Motorola Corporation

Ganesh Rajagopalan

Charles J Varker

Michael L Dreyer

A method and an electrically conductive interconnect structure (30) for controlling electromigration. The electrically conductive interconnect structure (30) comprises a groove (33) adjacent an electrically conductive interconnect (39). The electrically conductive interconnect (39) is patterned from a deposited layer of conductive material which contains global grain microstructures. Moreover, the electrically conductive interconnect (39) is patterned to have polycrystalline and single-grain segment lengths that are less than a length at which an electromigration flux fails to overcome a gradient-driven counter flux in a line segment. The groove (33) controls the polycrystalline and single-grain segment lengths to be less than the critical length, thereby reducing electromigration.

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Tempe, AZ, United States of America

Ganesh Rajagopalan