 50 &#x3bc;m width). A process for making the target includes hot isostatically pressing, below a temperature of 1080&#xb0; C., consolidated perform blocks that may be surface prepared (e.g., roughened to a predetermined roughness value) prior to pressing.

Multi-block sputtering target and associated methods and articles

Sputtering targets including molybdenum, niobium and tantalum are found to be useful for sputtering films for electronic devices. Sputtering targets with about 88 to 97 weight percent molybdenum show improved performance, particularly with respect to etching, such as when simultaneously etching an alloy layer including the Mo, Nb, and Ta, and a metal layer (e.g., an aluminum layer). The targets are particularly useful in manufacturing touch screen devices.

Sputtering targets and devices including Mo, Nb, and Ta, and methods

In various embodiments, metallic wires are fabricated by combining one or more powders of substantially spherical metal particles with one or more powders of non-spherical particles within one or more optional metallic tubes. The metal elements within the powders (and the one or more tubes, if present) collectively define a high entropy alloy of five or more metallic elements or a multi-principal element alloy of four or more metallic elements.

Fabrication of high-entropy alloy wire and multi-principal element alloy wire

In various embodiments, additive manufacturing is utilized to fabricate three-dimensional metallic parts using metallic alloy wire as a feedstock material.

Additive manufacturing utilizing metallic wire

A sputtering target that includes at least two consolidated blocks, each block including an alloy including a first metal (e.g., a refractory metal such as molybdenum in an amount greater than about 30 percent by weight) and at least one additional alloying ingredient; and a joint between the at least two consolidated blocks, the joint being prepared free of any microstructure derived from a diffusion bond of an added loose powder. A process for making the target includes hot isostatically pressing (e.g., below a temperature of 1080&#xb0; C.), consolidated preform blocks that, prior to pressing, have interposed between the consolidated powder metal blocks at least one continuous solid interface portion. The at least one continuous solid interface portion may include a cold spray body, which may be a mass of cold spray deposited powders on a surface a block, a sintered preform, a compacted powder body (e.g., a tile), or any combination thereof.

Multi-block sputtering target with interface portions and associated methods and articles

The invention is directed at sputter targets including 50 atomic % or more molybdenum, a second metal element of titanium, and a third metal element of chromium or tantalum, and deposited films prepared by the sputter targets. In a preferred aspect of the invention, the sputter target includes a phase that is rich in molybdenum, a phase that is rich in titanium, and a phase that is rich in the third metal element.

In various embodiments, a precursor powder is pressed into an intermediate volume and chemically reduced, via sintering, to form a metallic shaped article.

Metallic crucibles and methods of forming the same

Touch screen device comprising Mo-based film layer and methods thereof

In various embodiments, sputtering targets are formed by introducing molybdenum powder into a sheet bar mold, pressing the powder to form a sheet bar, sintering the sheet bar to form an ingot having a density of at least 90% of a theoretical density, preheating the ingot, rolling the ingot to form a plate, and heat treating the plate.

Methods of forming molybdenum sputtering targets

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Akron, OH, United States of America

Gary Alan Rozak