National Research Council of Canada

Other

Gaozhi Xiao

Zhiyi Zhang

Ye Tao

Zhenguo Lu

Chander P Grover

Fengguo Sun

Jiaren Liu

Jianping Lu

Ta-Ya Chu

Ping Zhao

Hiroshi Fukutani

A method is disclosed for aligning layers in fabricating a multilayer printable electronic device. The method entails providing a transparent substrate upon which a first metal layer is deposited, providing a transparent functional layer over the first metal layer, depositing metal nano particles over the functional layer to form a second metal layer, exposing the metal nano particles to intense pulsed light via an underside of the substrate to partially sinter exposed particles to the functional layer whereby the first metal layer acts as a photo mask, and washing away unexposed particles using a solvent to leave partially sintered metal nano particles on the substrate.

Self-aligning metal patterning based on photonic sintering of metal nanoparticles

The present disclosure relates to conductors comprising a conducting member comprising silver and a functionalized organosiloxane network having at least one functional group capable of trapping silver or a silver ion as well as to methods of preparing the same. For example, the functionalized organosiloxane network can at least substantially inhibit dendrite formation between a first conducting member and a second conducting member. For example, the conductors may be used in an electronic circuit such as a printed electronic circuit.

Conductors comprising a functionalized organosiloxane network and methods for the preparation thereof

A process for depositing a metal on a substrate involves the use of two reduction reactions in a bottom-up based tandem manner starting from a substrate surface and working upward. A first reduction reaction starts on the substrate surface at ambient temperature, and a second reduction reaction, which is initiated by the reaction heat of the first reduction reaction, occurs in a reactive ink solution film coated on top, which becomes solid after the reaction. Gas and other small molecules generated from the reduction reactions, and the solvent, can readily escape through the upper surface of the film before the solid metal layer is formed or during post-treatment, with no or few voids left in the metal film. Thus, the process can be used to form highly conductive films and features at ambient temperature on various substrates.

Process for depositing metal on a substrate

A compact interrogator for the simultaneous interrogation of multi wavelength-modulated fiber optical sensors, includes a planar waveguide based demultiplexer receiving input signals from the sensors. An array of detectors is coupled to output waveguides of the demultiplexer corresponding to different nominal wavelengths. A tuning element matches the nominal wavelengths of the output waveguide to the input signals from the respective sensors to find the wavelengths of the individual sensors to be interrogated.

Simultaneous interrogation of multi wavelength-modulated fiber optical sensors by modulating an arrayed waveguide grating based demultiplexer

Polarization-mode dispersion (PMD) of an optical device, i.e. fiber or component is effected by launching a first pump laser beam of a fixed wavelength, a probe laser beam with a second fixed wavelength and a second pump laser beam having a variable wavelength and a polarization direction orthogonal to the other two beams into an optical device to generate three output signals which are input into a semiconductor optical amplifier to generate four-wave mixing (FWM) products. The average PMD of the device is computed by measuring the power of the FWM products versus the wavelength of the second pump laser beam.

Method and apparatus for measuring polarization-mode dispersion

An integrated optical dynamic channel equalizer that can be employed to equalize the channel gain level in a WDM transmission line and monitor the optical channel performance. The device consists of a circulator, a dynamic gain equalizer chip and a controller. Due to the simplicity of the dynamic gain equalizer chip, which includes one 1&#xd7;n multiplexer/demultiplexer, an n-channel variable optical attenuator array (VOA-n), a partially transparent dielectric reflective means and an n-channel detector array, the device is very compact and can be fabricated at low cost. By placing a quarter wave plate between the n-channel variable optical attenuator array and the partially transparent reflective means in the dynamic channel equalizer chip, the device can be rendered polarization insensitive.

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Ottawa, Canada

Gaozhi Xiao