Corning Incorporated

Corning Optical Communications LLC

Garrett Andrew Piech

Jacques Gollier

Sergio Tsuda

Robert Stephen Wagner

Sasha Marjanovic

Michael Brian Webb

Dana Craig Bookbinder

Albert Roth Nieber

Daniel Ohen Ricketts

David Andrew Pastel

Kristopher Allen Wieland

Elvis Alberto Zambrano

Aric Bruce Shorey

Pushkar Tandon

Stephan Lvovich Logunov

Yuhui Jin

James Andrew West

James Scott Sutherland

Natesan Venkataraman

Qi Wu

Robert Adam Modavis

Xinghua Li

John T Keech

Kamjula Pattabhirami Reddy

Helmut Schillinger

Tian Huang

Sean Matthew Garner

Paul John Shustack

John Christopher Thomas

Dragan Pikula

Jeffrey John Domey

John Joseph Costello, Iii

Shandon Dee Hart

Xiaoju Guo

Christopher Lee Timmons

Heather Debra Boek

Raymond Miller Karam

Eric John Mozdy

Robert George Manley

Mark Francis Krol

Douglas Edward Brackley

Gregory Scott Glaesemann

Philip Robert LeBlanc

Bradley Frederick Bowden

Anthony Glenn Frutos

Alranzo Boh Ruffin

Rajesh Vaddi

Chong Pyung An

Jinlin Peng

Ekaterina Aleksandrovna Kuksenkova

Scott Winfield Deming

Mark Christian Sanson

Shyamala Shanmugam

Daniel Wayne Levesque, Jr

Gordon M Shedd

En Hong

Moussa N'Gom

Thomas Hackert

Zsigmond Varga

Carlos Alberto Pons Siepermann

James Joseph Watkins

Ravindra Kumar Akarapu

Chad Michael Wilcox

Sterling Michael Clarke

Brett C Shelton

Rachel Eileen Dahlberg

Mohamed A Zainul

Lawrence Charles Hughes

Jose Mario Quintal

Bertrand Paris

Jann Paul Kaminski

Douglass L Blanding

Ralf Joachim Terbrueggen

Daniel Arthur Sternquist

Lovell Eglin Comstock, Ii

Ming Ying

Thien An Thi Nguyen

Etienne Almoric

Michael Joseph Dailey, Jr

Alexander Lee Cuno

ChuanChe Wang

Heather Nicole Vanselous

Jean-Marc Martin Gerard Jouanno

Andreas Simon Gaab

Jaques Gollier

Jeffrey Mathew Clark

Daniel Schnitzler

Andres Covarrubias Jaramillo

Brian Nilsen

Vytautas Sabonis

Steven Ross Sims

Nickolaos Savidis

Mark Ranney Westcott

Reinhard Moritz Malchus

Michael Peter Gaj

Andrea Nichole Yeary

Frank Andrew Kramer, Iv

Steven R Matejka

Boyang Lin

Michael J Dailey

A method of separating a transparent workpiece comprises depositing a sacrificial layer onto a textured surface of the transparent workpiece, the sacrificial layer comprising a refractive index that is less than or equal to a refractive index of the transparent workpiece and greater than or equal to a refractive index of air. A defect-forming laser beam is generated via an optical assembly and used to form a plurality of defects in the transparent workpiece through sacrificial layer. The defect forming laser beam either comprises a pulsed laser beam forming a laser beam focal line in the transparent workpiece or an optical power of greater than or equal a critical power level to induce Kerr effect self-focusing in the transparent workpiece. The transparent workpiece is separated along the contour.

Sacrificial layers to enable laser cutting of textured substrates

A method for inspecting a transparent workpiece comprises: directing light from an illumination source onto a plurality of defects formed in the transparent workpiece, wherein the plurality of defects extends in a defect direction, wherein the transparent workpiece comprises a first surface and a second surface; detecting a scattering image signal from light scattered by the plurality of defects using an imaging system, wherein an imaging axis of the imaging system extends at a non-zero imaging angle relative to the defect direction, wherein entireties of at least a subset of the plurality of defects are within a depth of field of the imaging system; and generating a three-dimensional image of at least one of the plurality of defects based on the scattering signal.

Apparatus and method for inspecting laser defect inside of transparent material

A method of laser processing a transparent workpiece includes directing a pulsed laser beam into the transparent workpiece. The pulsed laser beam includes pulse bursts having 2 sub-pulses per pulse burst or more, each pulse burst of the pulsed laser beam has a burst duration Tof 380 ns or greater; and the pulsed laser beam forms a pulsed laser beam focal line in the transparent workpiece, the pulsed laser beam focal line inducing absorption in the transparent workpiece, the induced absorption producing a defect in the transparent workpiece. The pulsed laser beam focal line includes a wavelength λ, a spot size w, and a Rayleigh range Zthat is greater than where Fis a dimensionless divergence factor comprising a value of 10 or greater.

Methods for laser processing transparent workpieces using modified pulse burst profiles

A liquid lens that includes: a lens body comprising a first window, a second window, and a cavity disposed between the first window and the second window; and a first liquid and a second liquid within the cavity of the lens body, the first liquid and the second liquid substantially immiscible with each other and having different refractive indices such that an interface between the first liquid and second liquid to form a lens. The sidewall of the cavity has an average surface roughness (R) of less than or equal to 200 nanometers (nm). The cavity is disposed within a plate. Further, each of the windows and the plate comprises a glass, glass-ceramic or ceramic composition. In addition, a linearity of a first bottom portion of the sidewall in proximity to the base of the plate can be from 0 μm±5 μm.

Methods and apparatus for forming and polishing glass, glass-ceramic and ceramic preforms to form shaped plates for liquid lenses

A method of separating a portion of an object comprising: presenting an object having a thickness; using a laser emission at a wavelength to perforate at least a portion of the thickness of the object sequentially over a length to form a series of perforations between a first portion of the object on one side of the series of perforations and a second portion of the object on the other side of the series of perforations; and applying a stress to the object at the series of perforations to separate the first portion of the object from the second portion of the object, wherein the thickness of the object, at the series of perforations, is transparent to the wavelength of the laser emission.

Method of separating a liquid lens from an array of liquid lenses

Silica-containing substrates including vias with a narrow waist, electronic devices incorporating a silica-containing substrate, and methods of forming vias with narrow waist in silica-containing substrates are disclosed. In one embodiment, an article includes a silica-containing substrate including greater than or equal to 85 mol % silica, a first surface, a second surface opposite the first surface, and a via extending through the silica-containing substrate from the first surface toward the second surface. The via includes a first diameter at the first surface wherein the first diameter is less than or equal to 100 μm, a second diameter at the second surface wherein the first diameter is less than or equal to 100 μm, and a via waist between the first surface and the second surface. The via waist has a waist diameter that is less than the first diameter and the second diameter such that a ratio between the waist diameter and each of the first diameter and the second diameter is less than or equal to 75%.

Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same

The present invention relates to a laser cutting technology for cutting and separating thin substrates of transparent materials, for example to cutting of display glass compositions mainly used for production of Thin Film Transistors (TFT) devices. The described laser process can be used to make straight cuts, for example at a speed of &#x3e;0.25 m/sec, to cut sharp radii outer corners (&#x3c;1 mm), and to create arbitrary curved shapes including forming interior holes and slots. A method of laser processing an alkaline earth boro-aluminosilicate glass composite workpiece includes focusing a pulsed laser beam into a focal line. The pulsed laser produces pulse bursts with 5-20 pulses per pulse burst and pulse burst energy of 300-600 micro Joules per burst. The focal line is directed into the glass composite workpiece, generating induced absorption within the material. The workpiece and the laser beam are translated relative to each other to form a plurality of defect lines along a contour, with adjacent defect lines have a spacing of 5-15 microns.

Laser cutting and processing of display glass compositions

A system for and a method of processing a transparent material, such as glass, using an adjustable laser beam line focus are disclosed. The system for processing a transparent material includes a laser source operable to emit a pulsed laser beam, and an optical assembly (') disposed within an optical path of the pulsed laser beam. The optical assembly (&#x2032;) is configured to transform the pulsed laser beam into a laser beam focal line having an adjustable length and an adjustable diameter. At least a portion of the laser beam focal line is operable to be positioned within a bulk of the transparent material such that the laser beam focal line produces a material modification along the laser beam focal line. Method of laser processing a transparent material by adjusting at least one of the length of the laser beam focal line and the diameter of the laser beam focal line is also disclosed.

Systems and methods for processing transparent materials using adjustable laser beam focal lines

Disclosed herein are glass articles coated on at least one surface with an electrochromic layer and comprising minimal regions of laser damage, and methods for laser processing such glass articles. Insulated glass units comprising such coated glass articles are also disclosed herein.

Electrochromic coated glass articles and methods for laser processing the same

Methods of reshaping ferrules used in optical fiber cables assemblies are disclosed. The reshaping methods reduce a core-to-ferrule concentricity error (E), which improves coupling efficiency and optical transmission. The methods include measuring a true center of the ferrule, wherein the true center is based on an outer surface of the ferrule; and reshaping at least a portion of the ferrule to change the true center of the ferrule, wherein the reshaping includes enlarging a portion of the ferrule. A variety of reshaping techniques are also disclosed.

Methods of ferrule reshaping for correcting core-to-ferrule concentricity errors, and optical fiber cable assemblies related to such methods

A tiled display having pixels arranged in rows and columns, and including first and second tiles. The tiles comprise a substrate carrying a matrix of pixels arranged at a pixel pitch. The substrates comprise an edge extending between opposing faces in a depth direction. The substrate edges have a complementary shape, and face one another to establish a seam. The pixel pitch is maintained across the seam. Pixels of the second tile are not interposed between pixels of the first tile. The complementary shape includes a segment of the seam being oblique to the pixel rows, or the substrate edge of the first tile profiled in the depth direction whereby at least a section of the edge is non-perpendicular to the faces. The tiled display can maintain the pixel pitch at the seams at high resolutions (e.g., pixel pitch less than 0.5 mm).

Tiled displays and methods of manufacturing the same

Methods for forming holes in a substrate by reducing back reflections of a quasi-non-diffracting beam into the substrate are described herein. In some embodiments, a method of processing a substrate having a first surface and a second surface includes applying an exit material to the second surface of the substrate, wherein a difference between a refractive index of the exit material and a refractive index of the substrate is 0.4 or less, and focusing a pulsed laser beam into a quasi-non-diffracting beam directed into the substrate such that the quasi-non-diffracting beam enters the substrate through the first surface. The substrate is transparent to at least one wavelength of the pulsed laser beam. The quasi-non-diffracting beam generates an induced absorption within the substrate that produces a damage track within the substrate.

Methods for forming holes in substrates

Systems and processes of cutting and drilling in a target substrate uses a laser (e.g., a pulsed laser) and an optical system to generate a line focus of the laser beam within the target substrate, such as a glass substrate sheet, are provided. The laser cutting and drilling system and process creates holes or defects that, in certain embodiments, extend the full depth of the glass sheet with each individual laser pulse, and allows the laser system to cut and separate the target substrate into any desired contour by creating a series of perforations that form a contour or desired part shape. Since a glass substrate sheet is brittle, cracking will then follow the perforated contour, allowing the glass substrate sheet to separate into any required shape defined by the perforations.

Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same

Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.

Method for rapid laser drilling of holes in glass and products made therefrom

A method for laser processing a transparent workpiece includes forming a contour line that includes defects, by directing a pulsed laser beam output by a beam source through an aspheric optical element positioned offset in a radial direction from the beam pathway and into the transparent workpiece such that the portion of the pulsed laser beam directed into the transparent workpiece generates an induced absorption within the transparent workpiece that produces a defect within the transparent workpiece. The portion of the pulsed laser beam directed into the transparent workpiece includes a wavelength &#x3bb;, an effective spot size w, and a non-axisymmetric beam cross section having a minimum Rayleigh range Zin an x-direction and a minimum Rayleigh range Zin a y-direction. Further, the smaller of Zand Zis greater than where Fis a dimensionless divergence factor comprising a value of 10 or greater.

Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots

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Corning, NY, United States of America

Garrett Andrew Piech