Orthodyne Electronics Corporation

Stats Chippac Pte. Ltd.

Kulicke and Soffa Industries, Inc.

Garrett Leigh Wong

Jonathan Michael Byars

Christoph Benno Luechinger

You Yang Ong

Mohd Helmy Bin Ahmad

Kwang Yong Chung

A method of aligning a subject tooling element of a material handling system of an ultrasonic bonding system is provided. The method includes the steps of: a) providing an overlay defining a relative position of at least a portion of a reference tooling element; b) viewing an image of at least a portion of the subject tooling element combined with a corresponding portion of the overlay; and c) adjusting a position of at least a portion of the subject tooling element by referring to the overlay in the image.

Methods and systems for aligning tooling elements of ultrasonic bonding systems

An integrated circuit package system including a ribbon bond interconnect is provided, having a semiconductor device with at least one pad thereon. An external connection is provided. A heavy ribbon is provided and bonded to the external connection and to the pad on the semiconductor device.

Integrated circuit package system including ribbon bond interconnect

Growing community of inventors

North Tustin, CA, United States of America

Garrett Leigh Wong