Intel Corporation

Amazon Technologies, Inc.

Garrick Chow

Yuhong Cai

Yi Li

Lalithkumar Rajendran

Hua Wang

Austin Bryant

Lianhua Fan

Jun Woo Park

Min-Thi Lai

Techniques for identifying thermal critical conditions in devices with multiple SoCs, and coordinating the resetting and rebooting of the SoCs to recover from the thermal critical conditions are described herein. A device may include a first SoC that monitors a first temperature sensor, and a second SoC that monitors a second temperature sensor, to determine whether temperatures in the device indicate thermal critical conditions. The second SoC may determine that a temperature determined using the second temperature sensor is above a threshold indicating a thermal critical condition, and may provide an indication to the first SoC that the temperature is above the threshold. The first SoC may detect the indication, and the first SoC and second SoC may each reset to allow the device to cool down. The first SoC and second SoC may then coordinate rebooting once the thermal critical condition is no longer detected in the device.

Identifying critical thermal conditions in multiple system-on-a-chip (SoC) systems

Electronic device package technology is disclosed. In one example, an electronic device includes a substrate having at least one electronic component mounted thereon and a heatsink thermally coupled to the electronic component. A plurality of fasteners attaches the heatsink to the substrate. At least one of the substrate, the heatsink, and the plurality of fasteners include a stress-relieving component to minimize fastener stress on the substrate. The stress-relieving component can comprise a fastener having a compliant device (e.g., a spring) for z-direction stress relief. The stress-relieving component can comprise the substrate and/or the heatsink having an oversized aperture for x-direction and/or y-direction stress relief. A method is disclosed for coupling a substrate to a heatsink. A method is disclosed for minimizing fastener stress locally to fasteners of an electronic device.

Local stress-relieving devices, systems, and methods for electronic assemblies

Growing community of inventors

Foster City, CA, United States of America

Garrick Chow