Amkor Technology, Inc.

Garry Pycroft

Pil Je Sung

Frederick Evans Reed

John Merrill Nickelsen, Jr

Bob-Shih Wei Kuo

In accordance with the present invention, there is provided multiple embodiments of a concentrated photovoltaic (CPV) receiver cell or die. In each embodiment of the present invention, the receiver die includes a multiplicity of through wafer vias or TWV's which are etched therethrough to effectively eliminate the bus bars on the top or front surface of the receiver die, connectors such as bus bars instead being effectively moved to the bottom or back surface of the receiver die. The movement of the connectors to the back surface of the receiver die provides the potential for a greater active surface area on the front surface for solar input.

Through wafer via structures for concentrated photovoltaic cells

In one embodiment, a concentrated photovoltaic module or receiver package comprises a leadframe including a first section and a second section disposed in spaced relation to each other. Mounted to the first section of the leadframe is a receiver die. The receiver die is electrically connected to both the first and second sections of the leadframe. The receiver die is electrically connected to the second section of the leadframe by a plurality of conductive wires. The receiver die and portions of the leadframe are covered by a molded body which can be used to define an alignment feature for a light concentrating device such as a light guide or optical rod. Portions of the first and second sections of the leadframe protruding from the body are sized and configured to define integrated cable connectors for the receiver package.

Concentrated photovoltaic receiver package with built-in connector

In accordance with the present invention, there is provided a CPV package which comprises a leadframe assembly, such leadframe assembly including multiple frames stacked on top of each other. A top frame of the leadframe assembly provides the electrical interconnect between the top or front surface of the receiver die and the bypass diode required to complete the circuit. The top frame also provides hook up wire interconnect pads for the completed CPV package. An exposed bottom surface of a bottom frame of the leadframe assembly defines a heat spreader which assists in thermal management. The fabrication of the CPV package to include multiple frames stacked on top of each other provides high thermal dissipation and high voltage isolation, while at the same providing a high level of reliability with a comparatively low manufacturing cost.

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San Jose, CA, United States of America

Garry Pycroft