International Business Machines Corporation

Globalfoundries Inc.

Au Optronics Corporation

Gareth Geoffrey Hougham

Paul William Coteus

Evan G Colgan

Brian Samuel Beaman

Stefano Sergio Oggioni

Enrique Vargas

Paul Alfred Lauro

Xiao Hu Liu

Brian Richard Sundlof

Sung Kwon Kang

Gerard McVicker

Shawn Anthony Hall

S Jay Chey

Sherif Ahmed Goma

James Patrick Doyle

Alphonso Philip Lanzetta

Joanna Rosner

Joseph Zinter, Jr

Jeffrey Donald Gelorme

Stephen L Buchwalter

Claudius Feger

Nancy C LaBianca

Michael Joseph Rooks

James Henry Glownia

Keith E Fogel

Kevin Charles Gower

Frank Robert Libsch

Jon Alfred Casey

Xiaoxiong Gu

Dale J Pearson

Peter M Fryer

Christopher Vincent Jahnes

Robert J Von Gutfeld

Lawrence Shungwei Mok

Steven Alan Cordes

Kamalesh K Srivastava

Daniel Peter Morris

Donald W Henderson

Matthew J Farinelli

Alfred Viehbeck

John J Ritsko

Leena Paivikki Buchwalter

Ronald Wayne Nunes

John Ulrich Knickerbocker

Charles Leon Arvin

William Louis Brodsky

Russell Alan Budd

Sri Muthuthamby Sri-Jayantha

Alan Edward Rosenbluth

Hosadurga K Shobha

Da-Yuan Shih

Fuad Elias Doany

Minhua Lu

Thomas Mario Cipolla

Eric D Perfecto

Vijayeshwar Das Khanna

Hien Phu Dang

Arun Sharma

Alessandro Cesare Callegari

Krystyna Waleria Semkow

Praveen Chaudhari

Kang-Wook Lee

Shui-Chih Alan Lien

James Andrew Lacey

Roy Arthur Carruthers

Peter Jeffrey Brofman

Mary Beth Rothwell

Kei-Hsiung Yang

Julien Sylvestre

Hsichang Liu

Renee L Weisman

Eileen Ann Galligan

Matteo Flotta

Mary Elizabeth Rothwell

Daniel C Edelstein

Paul Stephen Andry

Peter Alfred Gruber

John Peter Karidis

Edmund Juris Sprogis

John G Torok

Jane M Shaw

George Frederick Walker

Cornelia K Tsang

Raymond R Horton

Michael Wayne Lane

Theron Lee Lewis

John Harold Magerlein

Chirag Suryakant Patel

Eric Gerhard Liniger

Anthony Cyril Lowe

George L Chiu

Hubert Harrer

Stanley Joseph Whitehair

David B Goland

Peter Slota, Jr

Michelle Leigh Steen

Srinivasa S N Reddy

Dudley A Chance

Steven E Molis

Punit P Chiniwalla

A contact structure and assembly for a microelectronics device includes first and second electrically conductive contacts being helically shaped. A carrier element is attached to and positioned between the first and second contacts. The first and second contacts are in electrical communication with each other, and the first and second contacts are in a mirror image relationship with each other. A pair of insulating substrates each include electrically conductive members. A contact point on each of the first and second contacts is attached and electrically communicating to respective electrically conductive members such that the first and second electrically conductive contacts between the pair of insulating substrates form an electrically conductive package. A metal layer on the carrier element provides electrical conductivity through a first opening defined by the carrier element between the first and second portions of the helix shaped contact.

Axiocentric scrubbing land grid array contacts and methods for fabrication

A negative electrophoretic photoresist is applied over a plurality of protruding disposable template portions on a substrate. A silo structure is placed on planar portions of the negative electrophoretic photoresist that laterally surround the plurality of protruding disposable template portions. The negative electrophoretic photoresist is lithographically exposed employing the silo structure and a first lithographic mask, which includes a transparent substrate with isolated opaque patterns thereupon. After removal of the silo structure, the negative electrophoretic photoresist is lithographically exposed employing a second lithographic mask, which includes a pattern of transparent areas overlying the planar portions of the negative electrophoretic photoresist less the areas for bases of metal structure to be subsequently formed by electroplating. The negative electrophoretic photoresist is developed to form cavities therein, and metal structures are formed by electroplating within the cavities. The negative electrophoretic photoresist and the plurality of protruding disposable template portions can be subsequently removed.

Two mask process for electroplating metal employing a negative electrophoretic photoresist

The present invention relates generally to thermally-conductive pastes for use with integrated circuits, and particularly, but not by way of limitation, to self-orienting microplates of graphite.

Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive

A contact structure and assembly and a method for manufacturing the same for a microelectronics device includes first and second electrically conductive contacts being helically shaped. A carrier element is attached to and positioned between the first and second contacts. The first and second contacts are in electrical communication with each other, and the first and second contacts are in a mirror image relationship with each other. A pair of insulating substrates each include electrically conductive members. A contact point on each of the first and second contacts is attached and electrically communicating to respective electrically conductive members such that the first and second electrically conductive contacts between the pair of insulating substrates form an electrically conductive package. A metal layer on the carrier element provides electrical conductivity through a first opening defined by the carrier element between the first and second portions of the helix shaped contact.

A structure and method for manufacturing the same for manufacturing a contact structure for microelectronics manufacturing including the steps of forming first and second metal sheets to form a plurality of outwardly extending bump each defining a cavity. Symmetrically mating the first and second metal sheets in opposing relation to each other to form upper and lower bumps each defining an enclosure therebetween wherein the mated first and second sheets form a contact structure. Coating the contact structure with an insulating material, and fabricating helix shaped contacts from upper and lower bumps. The helix shaped contacts having first and second portions being in mirror image relationship to each other.

Metallurgical clamshell methods for micro land grid array fabrication

In one embodiment of the present invention, inert nano-sized particles having dimensions from 1 nm to 1,000 nm are added into a solder ball. The inert nano-sized particles may comprise metal oxides, metal nitrides, metal carbides, metal borides, etc. The inert nano-sized particles may be a single compound, or may be a metallic material having a coating of a different material. In another embodiment of the present invention, a small quantity of at least one elemental metal that forms stable high melting intermetallic compound with tin is added to a solder ball. The added at least one elemental metal forms precipitates of intermetallic compounds with tin, which are dispersed as fine particles in the solder.

Additives for grain fragmentation in Pb-free Sn-based solder

Bilayer platelet fillers are employed to compensate for a positive coefficient of thermal expansion (CTE) of an embedding polymeric material, or even to provide a composite structure having a negative CTE to eliminate or alleviate thermomechanical stress and/or delamination during thermal cycling. A bilayer platelet includes two joined layers having different CTEs. The CTE mismatch induces bending of the bilayer platelets, thereby causing cavities at temperatures lower than the joining temperature at which the bilayers are joined. The decrease in the volume of the polymeric material and the bilayer platelets at low temperatures is compensated by an accompanying increase in the volume of the cavities so that the composite structure has a temperature independent volume, a low net CTE, or even a negative CTE.

Thermal expansion control employing platelet fillers

Techniques for forming enhanced electrical connections are provided. In one aspect, a method of forming an electrical connecting device includes the steps of: depositing an elastomeric material on an electrically insulating carrier; and metallizing the elastomeric material so as to form an electrically conductive layer running continuously through a plane of the carrier and along a surface of the elastomeric material.

Method of forming metallized elastomeric electrical contacts

A method of producing a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane.

Method of producing a land grid array (LGA) interposer utilizing metal-on-elastomer

A structure and method for manufacturing the same for manufacturing a contact structure for microelectronics manufacturing including the steps of forming first and second metal sheets to form a plurality of outwardly extending bump each defining a cavity. Symmetrically mating the first and second metal sheets in opposing relation to each other to form upper and lower bumps each defining an enclosure therebetween wherein the mated first and second sheets form a contact structure. Coating the contact structure with an insulating material, and fabricating helix shaped contacts from upper and lower bumps. The helix shaped contacts having first and second portions being in minor image relationship to each other.

Methods for the fabrication of negative coefficient thermal expansion engineered elements, and particularly, wherein such elements provide for fillers possessing a low or even potentially zero coefficient thermal expansion and which are employable as fillers for polymers possessing high coefficients of thermal expansion. Further, disclosed are novel structures, which are obtained by the inventive methods.

Negative coefficient thermal expansion engineered particles for composite fabrication

A method of producing a module arrangement which includes a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane.

Land grid array interposer producing method

Growing community of inventors

Ossining, NY, United States of America

Gareth Geoffrey Hougham