Microsoft Technology Licensing, LLC

Garrett Douglas Blankenburg

William Paul Hovis

Andres Felipe Hernandez Mojica

Peter Anthony Atkinson

Robert James Ray

Brian K Langendorf

Gregory Mayo Daly

Erng-Sing Wee

Andres Felipe Hernandez

Samy Boshra-Riad

Rich Tat An

Michael J Duggan

Michael G Love

Steven William Ranta

Andrew Charles Banks

Brian Keith Langendorf

Power control and decoupling capacitance arrangements for integrated circuit devices are discussed herein. In one example, an assembly includes a first circuit assembly comprising a first circuit board coupled to an integrated circuit device, wherein the first circuit board is coupled to first surface of a system circuit board. The assembly also includes a second circuit assembly comprising a second circuit board having one or more voltage adjustment units configured to supply at least one input voltage to the integrated circuit device, wherein the second circuit board is coupled to a second surface of the system circuit board and positioned at least partially under a footprint of the integrated circuit device with respect to the system circuit board.

Through-board power control arrangements for integrated circuit devices

Systems, methods, and software are disclosed herein for compressing audio data. In an implementation, sampled values of an audio signal have a dynamic range. A division of the dynamic range, into at least a lower range and an upper range, is identified based on a fixed mapping of a lower portion of the sampled values to a subset of quanta in a set of quanta having a depth less than a depth of the sampled values. Then an adaptive mapping of an upper portion of the sampled values to a remaining subset of quanta in the set of quanta is also identified, based at least on a dimension of the upper range. The fixed mapping is used to encode the lower portion of the sampled values based, while the adaptive mapping is used to encode the upper portion of the sampled values based on the adaptive mapping.

Adaptive and fixed mapping for compression and decompression of audio data

Power control arrangements for integrated circuit devices are discussed herein. In one example, an assembly includes an integrated circuit device comprising one or more processing cores and a power domain configured to distribute a supply voltage to the one or more processing cores. The assembly also includes a charge injection circuit coupled to the power domain of the integrated circuit device, and configured to selectively couple electric charge into the power domain to predictively offset at least portions of voltage transients in the power domain.

Predictive voltage transient reduction in integrated circuits

Power supply circuitry and enhanced associated techniques are presented herein. In one example, a method includes powering a circuit with a plurality of power supply phases, and monitoring thermal properties of the plurality of power supply phases. Responsive to the thermal properties indicating at least one of the plurality of power supply phases exceeds a thermal threshold, the method includes selecting a dormant power supply phase to supplant the at least one of the plurality of power supply phases.

Thermal rotation of power supply phases

An example method for adjusting operation of an integrated circuit includes testing a plurality of electronic elements of the integrated circuit including one or more redundant electronic elements designated as inactive according to a manufacturer's default configuration of the integrated circuit to determine one or more operating parameters of the integrated circuit. The method further includes selecting a subset of electronic elements from the plurality of electronic elements based on the one or more operating parameters, wherein the subset of electronic elements is designated as active according to an updated configuration of the integrated circuit, and controlling operation of the integrated circuit using the updated configuration instead of the manufacturer's default configuration.

Integrated circuit operation adjustment using redundant elements

Power reduction and voltage adjustment techniques for computing systems and processing devices are presented herein. In one example, a method includes executing a voltage characterization service for a processing device of a computing apparatus to determine at least one supply voltage for the processing device, the voltage characterization service comprising a functional test that exercises the processing device at iteratively adjusted voltages in context with associated system elements of the computing apparatus. During execution of the voltage characterization service, the method includes monitoring for operational failures of at least the processing device, and responsive to the operational failures, determining at least one resultant supply voltage.

Processor device supply voltage characterization

Computing assemblies, such as blade servers, can comprise a plurality of modular computing elements coupled onto an associated circuit board assembly. Assemblies and systems having enhanced individual computing module placement and arrangement are discussed herein, as well as example systems and operations to manufacture such assemblies. In one example, a method includes executing a performance test on a plurality of computing modules to determine at least variability in power consumption across the plurality of computing modules, and binning the plurality of computing modules according to graduated levels of the variability in power consumption. The method also includes selecting from among the graduated levels for placement in an assembly of ones of the computing modules in a progressively lower power consumption arrangement with relation to an airflow of the assembly.

Thermal arrangement of modules in server assemblies

This document relates to protocol translation for remote control of various devices. One example is a technique that includes identifying a controlled device that has a controlled device communication protocol for controlling the controlled device. The technique also includes obtaining translation data that conveys translations of commands from another protocol into the controlled device protocol. The technique also includes configuring a delay for transmitting the translated commands, and performing translation between the another protocol and the controlled device protocol using the translation data and the configured delay.

Protocol translation with delay

Examples are disclosed that relate cooling an electronic device based on power load. One disclosed example includes a controller configured to obtain a first measure of a power load, apply a filter to obtain a first filtered power load value, set a first thermal setpoint based at least on the first filtered power load value, determine a first temperature of the device, and adjust a response of the cooling mechanism based at least on the first thermal setpoint. The controller is further configured to obtain a second measure of the power load at a different time, apply the filter to obtain a second filtered power load value, set a second thermal setpoint based at least on the second filtered power load value, determine a second temperature of the device, and adjust the response of the cooling mechanism based at least on the second thermal setpoint.

Advanced power based thermal control systems

A hardware debug system includes a target chip comprising one or more target chip registers and one or more target chip ports, wherein at least one of the one or more target chip ports is used as a target chip debug port, and a debug host with one or more debug host ports, wherein at least one of the one or more debug host ports is connected to the target chip debug port via a hardware debug bus, wherein the debug host is configured to load at least one target chip setting into the one or more target chip registers that enables the target chip to boot via the hardware debug port using the hardware debug bus.

Hardware debug host

Voltage adjustment techniques for computing systems and processing devices are presented herein. In one example, a method of determining operating voltages for a processing device includes executing a voltage adjustment process to determine at least one input voltage for the processing device lower than a manufacturer specified operating voltage. During the voltage adjustment process, the method includes applying incrementally adjusted input voltages to the processing device, operating the processing device according to a functional test that exercises the processing device in context with associated system elements of a computing assembly, and monitoring for operational failures of at least the processing device during application of each of the incrementally adjusted input voltages. Responsive to the operational failures, the method includes determining corresponding values of the incrementally adjusted input voltages and establishing an input voltage based at least in part on the corresponding values of the incrementally adjusted input voltages.

Input voltage reduction for processing devices

Thermal reduction and voltage adjustment techniques for computing systems and processing devices are presented herein. In a first example, a method of operating a voltage control system for a processing device includes operating the processing device in a computing assembly at a selected performance level, the processing device supplied with at least one input voltage at a first voltage level. The method includes monitoring thermal information associated with the computing assembly, and when the thermal information indicates a temperature associated with the computing assembly exceeds a threshold temperature, adjusting the at least one input voltage level supplied to the processing device to a second voltage level lower than the first voltage level and continuing to operate the processing device at the selected performance level.

Voltage based thermal control of processing device

A method for controlling a cooling system for a device includes determining a power load of the processing system, determining a power load of the device, setting a first thermal setpoint based at least in part on the power load, determining a temperature of the device, adjusting a response of the cooling system based at least in part on the first thermal setpoint, detecting a change in the power load of the device to a higher power load having a higher magnitude acoustic response, in response to detecting the change in the power load, setting a second thermal setpoint having a lower magnitude acoustic response at the higher power load, the second thermal setpoint being based at least in part on a determined second corresponding acoustic response curve, and adjusting the response of the cooling system based at least in part on the second thermal setpoint.

Power based thermal management of device

Power reduction and voltage adjustment techniques for computing systems and processing devices are presented herein. In one example, a method includes receiving a voltage characterization service over a communication interface of the computing apparatus as transferred by a deployment platform remote from the computing apparatus. The method includes executing the voltage characterization service for a processing device of the computing apparatus to determine at least one input voltage for the processing device lower than a manufacturer specified operating voltage, the voltage characterization service comprising a functional test that exercises the processing device at iteratively adjusted voltages in context with associated system elements of the computing apparatus. During execution of the voltage characterization service, the method includes monitoring for operational failures of at least the processing device, and responsive to the operational failures, restarting the processing device using a recovery voltage higher than a current value of the iteratively adjusted voltages.

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Sammamish, WA, United States of America

Garrett Douglas Blankenburg