Motorola Corporation

Gary A Humbert

Ross P Goodwin

Robert W Lela

Electromagnetic shielding apparatus for portable telephones (300) and other electronic equipment, includes shield clips (100) for intercoupling the conductive surfaces of a housing (302 and 303) to the metal layer (205) of the circuit board (200). Each shield clip (100) mates with a corresponding edge (204) of the circuit board (200) such that tabs (208, 209, 210) insert into holes (108, 109, 110) in the central channel (111--113) of the clip (100) and feet (101, 102, 103) of the clip rest on other tabs (201, 202, 203). The clip (100) is bonded to the metal layer (205) of the circuit board preferably by resistance welding, thereby reliably connecting the clip (100) and the conductive housing surfaces to signal ground.

Electromagnetic shielding apparatus for cellular telephones

The selective wave soldering apparatus (101) of the present invention permits wave soldering of select components on a printed circuit board. This is accomplished by narrowing the flow of solder from the wave solder apparatus and creating the proper back pressure on two sides of the flow to form the proper height wave. The back pressure is created by an extended, angled lip (102) on one side and a trough (103) on the side opposite the lip. The trough (103) is open on top and has small openings in one end to slow the flow of molten solder from the trough (103).

Selective wave solder apparatus

Electromagnetic shielding apparatus for portable telephones (300) and other electronic equipment, includes shield clips (100) for intercoupling the conductive surfaces of a housing (302 and 303) to the metal layer (205) of the circuit board (200). Each shield clip (100) mates with a corresponding edge (204) of the circuit board (200) such that tabs (208, 209, 210) insert into holes (108, 109, 110) in the central channel (111-113) of the clip (100) and feet (101, 102, 103) of the clip rest on other tabs (201, 202, 203). The clip (100) is bonded to the metal layer (205) of the circuit board preferably by resistance welding, thereby reliably connecting the clip (100) and the conductive housing surfaces to signal ground.

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Oakbrook Terrace, IL, United States of America

Gary A Humbert