Sandia Corporation

Gary A Patrizi

Roy H Olsson

Randy J Shul

Christopher Nordquist

Thomas A Plut

Rajen Chanchani

Tracy C Peterson

Catalina Ahlers

In wafer-level packaging of microelectromechanical (MEMS) devices a lid wafer is bonded to a MEMS wafer in a predetermined aligned relationship. Portions of the lid wafer are removed to separate the lid wafer into lid portions that respectively correspond in alignment with MEMS devices on the MEMS wafer, and to expose areas of the MEMS wafer that respectively contain sets of bond pads respectively coupled to the MEMS devices.

MEMS packaging with etching and thinning of lid wafer to form lids and expose device wafer bond pads

Growing community of inventors

Albuquerque, NM, United States of America

Gary A Patrizi