Intel Corporation

Other

Gary A Brist

Gary Baxter Long

William O Alger

Bryce D Horine

Daryl A Sato

Howard L Heck

Stephen H Hall

Jayne L Mershon

Carlos Mejia

Tao Liang

Michael W Beckman

Kevin J Daniel

Peter A Davison

Patrick D Boyd

Stephen H Hall, Jr

Dennis J Miller

Melissa A Cowan

Tom Ruttan

Ted Zarbock

Stephen H Stephen

William Alger

Charles Mejia

Techniques for computing a magnetic heading based on sensor data are described herein. An example of a device in accordance with the present techniques includes a magnetic sensor to collect sensor output data and a heading computation engine to compute a magnetic heading based on the sensor output data. The heading computation engine includes logic to measure a level of noise in the sensor output data. The heading computation engine also includes logic to determine whether to average the sensor output data based, at least in part, on the level of noise. The heading computation engine also includes logic to determine an applied sensor output based on the sensor output data. The heading computation engine also includes logic to compute a magnetic heading based, at least in part, on the applied sensor output.

Computing a magnetic heading

A computing device, system, apparatus, and at least one machine readable medium for dynamically calibrating a magnetic sensor are described herein. The computing device includes a sensor hub and a magnetic sensor communicably coupled to the sensor hub. The magnetic sensor is configured to collect sensor data corresponding to the computing device. The computing device also includes a processor that is configured to execute stored instructions and a storage device that stores instructions. The storage device includes processor executable code that, when executed by the processor, is configured to determine a system state of the computing device and send the determined system state of the computing device to the sensor hub. The sensor hub is configured to dynamically calibrate the magnetic sensor based on the sensor data collected via the magnetic sensor and the determined system state of the computing device.

Dynamically calibrating magnetic sensors

The present disclosure provides techniques for creating a symmetrical ball grid array pattern for an integrated circuit package. The ball grid array includes a symmetrical pattern of circuit connection points, wherein the symmetrical pattern is derived from a base hexagonal pattern that is repeated in at least one or more sections of the ball grid array.

Symmetrical hexagonal-based ball grid array pattern

In one example a magnetometer unit comprises logic, to receive first magnetic response data from a first magnetic sensor and second magnetic response data from a second magnetic sensor displaced from the first magnetic sensor, generate a composite response surface representation from the first magnetic response data and the second magnetic response data, and store the composite response surface representation in a non-transitory memory. Other examples may be described.

Magnetometer unit for electronic devices

In some embodiments a high speed interconnect includes a layer of FR4 material, a trench in the layer of FR4 material, and a pair of transmission lines located near the trench. The trench is filled with a homogenous material. Other embodiments are described and claimed.

Method of forming a high speed interconnect

A method of making a printed circuit board panel, a printed circuit board panel made according to the method, and a system incorporating a printed circuit board provided onto the panel. The printed circuit board panel has a panel top edge, a panel bottom edge parallel to the panel top edge, and two parallel panel side edges, and further includes a first set of fiber bundles extending at the predetermined angle with respect to the panel side edges, and a second set of fiber bundles extending at the predetermined angle with respect to the panel top edge.

Method of making a fiber reinforced printed circuit board panel and a fiber reinforced panel made according to the method

An apparatus that includes a plurality of metalized planes, one or more dielectric layers separating the plurality of metalized planes; and one or more conductive trenches connecting to at least one of the plurality of metalized planes.

Power-ground plane partitioning and via connection to utilize channel/trenches for power delivery

An article of manufacture includes a circuit board and a pair of traces on or in the circuit board. The pair of traces includes a first trace and a second trace. The first trace includes a first segment and a second segment continuously joined to the first segment. The first segment coincides with a first longitudinal axis. The second trace includes a first segment that runs alongside the first segment of the first trace. The second trace also includes a second segment that runs alongside the second segment of the first trace. The second segment of the second trace is continuously joined to the first segment of the second trace. The second segment of the second trace coincides with the first longitudinal axis.

Shifted segment layout for differential signal traces to mitigate bundle weave effect

Method of power-ground plane partitioning to utilize channel/trenches

Modification of the connections between a die package and a system board is described. In one example a pattern redistribution module is used in a socket. The module has a first array of contacts on one side of the module. The contacts have a first configuration to connect to the socket. A second array of contacts is on another side of the module opposite the first array of contacts and has a second configuration to connect to a package containing a die. A board is between the first and the second array of contacts to interconnect contacts of the first array of contacts to contacts of the second array of contacts.

Modification of connections between a die package and a system board

Numerous embodiments of a carrier substrate having thermochromatic materials are described. In one embodiment of the present invention, a carrier substrate has a visible surface, and a thermochromatic material is disposed near the carrier substrate. The thermochromatic material produces a visual change of the visible surface when an activation temperature of the thermochromatic material is reached.

Carrier substrate with a thermochromatic coating

The invention provides an optical connection between a component on a printed circuit board ('PCB') and an optical fiber embedded in the PCB. By optically connecting the component with the optical fiber, the component may use the optical fiber for high speed optical data communication.

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Yamhill, OR, United States of America

Gary A Brist